Patents by Inventor Anika A. Odukale

Anika A. Odukale has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device comprising high performance encapsulation resins
    Patent number: 8035236
    Abstract: A semiconductor device comprising curable polyorganosiloxane composites is provided where the composites contain at least 0.1 wt % of the 4th and/or 13th group elements of the periodic table. The cured polyorganosiloxane composites may be catalyst-free, have increased stability, and can be used as encapsulation resin at a temperature far lower than 300° C., have excellent light transmission properties (colorless transparency) in a wavelength region of from ultraviolet light to visible light, light resistance, heat resistance, resistance to moist heat and UV resistance, and has excellent adhesiveness toward metal, ceramics, and plastic surfaces over a long period of time.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: October 11, 2011
    Assignees: The Regents of the University of California, Mitsubishi Chemical Corporation
    Inventors: Craig J. Hawker, Hunaid Nulwala, Anika A. Odukale, Jeffrey A. Gerbec, Kenichi Takizawa
  • SEMICONDUCTOR LIGHT EMITTING DEVICE COMPRISING HIGH PERFORMANCE RESINS
    Publication number: 20110147722
    Abstract: A semiconductor light emitting device comprising curable polyorganosiloxane compositions is provided where the compositions contain a 13th group elements of the periodic table. The cured polyorganosiloxane compositions may be catalyst-free, have increased stability, and can be used as encapsulation resin at a temperature far lower than 300° C., have excellent light transmission properties (colorless transparency) in a wavelength region of from ultraviolet light to visible light, light resistance heat resistance, resistance to moist heat and UV resistance, and has excellent adhesiveness toward metal, ceramics, and plastic surfaces over a long period of time.
    Type: Application
    Filed: November 22, 2010
    Publication date: June 23, 2011
    Inventors: Craig J. Hawker, Hunaid Nulwala, Anika A. Odukale, Taegon Kang, Jeffrey A. Gerbec, Kenichi Takizawa
  • SEMICONDUCTOR DEVICE COMPRISING HIGH PERFORMANCE ENCAPSULATION RESINS
    Publication number: 20110089580
    Abstract: A semiconductor device comprising curable polyorganosiloxane composites is provided where the composites contain at least 0.1 wt % of the 4th and/or 13th group elements of the periodic table. The cured polyorganosiloxane composites may be catalyst-free, have increased stability, and can be used as encapsulation resin at a temperature far lower than 300° C., have excellent light transmission properties (colorless transparency) in a wavelength region of from ultraviolet light to visible light, light resistance, heat resistance, resistance to moist heat and UV resistance, and has excellent adhesiveness toward metal, ceramics, and plastic surfaces over a long period of time.
    Type: Application
    Filed: October 16, 2009
    Publication date: April 21, 2011
    Inventors: Craig J. Hawker, Hunaid Nulwala, Anika A. Odukale, Jeffrey A. Gerbec, Kenichi TAKIZAWA