Patents by Inventor Anikara Rangappan

Anikara Rangappan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8895416
    Abstract: Systems and methods for semiconductor device PN junction fabrication are provided. In one embodiment, a method for fabricating an electrical device having a P-N junction comprises: depositing a layer of amorphous semiconductor material onto a crystalline semiconductor base, wherein the crystalline semiconductor base comprises a crystalline phase of a same semiconductor as the amorphous layer; and growing the layer of amorphous semiconductor material into a layer of crystalline semiconductor material that is epitaxially matched to the lattice structure of the crystalline semiconductor base by applying an optical energy that penetrates at least the amorphous semiconductor material.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: November 25, 2014
    Assignee: Alliance for Sustainable Energy, LLC
    Inventors: Bhushan Sopori, Anikara Rangappan
  • Publication number: 20140256080
    Abstract: Systems and methods for semiconductor device PN junction fabrication are provided. In one embodiment, a method for fabricating an electrical device having a P-N junction comprises: depositing a layer of amorphous semiconductor material onto a crystalline semiconductor base, wherein the crystalline semiconductor base comprises a crystalline phase of a same semiconductor as the amorphous layer; and growing the layer of amorphous semiconductor material into a layer of crystalline semiconductor material that is epitaxially matched to the lattice structure of the crystalline semiconductor base by applying an optical energy that penetrates at least the amorphous semiconductor material.
    Type: Application
    Filed: March 11, 2013
    Publication date: September 11, 2014
    Applicants: APPLIED OPTICAL SCIENCES (AOS) CORP, ALLIANCE FOR SUSTAINABLE ENERGY, LLC
    Inventors: Bhushan SOPORI, Anikara RANGAPPAN
  • Patent number: 5256899
    Abstract: A fuse link includes a fuse portion and a exothermic charge adjacent the fuse portion for blowing the fuse portion upon application of a triggering current to the fuse link.
    Type: Grant
    Filed: December 24, 1991
    Date of Patent: October 26, 1993
    Assignee: Xerox Corporation
    Inventor: Anikara Rangappan
  • Patent number: 5218754
    Abstract: A new thermal ink jet print head designed to have a page wide length. A channel plate is made on a single piece of desired length, preferably the width of the paper being printed, by molding any material that can be molded. Subsequently, the channel plate is hardened to form a rigid structure. Due to the limitations of the silicon chip lengths, as a result of process yield, the heaters are made in plurality of chips and then the heater chips are precisely diced and bonded to the channel plate.
    Type: Grant
    Filed: December 11, 1992
    Date of Patent: June 15, 1993
    Assignee: Xerox Corporation
    Inventor: Anikara Rangappan
  • Patent number: 5211806
    Abstract: The present invention is directed to a method for fabricating a monolithic ink jet printhead. The printhead has a substrate with a major surface and a plurality of ink channels formed on the major surface, with the ink channels each having a nozzle at one end and an inlet communicating with an ink manifold at the other end. The printhead has transducers, formed on the major surface and positioned in each ink channel, for creating pressure to move ink through the nozzles. According to the method, first a mandrel of a first metal or metal alloy is formed, on the major surface, that models the ink channels and the ink manifold. Then a first passivation layer is formed on the mandrel and the major surface, and a mandrel cover of a first metal or metal alloy is formed covering the mandrel, separated from the mandrel by the first passivation layer. A nozzle cap is formed over and attached to the mandrel cover by plating the mandrel cover with a third metal or metal alloy.
    Type: Grant
    Filed: December 24, 1991
    Date of Patent: May 18, 1993
    Assignee: Xerox Corporation
    Inventors: Kaiser Wong, Anikara Rangappan