Patents by Inventor Angus Repper
Angus Repper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9737855Abstract: A filtration material having a second fibrous layer (downstream drainage layer) with a length that is shorter than the length of the first fibrous material (upstream drainage layer) is provided. At least the first fibrous material is meltable. In forming the filtration material, the second fibrous layer may be cut to a predetermined length while the porous membrane and the first fibrous layer maintain their length. The length of the second fibrous layer may be substantially the same as the length of the outer cage. The filtration material is disposed within the outer cage such that the first fibrous layer and the porous membrane protrude from the cage member. When positioning an end cap onto the filtration material, heat is applied and the first fibrous layer melts and bonds to the end cap at a melt interface. The filtration material is free from thermoplastic strips and imbibed thermoplastic material(s).Type: GrantFiled: June 17, 2014Date of Patent: August 22, 2017Assignee: W. L. Gore & Associates, Inc.Inventors: Edward T. Neitzel, Angus Repper
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Patent number: 9446497Abstract: A multilayer chemical mechanical polishing pad is provided, having: a polishing layer having a polishing surface, a counterbore opening, a polishing layer interfacial region parallel to the polishing surface; a porous subpad layer having a bottom surface and a porous subpad layer interfacial region parallel to the bottom surface; and, a broad spectrum, endpoint detection window block comprising, comprises an olefin copolymer; wherein the window block exhibits a uniform chemical composition across its thickness; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the multilayer chemical mechanical polishing pad has a through opening that extends from the polishing surface to the bottom surface of the porous subpad layer; wherein the counterbore opening opens on the polishing surface, enlarges the through opening and forms a ledge; and, wherein the window block is disposed within the counterbore opening.Type: GrantFiled: March 7, 2013Date of Patent: September 20, 2016Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLCInventors: Angus Repper, Mary A. Leugers, David B. James, Marty W. DeGroot
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Patent number: 9259820Abstract: A chemical mechanical polishing pad is provided having a polishing layer; and an endpoint detection window incorporated into the chemical mechanical polishing pad, wherein the endpoint detection window is a plug in place window; wherein the endpoint detection window comprises a reaction product of ingredients, comprising: a window prepolymer, and, a window curative system, comprising: at least 5 wt % of a window difunctional curative; at least 5 wt % of a window amine initiated polyol curative; and, 25 to 90 wt % of a window high molecular weight polyol curative.Type: GrantFiled: March 28, 2014Date of Patent: February 16, 2016Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLCInventors: Bainian Qian, Marty W. DeGroot, James Murnane, Angus Repper, Michelle Jensen, Jeffrey J. Hendron, John G. Nowland, David B. James, Fengji Yeh
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Patent number: 9238295Abstract: A chemical mechanical polishing pad is provided containing: a polishing layer; a plug in place endpoint detection window block; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer comprises the reaction product of ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 ?m/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate. Also provide are methods of making and using the chemical mechanical polishing pad.Type: GrantFiled: May 31, 2013Date of Patent: January 19, 2016Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLCInventors: Bainian Qian, Michelle K. Jensen, Marty W. DeGroot, Angus Repper, James Murnane, Jeffrey James Hendron, John G. Nowland, David B. James, Fengji Yeh
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Patent number: 9186772Abstract: A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a broad spectrum, endpoint detection window block having a thickness along an axis perpendicular to a plane of the polishing surface; wherein the broad spectrum, endpoint detection window block, comprises a cyclic olefin addition polymer; wherein the broad spectrum, endpoint detection window block exhibits a uniform chemical composition across its thickness; wherein the broad spectrum, endpoint detection window block exhibits a spectrum loss ?40%; and, wherein the polishing surface is adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate.Type: GrantFiled: March 7, 2013Date of Patent: November 17, 2015Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.Inventors: Angus Repper, David B. James, Mary A. Leugers
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Publication number: 20150273652Abstract: A chemical mechanical polishing pad is provided having a polishing layer; and an endpoint detection window incorporated into the chemical mechanical polishing pad, wherein the endpoint detection window is a plug in place window; wherein the endpoint detection window comprises a reaction product of ingredients, comprising: a window prepolymer, and, a window curative system, comprising: at least 5 wt % of a window difunctional curative; at least 5 wt % of a window amine initiated polyol curative; and, 25 to 90 wt % of a window high molecular weight polyol curative.Type: ApplicationFiled: March 28, 2014Publication date: October 1, 2015Inventors: Bainian Qian, Marty W. DeGroot, James Murnane, Angus Repper, Michelle Jensen, Jeffrey J. Hendron, John G. Nowland, David B. James, Fengji Yeh
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Patent number: 9108290Abstract: A multilayer chemical mechanical polishing pad is provided, having: a polishing layer having a polishing surface, a counterbore opening, a polishing layer interfacial region parallel to the polishing surface; a porous subpad layer having a bottom surface and a porous subpad layer interfacial region parallel to the bottom surface; and, a broad spectrum, endpoint detection window block; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the multilayer chemical mechanical polishing pad has a through opening that extends from the polishing surface to the bottom surface of the porous subpad layer; wherein the counterbore opening opens on the polishing surface, enlarges the through opening and forms a ledge; and, wherein the broad spectrum, endpoint detection window block is disposed within the counterbore opening.Type: GrantFiled: March 7, 2013Date of Patent: August 18, 2015Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLCInventors: Angus Repper, Marty W. DeGroot
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Publication number: 20140357170Abstract: A chemical mechanical polishing pad is provided containing: a polishing layer; a plug in place endpoint detection window block; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer comprises the reaction product of ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 ?m/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate. Also provide are methods of making and using the chemical mechanical polishing pad.Type: ApplicationFiled: May 31, 2013Publication date: December 4, 2014Inventors: Bainian Qian, Michelle K. Jensen, Marty W. DeGroot, Angus Repper, James Murnane, Jeffrey James Hendron, John G. Nowland, David B. James, Fengji Yeh
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Publication number: 20140256226Abstract: A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a broad spectrum, endpoint detection window block having a thickness along an axis perpendicular to a plane of the polishing surface; wherein the broad spectrum, endpoint detection window block, comprises an olefin copolymer; wherein the olefin copolymer, comprises, as initial components: ethylene, a branched or straight chain C3-30 ?-olefin; a silane; and, optionally, a polyolefin; wherein the broad spectrum, endpoint detection window block exhibits a uniform chemical composition across its thickness; wherein the broad spectrum, endpoint detection window block exhibits a spectrum loss ?60%; and, wherein the polishing surface is adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate.Type: ApplicationFiled: March 7, 2013Publication date: September 11, 2014Inventors: Angus Repper, Mary A. Leugers, David B. James
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Publication number: 20140256225Abstract: A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a broad spectrum, endpoint detection window block having a thickness along an axis perpendicular to a plane of the polishing surface; wherein the broad spectrum, endpoint detection window block, comprises a cyclic olefin addition polymer; wherein the broad spectrum, endpoint detection window block exhibits a uniform chemical composition across its thickness; wherein the broad spectrum, endpoint detection window block exhibits a spectrum loss ?40%; and, wherein the polishing surface is adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate.Type: ApplicationFiled: March 7, 2013Publication date: September 11, 2014Applicants: DOW GLOBAL TECHNOLOGIES LLC, Roham and Haas Electronic Materials CMP Holdings IncInventors: Angus Repper, David B. James, Mary A. Leugers
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Publication number: 20140256232Abstract: A multilayer chemical mechanical polishing pad is provided, having: a polishing layer having a polishing surface, a counterbore opening, a polishing layer interfacial region parallel to the polishing surface; a porous subpad layer having a bottom surface and a porous subpad layer interfacial region parallel to the bottom surface; and, a broad spectrum, endpoint detection window block comprising, comprises an olefin copolymer; wherein the window block exhibits a uniform chemical composition across its thickness; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the multilayer chemical mechanical polishing pad has a through opening that extends from the polishing surface to the bottom surface of the porous subpad layer; wherein the counterbore opening opens on the polishing surface, enlarges the through opening and forms a ledge; and, wherein the window block is disposed within the counterbore opening.Type: ApplicationFiled: March 7, 2013Publication date: September 11, 2014Applicants: Dow Global Technologies LLC, Rohm and Haas Electronic Materials CMP Holdings Inc.Inventors: Angus Repper, Mary A. Leugers, David B. James, Marty W. DeGroot
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Publication number: 20140256231Abstract: A multilayer chemical mechanical polishing pad is provided, having: a polishing layer having a polishing surface, a counterbore opening, a polishing layer interfacial region parallel to the polishing surface; a porous subpad layer having a bottom surface and a porous subpad layer interfacial region parallel to the bottom surface; and, a broad spectrum, endpoint detection window block comprising a cyclic olefin addition polymer; wherein the window block exhibits a uniform chemical composition across its thickness; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the multilayer chemical mechanical polishing pad has a through opening that extends from the polishing surface to the bottom surface of the porous subpad layer; wherein the counterbore opening opens on the polishing surface, enlarges the through opening and forms a ledge; and, wherein the window block is disposed within the counterbore opening.Type: ApplicationFiled: March 7, 2013Publication date: September 11, 2014Applicants: Dow Global Technologies LLC, Rohm and Haas Electronic Materials CMP Holdings, Inc.Inventors: Angus Repper, David B. James, Mary A. Leugers, Marty W. DeGroot
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Publication number: 20140256230Abstract: A multilayer chemical mechanical polishing pad is provided, having: a polishing layer having a polishing surface, a counterbore opening, a polishing layer interfacial region parallel to the polishing surface; a porous subpad layer having a bottom surface and a porous subpad layer interfacial region parallel to the bottom surface; and, a broad spectrum, endpoint detection window block; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the multilayer chemical mechanical polishing pad has a through opening that extends from the polishing surface to the bottom surface of the porous subpad layer; wherein the counterbore opening opens on the polishing surface, enlarges the through opening and forms a ledge; and, wherein the broad spectrum, endpoint detection window block is disposed within the counterbore opening.Type: ApplicationFiled: March 7, 2013Publication date: September 11, 2014Applicants: Dow Global Technologies LLC, Rohm and Haas Electronic Materials CMP Holdings, Inc.Inventors: Angus Repper, Marty W. DeGroot