Abstract: A method of manufacturing an assembly to couple an optical fiber to an opto-electronic component includes providing the optical fiber having an end section with a front face to couple light in and out of the optical fiber, providing a housing to encase the end section of the optical fiber. The housing is formed with an opening to receive the optical fiber. The method further includes inserting the optical fiber in the opening such that the end section of the optical fiber is disposed inside the housing, attaching the optical fiber to a surface of the housing arranged to form a boundary of the opening, and aligning the front face of the optical fiber to the opto-electronic component.

Abstract: A compact optical splitter module is disclosed. One type of compact optical splitter module is a planar attenuated splitter module that includes a branching waveguide network having j?1 50:50 splitters that form up to n?2j output waveguides having associated n output ports, wherein only m<n output ports are suitable for transmitting light to the at least one external output device. This provides a 1×m splitter module wherein each output port has the attenuation of a 1×n splitter module, thereby obviating the need for external attenuation. Another type of compact optical splitter module is a direct-connect splitter module that eliminates the need for an optical fiber array when coupling to external optical fibers. Another type of compact optical splitter module is a microsplitter module that serves as device and module at the same time and that eliminates the differentiation between device and module. The integration of device and module also makes manufacturing the microsplitter module cost-effect.

Abstract: An optical fiber having an end section with a front face to couple light in and out of the optical fiber is inserted in an opening of a housing to encase the end section of the optical fiber. The optical fiber is attached to a surface of the housing, wherein the surface forms a boundary of the opening. The front face of the optical fiber is aligned to the opto-electronic device such that light coupled out of the front face of the optical fiber is coupled into the opto-electronic device or light coupled out of the opto-electronic device is coupled into the optical fiber at the front face of the optical fiber.

Abstract: A compact optical splitter module is disclosed. One type of compact optical splitter module is a planar attenuated splitter module that includes a branching waveguide network having j?1 50:50 splitters that form up to n?2j output waveguides having associated n output ports, wherein only m<n output ports are suitable for transmitting light to the at least one external output device. This provides a 1×m splitter module wherein each output port has the attenuation of a 1×n splitter module, thereby obviating the need for external attenuation. Another type of compact optical splitter module is a direct-connect splitter module that eliminates the need for an optical fiber array when coupling to external optical fibers. Another type of compact optical splitter module is a microsplitter module that serves as device and module at the same time and that eliminates the differentiation between device and module. The integration of device and module also makes manufacturing the microsplitter module cost-effect.

Abstract: An optical splitter has an optical chip, in which a conductor track is arranged on a carrier substrate, wherein a conductor track section of the conductor track running from a first side of the chip branches into different conductor track sections which run to a second side of the chip via a plurality of branching nodes. An optical waveguide section of an optical waveguide is bonded at the first side of the chip by means of an adhesive material. Correspondingly, optical waveguide sections are bonded on the second side of the chip by means of an adhesive material. In order to reinforce the fixing, glass plates are arranged over and under the optical waveguides, said glass plates being bonded to the optical chip at the respective lateral surfaces.

Abstract: An optical splitter has an optical chip, in which a conductor track is arranged on a carrier substrate, wherein a conductor track section of the conductor track running from a first side of the chip branches into different conductor track sections which run to a second side of the chip via a plurality of branching nodes. An optical waveguide section of an optical waveguide is bonded at the first side of the chip by means of an adhesive material. Correspondingly, optical waveguide sections are bonded on the second side of the chip by means of an adhesive material. In order to reinforce the fixing, glass plates are arranged over and under the optical waveguides, said glass plates being bonded to the optical chip at the respective lateral surfaces.

Abstract: A compact optical splitter module is disclosed. One type of compact optical splitter module is a planar attenuated splitter module that includes a branching waveguide network having j?1 50:50 splitters that form up to n?2j output waveguides having associated n output ports, wherein only m<n output ports are suitable for transmitting light to the at least one external output device. This provides a 1×m splitter module wherein each output port has the attenuation of a 1×n splitter module, thereby obviating the need for external attenuation. Another type of compact optical splitter module is a direct-connect splitter module that eliminates the need for an optical fiber array when coupling to external optical fibers. Another type of compact optical splitter module is a microsplitter module that serves as device and module at the same time and that eliminates the differentiation between device and module. The integration of device and module also makes manufacturing the microsplitter module cost-effect.

Abstract: The invention relates to an optical chip and to a method for producing an optical chip having a reinforced structure. The chip has a substrate, optical waveguides arranged on the surface of said substrate, and at least one optical structure for influencing the optical properties of the optical waveguides, and an interconnected laminar reinforcing or stiffening structure constructed in the form of a cross which is arranged centrally on the substrate with the provision of diametrically opposite cut-outs.

Abstract: The invention is directed to an immersion agent that can be used to couple optical waveguides to optical components. The invention is also directed to the use of an immersion agent, a coupling arrangement and a method for coupling optical waveguides to other optical components; for example, an optical chip.

Abstract: Optical fiber coupling unit and optical waveguide arrangement, and method of producing an optical fiber coupling unit. The optical fiber coupling unit 1 has: an optical fiber 2, which has a fiber core 4 and a fiber cladding 6 surrounding the fiber core 4, and a sleeve 8, which is arranged on an end portion of the optical fiber 2 and terminates flush with the associated extreme end 14 of the optical fiber 2, so that on this extreme end 14 there is formed a continuous coupling face 16, with which the optical fiber coupling unit 1 can be placed against an optical waveguide component to establish an optical coupling.

Abstract: The invention relates to an optical conductor component in the form of an optical chip to which it is possible to connect optical conductors (LWL), such as, for example, individual fibres or fibre arrays and/or other optical conductor components such as photodetectors or photodetector arrays. The invention further relates to a method for producing such an optical chip.

Abstract: A transparent elastomer (e.g. silicon rubber) is used as an immersion agent (10) for durable and low-attenuation connection of an optical waveguide (2) to the conductive structures of an optical component (6). The matrix of said elastomer contains a non-cross-linked proportion of a liquid phase (e.g. silicon softeners). The same kind of immersion agent (10) is used in the coupling system. The distance between the end face of the optical waveguide (2) and the coupling surface of the component (6) ranges from approximately 2 &mgr;m to 20 &mgr;m. The volume of the immersion agent (10) present at the point of coupling (8) is less than 5 &mgr;l.

Abstract: Optical fiber coupling unit and optical waveguide arrangement, and method of producing an optical fiber coupling unit. The optical fiber coupling unit 1 has: an optical fiber 2, which has a fiber core 4 and a fiber cladding 6 surrounding the fiber core 4, and a sleeve 8, which is arranged on an end portion of the optical fiber 2 and terminates flush with the associated extreme end 14 of the optical fiber 2, so that on this extreme end 14 there is formed a continuous coupling face 16, with which the optical fiber coupling unit 1 can be placed against an optical waveguide component to establish an optical coupling. (FIG.