Abstract: Polyamides based on reaction products of C4-C18 dicarboxylic acids and diamines are suitable as molding compositions for the production of moldings in the low pressure injection molding process, and for adhesive sealing or filling in the production of electrical or electronic devices, in particular of plugs, cables, switches, sensors, transponders, modules, printed circuit boards or smart cards. In comparison with conventional molding compositions based in known hot melt adhesives, said polyamides exhibit higher strength values, higher abrasion resistance and higher chemical resistance.

Abstract: Hot melt adhesives are prepared using thermoplastic polyamides derived from polymerized fatty acid components. The adhesives are particularly useful for bonding nonpolar substrates such as poly-&agr;-olefins.

Abstract: Polyamides based on reaction products of C4-C18 dicarboxylic acids and diamines are suitable as molding compositions for the production of moldings in the low pressure injection molding process, and for adhesive sealing or filling in the production of electrical or electronic devices, in particular of plugs, cables, switches, sensors, transponders, modules, printed circuit boards or smart cards. In comparison with conventional molding compositions based in known hot melt adhesives, said polyamides exhibit higher strength values, higher abrasion resistance and higher chemical resistance.

Abstract: A process for making an injection-molded article having reduced warpage comprising: (a) providing a crystalline polymer selected from the group consisting of a high-density polyethylene, a polyolefin, a polyacrylate, a polyacrylamide, a polyvinyl acetate, a polyethylene imine, a polyoxymethylene, and mixtures thereof; (b) providing an organic pigment; (c) providing a polyamide; (d) mixing (a)-(c) to form a polymer mixture; and (e) injection molding the polymer mixture to form the injection-molded article having reduced warpage.

Abstract: A composition of matter useful as a hotmelt adhesive is provided. The adhesive comprises a polyamide based on dimerized fatty acid, preferably having an amine value of less than 2, and at least one heat stabilizer for polyvinyl chloride, preferably selected from the group consisting of alkyl tin carboxylate compounds and epoxy compounds. The heat stabilizer is preferably present in an amount of 0.2% to 10.0% by weight of the composition. Also provided is a method of using the composition as a hotmelt adhesive for polyvinyl chloride.

Abstract: A hotmelt adhesive based on a number of components is provided. One of the components is at least one polyamide based on dimerized fatty acid, said polyamide being present in an amount by weight of the composition of at least 50%. Another component is from at least one ethylene copolymer selected from the group consisting of ethylene/vinyl acetate, ethylene/acrylate, said acrylate being derived from an alcohol containing 1 to 18 carbon atoms, and ethylene/methacrylate, said methacrylate being derived from an alcohol containing 1 to 18 carbon atoms, said ethylene copolymer being present in an amount by weight of the composition of 5 to 20%. Another component is at least one copolymer of styrene with one or more members selected from the group consisting of ethylene, isoprene and butylene, said copolymer of styrene being present in an amount by weight of the composition of 2 to 10%.

Abstract: Methods of producing thermoplastic poly(amide-urethane) block copolymers having excellent flexibility at low temperatures are provided. The methods comprise reacting substantially linear polyamides, the polyamides being based on dimerized fatty acids and terminated by carboxyl and/or amino groups and aliphatic or cycloaliphatic polyethers and/or reaction products thereof with 2,3-epoxypropanol. The reaction products contain substantially no free isocyanate groups or epoxide groups. The invention also relates to the use of these products as adhesives and corrosion inhibitors for metallic and/or wooden materials.

Abstract: Methods of producing thermoplastic poly(amide-urethane) block copolymers having excellent flexibility at low temperatures are provided. The methods comprise reacting substantially linear polyamides, the polyamides being based on dimerized fatty acids and terminated by carboxyl and/or amino groups and aliphatic or cyloaliphatic polyethers and/or reaction products thereof with 2,3-epoxypropanol. The reaction products contain substantially no free isocyanate groups or epoxide groups. The invention also relates to the use of these products as adhesives and corrosion inhibitors for metallic and/or wooden materials.

Abstract: Thermoplastic polyamide resins with improved low-temperature flexibility and improved bonding properties consisting essentially of polycondensates of the following components:(a) 10 to 50 mol-% of a dimer fatty acid or mixture of such acids,(b) 5 to 45 mol-% of polyoxyalkylene urea diamine,(c) 0 to 25 mol-% of an aliphatic C.sub.6 -C.sub.22 dicarboxylic acid or mixture of such acids,(d) 0 to 45 mol-% of an aliphatic, aromatic or cyclic C.sub.2 -C.sub.40 diamine or a mixture of such diamines selected from the group comprising diprimary diamines, diamines containing secondary amino groups and alkyl substituents with no more than 8 carbon atoms at the nitrogen atom, and heterocyclic diamines capable of double amide formation.Preferred resins are base-terminated resins having amine values of up to 50 and acid-terminated resins having acid values of up to 20 and a molecular weight within the range from 5000 to 20,000 and preferably from 8000 to 15,000.

Abstract: Thermoplastic polyamide resins showing improved substrate adhesion and consisting essentially of polycondensates of the following components:(a) from 10 to 50 mole percent dimer fatty acids, having a trimer fatty acid content of from 10 to 20 mol percent;(b) from 25 to 45 mole percent of one or more aliphatic, aromatic and/or cyclic C.sub.2 -C.sub.40 diamines which are diprimary diamines, diamines containing secondary amino groups and alkyl substituents with no more than 8 carbon atoms on the N-atom, or heterocyclic diamines capable of diamide formation,(c) from 5 to 25 mole percent of aliphatic diamines capable of diamide formation and N-alkyl-substituted on at least one N-atom, containing from 2 to 10 C-atoms and from 10 to 25 carbon atoms in the N-alkyl group, and(d) from 0 to 40 mole percent aliphatic C.sub.6 -C.sub.22 dicarboxylic acids.

Abstract: The object of the invention are adhesion promoters for plastisols of polyvinylchloride polymers or copolymers, characterized in that they are constituted by polyaminoamidic resins obtained by means of the condensation of:1 equivalent of carboxylic acids, obtained by polymerization of unsaturated fatty acids, of composition comprised within the following ranges: 0-2% monomers, 10-50% dimers, 50-90% trimers, withfrom 1.0 to 2.2 equivalents of an heterocyclic amine of general formula ##STR1## wherein R can be H or an alkylamino group --R'--NH.sub.2, wherein R' is a saturated alifatic chain.