Patents by Inventor Angela L. Petroski

Angela L. Petroski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210222740
    Abstract: A clutch pack arrangement including a plurality of discs having inner splines with each disc having a friction lining attached to a single side of the discs having inner splines; a plurality of discs having outer splines with each disc having a friction lining attached to a single side of the discs having outer splines, said discs having outer splines being space intermittent to said discs having inner splines, and all friction lings are located on the same relative side of the discs having inner and outer splines; and; a plurality of bare steel discs including at least one bare steel disc having an inner spline and at least one bare steel disc having an outer spline, said bare steel discs being located intermittently between said, disc have friction linings attached to one side thereof.
    Type: Application
    Filed: January 21, 2021
    Publication date: July 22, 2021
    Inventors: Przemyslaw A. Zagrodzki, Angela L. Petroski
  • Patent number: 7708863
    Abstract: A process and apparatus for making die-dried friction wafers collects friction particulates in a mold defining a wafer. The mold includes at least one perforate wall portion against which an aqueous slurry including the particulates is passed to form at least one layer on the wall as the particulates collect in the mold. The collection is dried followed by curing, and may be cured in the mold by heating.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: May 4, 2010
    Assignee: Raytech Composites, Inc.
    Inventors: Angela L. Petroski, Samuel A. Truncone, James Macey, Hualin Jiang
  • Publication number: 20090025898
    Abstract: A process and apparatus for making die-dried friction wafers collects friction particulates in a mold defining a wafer. The mold includes at least one perforate wall portion against which an aqueous slurry including the particulates is passed to form at least one layer on the wall as the particulates collect in the mold. The collection is dried followed by curing, and may be cured in the mold by heating.
    Type: Application
    Filed: August 24, 2006
    Publication date: January 29, 2009
    Applicant: Raytech Composites, Inc.
    Inventors: Angela L. Petroski, Samuel A. Truncone, James Macey, Hualin Jiang
  • Patent number: D803116
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: November 21, 2017
    Inventors: Jeremiah Joseph Shepard, Przemyslaw A. Zagrodzki, Angela L. Petroski, Marc Andrew Yesnik