Patents by Inventor Angelo Rossoni

Angelo Rossoni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090140762
    Abstract: A layout for devices under test formed on a semiconductor wafer for use in wafer testing includes a first array of devices under test and a first pad set formed adjacent to the first array. The first pad set includes a gate force pad, a source pad, and a drain pad. Each of the devices under test in the first array is connected to the gate pad of the first pad set. Each of the devices under test in the first array is connected to the source pad of the first pad set. Each of the devices under test in the first array is connected to the drain pad of the first pad set.
    Type: Application
    Filed: February 10, 2009
    Publication date: June 4, 2009
    Applicant: PDF Solutions, Inc.
    Inventors: Christopher Hess, Angelo Rossoni, Stefano Tonello, Michele Squicciarini, Michele Quarantelli
  • Patent number: 7489151
    Abstract: A layout for devices under test formed on a semiconductor wafer for use in wafer testing includes a first array of devices under test and a first pad set formed adjacent to the first array. The first pad set includes a gate force pad, a source pad, and a drain pad. Each of the devices under test in the first array is connected to the gate pad of the first pad set. Each of the devices under test in the first array is connected to the source pad of the first pad set. Each of the devices under test in the first array is connected to the drain pad of the first pad set.
    Type: Grant
    Filed: October 3, 2005
    Date of Patent: February 10, 2009
    Assignee: PDF Solutions, Inc.
    Inventors: Christopher Hess, Angelo Rossoni, Stefano Tonello, Michele Squicciarini, Michele Quarantelli
  • Publication number: 20070075718
    Abstract: A layout for devices under test formed on a semiconductor wafer for use in wafer testing includes a first array of devices under test and a first pad set formed adjacent to the first array. The first pad set includes a gate force pad, a source pad, and a drain pad. Each of the devices under test in the first array is connected to the gate pad of the first pad set. Each of the devices under test in the first array is connected to the source pad of the first pad set. Each of the devices under test in the first array is connected to the drain pad of the first pad set.
    Type: Application
    Filed: October 3, 2005
    Publication date: April 5, 2007
    Applicant: PDF Solutions, Inc.
    Inventors: Christopher Hess, Angelo Rossoni, Stefano Tonello, Michele Squicciarini, Michele Quarantelli