Abstract: The invention relates to a polymer suited for modifying the styling performance and the rheology of a cosmetic preparation, a composition thereof, a method of making it as well as the use of said polymer and the composition respectively. The copolymer comprises at least one non-ionic ethylenically unsaturated C1-C4 (meth)acrylate as monomer A; an ethylenically unsaturated monomer B having as hydrogen bond donor an amide group, said ethylenically unsaturated monomer B being an ethylenically unsaturated monomer having a cyclic amide moiety, as monomer B1 and/or, an ethylenically unsaturated monomer having an acyclic amide group, as monomer B2; at least one ethylenically unsaturated carboxylic acid as monomer C; a macromonomer D; optionally at least one cross-linker E; and optionally at least one further monomer F.

Abstract: The invention relates to a polymer suited for modifying the styling performance and the rheology of a cosmetic preparation, a composition thereof, a method of making it as well as the use of said polymer and the composition respectively. The copolymer comprises at least one non-ionic ethylenically unsaturated C1-C4 (meth)acrylate as monomer A; an ethylenically unsaturated monomer B having as hydrogen bond donor an amide group, said ethylenically unsaturated monomer B being an ethylenically unsaturated monomer having a cyclic amide moiety, as monomer B1 and/or, an ethylenically unsaturated monomer having an acyclic amide group, as monomer B2; at least one ethylenically unsaturated carboxylic acid as monomer C; a macromonomer D; optionally at least one cross-linker E; and optionally at least one further monomer F.

Abstract: The invention relates to a semiconductor component having a metal-insulator structure (MIS) which contains as basic components a substrate, a layer made of an organic semiconductor material and a dielectric layer as insulator. The substrate and/or the dielectric layer made of an inorganic-organic hybrid polymer is chosen from these basic components. In addition, the invention relates to a method for the production of semiconductor components of this type and also to the use of inorganic-organic hybrid polymers for the production of semiconductor components.

Abstract: The invention relates to a semiconductor component having a metal-insulator structure (MIS) which contains as basic components a substrate, a layer made of an organic semiconductor material and a dielectric layer as insulator. The substrate and/or the dielectric layer made of an inorganic-organic hybrid polymer is chosen from these basic components. In addition, the invention relates to a method for the production of semiconductor components of this type and also to the use of inorganic-organic hybrid polymers for the production of semiconductor components.

Abstract: Polymer powders redispersible in aqueous solution, their use in cosmetic, pharmaceutical or crop protection formulations and a process for preparing polymer powders redispersible in aqueous solution comprising copolymers carrying free acid or base groups and, if appropriate, auxiliaries, which comprises adjusting the pH of the dispersion prior to drying by the addition of at least one buffer system to a pH of from 2.0 to 6.5 in the case of copolymers carrying free acid groups or a pH of from pH 7.5 to 12 in the case of copolymers carrying free base groups.