Patents by Inventor Angela Rogona

Angela Rogona has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Backside metallization scheme for semiconductor devices
    Patent number: 4946376
    Abstract: A backside metalization scheme for semiconductor devices includes a vanadium layer disposed on the backside of a wafer and a silver layer disposed on the vanadium layer. An optional intermediate layer comprising either a mixture of vanadium and silver or nickel may be disposed between the vanadium layer and the silver layer. The vanadium layer exhibits excellent adhesion characteristics on the backside of wafers having a finish at least as fine as a 300 grit equivalency while the silver layer exhibits excellent solderability characteristics.
    Type: Grant
    Filed: April 6, 1989
    Date of Patent: August 7, 1990
    Assignee: Motorola, Inc.
    Inventors: Ravinder K. Sharma, William H. Lytle, Angela Rogona, Bennett L. Hileman