Patents by Inventor Angelo Puzella

Angelo Puzella has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EXTENDABLE SPAR BUOY SEA-BASED COMMUNICATION SYSTEM
    Publication number: 20070123122
    Abstract: An extendable spar buoy sea-based communication system includes a spar buoy having a retracted configuration deployable from an underwater vessel and an extended configuration after deployment, and a communication subsystem mounted to the top of the spar buoy and supported thereby.
    Type: Application
    Filed: February 16, 2005
    Publication date: May 31, 2007
    Inventors: Angelo Puzella, Thomas Smith, Yueh-Chi Chang, Brian Lamont, Mario D'Amico, Leon Wardle
  • Multilayer stripline radio frequency circuits and interconnection methods
    Patent number: 6731189
    Abstract: A multi-layer stripline assembly interconnection includes a first stripline sub-assembly having a first surface and a first plurality of vias disposed in the first surface adapted to receive a plurality of solid metal balls. The interconnection further includes a second stripline sub-assembly having a second plurality of vias disposed in the first surface of the second sub-assembly adapted to be aligned with the first plurality of vias. Reflowed solder is wetted to the second plurality of vias and to the corresponding plurality of solid metal balls.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: May 4, 2004
    Assignee: Raytheon Company
    Inventors: Angelo Puzella, Joseph M. Crowder, Patricia S. Dupuis, Michael C. Fallica
  • Multilayer stripline radio frequency circuits and interconnection methods
    Publication number: 20040000979
    Abstract: A multi-layer stripline assembly interconnection includes a first stripline sub-assembly having a first surface and a first plurality of vias disposed in the first surface adapted to receive a plurality of solid metal balls. The interconnection further includes a second stripline sub-assembly having a second plurality of vias disposed in the first surface of the second sub-assembly adapted to be aligned with the first plurality of vias. Reflowed solder is wetted to the second plurality of vias and to the corresponding plurality of solid metal balls.
    Type: Application
    Filed: June 27, 2002
    Publication date: January 1, 2004
    Inventors: Angelo Puzella, Joseph M. Crowder, Patricia S. Dupuis, Michael C. Fallica
  • Embedded planar circulator
    Patent number: 6611180
    Abstract: A planar circulator assembly includes a dielectric substrate having a first surface and an opposing second surface, a plurality of circulator circuits, each circulator circuit having a first ferrite receiving pad disposed on the first surface and a second ferrite receiving pad; disposed on the second surface a first sub-assembly board disposed on the first surface having a plurality of first apertures, a plurality of ferrite-magnet sub-assemblies, each ferrite-magnet sub-assembly disposed in a corresponding first aperture and aligned with a corresponding first ferrite receiving pad and electromagnetically coupled to the corresponding first ferrite receiving pad.
    Type: Grant
    Filed: April 16, 2002
    Date of Patent: August 26, 2003
    Assignee: Raytheon Company
    Inventors: Angelo Puzella, Kenneth Komisarek, Joseph Crowder, Patricia Dupuis, Gary Kingston