Patents by Inventor Aniket (NO LAST NAME)

Aniket (NO LAST NAME) has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250259705
    Abstract: The present disclosure relates to systems, non-transitory computer-readable media, and methods that a implement a framework for active learning to discover pairwise interactions via representation learning. Indeed, in one or more implementations, the disclosed systems generate a first individual perturbation embedding from a first representation of a first cell exposed to a first perturbation and a second individual perturbation embedding, from a second representation of a second cell exposed to a second perturbation. For instance, the disclosed systems combine the first individual perturbation embedding and the second individual perturbation embedding to determine a predicted pairwise embedding. Moreover, in some instances, the disclosed systems generate a pairwise embedding from a representation of a cell exposed to both the first and second perturbation.
    Type: Application
    Filed: April 18, 2024
    Publication date: August 14, 2025
    Inventors: Aniket Rajiv Didolkar, Jason Siyanda Hartford, Moksh Mukesh Kumar Jain
  • Patent number: 12385847
    Abstract: A method, system, and device evaluate a gemstone using a gemstone imaging and evaluation device. The method includes capturing a plurality of training images of a plurality of gemstones using an image capturing device having a plurality of different focal settings, training a machine learning module using the plurality of training images, capturing a query image of a gemstone, analyzing the query image using the trained machine learning module, identifying a selected feature of the gemstone within the query image, and outputting a notification of the identified selected feature. The system and the gemstone imaging and evaluation device implement the method.
    Type: Grant
    Filed: May 24, 2023
    Date of Patent: August 12, 2025
    Assignee: Parikh Holdings LLC
    Inventor: Aniket Parikh
  • Publication number: 20250246531
    Abstract: Aspects disclosed include an integrated circuit (IC) package with die interconnects of a semiconductor die terminating at multiple metallization layers in a substrate to reduce spacing requirement between die interconnects. The die comprises a first plurality of die interconnects and a second plurality of die interconnects. The substrate includes a first metallization layer adjacent to the die and a second metallization layer that is parallel to the first metallization layer such that the first metallization layer is between the die and second metallization layer. The first and second metallization layers each comprise a respective first plurality of metal pads and a second plurality of metal pads. The first plurality of die interconnects terminates to the first plurality of metal pads in the first metallization layer while the second plurality of die interconnects terminates to the second plurality of metal pads in the second metallization layer.
    Type: Application
    Filed: January 29, 2024
    Publication date: July 31, 2025
    Inventors: Aniket Patil, Yangyang Sun, Joan Rey Villarba Buot
  • Publication number: 20250243877
    Abstract: An electric motor-powered centrifugal compressor having serially connected low- and high-pressure stages includes journal bearings for the shaft of the compressor, the journal bearings being contained in a motor housing that defines a motor cavity enclosing the electric motor. A labyrinth seal is arranged between the high-pressure compressor wheel and the adjacent journal bearing. The labyrinth seal allows a metered flow of fluid, constituting a fraction of the main fluid flow, to pass the labyrinth seal and flow through the journal bearing into the motor cavity for cooling the journal bearing.
    Type: Application
    Filed: January 25, 2024
    Publication date: July 31, 2025
    Applicant: Garrett Transportation I Inc.
    Inventors: Vijaysarathy Anbazhagan, Darius Mehta, Gururaj Jk, Suryakant Gupta, Kosuvari Vamsikrishna Reddy, Aniket Santoshwar
  • Publication number: 20250245019
    Abstract: A firmware management operation. The firmware management operation includes providing an information handling system with a distributed BIOS, the distributed BIOS including a BIOS component and a BIOS variable; identifying a processor environment installed on an information handling system from a plurality of processor environments; performing a processor environment agnostic storage protocol based information handling system firmware management operation, the processor environment agnostic storage protocol based information handling system firmware management operation enabling storage device recovery from an issue relating to one of a plurality of storage configurations during a pre-boot phase of operation.
    Type: Application
    Filed: January 31, 2024
    Publication date: July 31, 2025
    Inventors: Aniket Surekar, Shekar Babu Suryanarayana, Anjali S
  • Publication number: 20250246590
    Abstract: A device includes a first die physically and electrically connected to a first set of redistribution layers, where the first set of redistribution layers include a first set of metal layers oriented along a first plane. The integrated device also includes a substrate and a second die disposed between the first set of redistribution layers and the substrate. The second die is physically and electrically connected to a second set of redistribution layers, where the second set of redistribution layers include a second set of metal layers oriented along a second plane. The second plane is non-parallel with respect to the first plane, and the second set of metal layers define conductive paths between various combinations of the substrate, the first die, and the second die.
    Type: Application
    Filed: January 25, 2024
    Publication date: July 31, 2025
    Inventors: Yujen CHEN, Aniket PATIL, Yangyang SUN
  • Publication number: 20250246532
    Abstract: A plurality of surface interconnects is disposed in a surface interconnect layer on a first surface of a substrate. The surface interconnects extend between a first area and a second area. In some examples, the first area may be configured to couple to an integrated circuit die and the second area may include package contacts. In the second area, a dielectric layer is disposed on the surface interconnect layer, a plurality of raised interconnects are disposed on the dielectric layer, and the raised interconnects are coupled to the surface interconnects through the dielectric layer. The raised interconnects may provide parallel paths for signals propagating through the surface interconnects between the first area and the second area. The raised interconnects may allow surface interconnects to be narrowed and disposed with increased density on the substrate without increasing resistance for signals propagating between the first area and the second area.
    Type: Application
    Filed: January 30, 2024
    Publication date: July 31, 2025
    Inventors: Manuel Aldrete, Aniket Patil, Kuiwon Kang
  • Publication number: 20250240615
    Abstract: This application sets forth techniques for managing push notifications for a reserve electronic subscriber identity module (eSIM) connection for a wireless device. A reserve eSIM is installed in the wireless device to provide a limited functionality connectivity option for essential services, such as device activation, user eSIM provisioning, user eSIM transfer, and user subscription account management. When a reserve eSIM is active, push notifications for a limited set of push notification topics are allowed to be communicated to the wireless device via the reserve eSIM connection.
    Type: Application
    Filed: October 15, 2024
    Publication date: July 24, 2025
    Inventors: Abishek Kumar VAIDYANATHAN, Aniket A. ZAMWAR, Li LI, Mohanasundaram KATTAVOOR SIVAKUMAR, Nelson M. LeDUC, Nithish Kulur PRABHAKARA, Siddharth VERMA
  • Patent number: 12368694
    Abstract: Techniques are described for creating isolated pools of external, failover, and/or floating IP addresses. In one example, this disclosure describes a method including creating a plurality of virtual networks, creating a plurality of pools of external IP addresses, detecting a request to instantiate an object that identifies a specific pool from the plurality of pools of external IP addresses; and instantiating the object and configuring the object with an external IP address drawn from the specific pool. The pools of external IP addresses may be created and isolated on a per-namespace, per-service, or per-ingress basis.
    Type: Grant
    Filed: May 13, 2024
    Date of Patent: July 22, 2025
    Assignee: Juniper Networks, Inc.
    Inventors: Aniket J. Gawade, Sachchidanand Vaidya, Yuvaraja Mariappan
  • Patent number: 12368652
    Abstract: A distributed oracle agreement system and method thereof includes obtaining, by a first oracle node and a second oracle node of a consensus network, a first set and second set of data points from a data source that is external to the consensus network having a plurality of nodes. The method further includes computing a first median of the first set of data points and a second median of the second set of data points. The method includes forming, by an aggregator node, a cluster of data points from the sets of data points with the cluster contains data points within a predetermined distance. The method includes proposing the cluster to the plurality of nodes such that a vote on the cluster is performed. The method includes generating a quorum certificate message in response to the vote. The method includes committing the cluster to a block of the consensus network.
    Type: Grant
    Filed: June 3, 2024
    Date of Patent: July 22, 2025
    Assignee: Unity Chain, Inc.
    Inventors: Saurabh Bhanuprasad Joshi, Aniket Kate, Joshua Tobkin, Yin Yang
  • Publication number: 20250233182
    Abstract: Disclosed are a membrane-electrode assembly (MEA) and a method of manufacturing the same. The MEA include an electrolyte membrane and a pair of electrodes, the electrodes being disposed on both surfaces of the electrolyte membrane, respectively. At least one of the electrolyte membranes and electrodes includes an ion-conducting polymer having a proton-conducting functional group, and a compound represented by Chemical Formula 1 is bonded to each of all or some of the proton-conducting functional groups including the Chemical Formula 1 of MAx, wherein M is an element belonging to the lanthanum group, A is a hydrophilic functional group, and X is a numerical value for balance of charges between A and M. Since the MEA includes an ion-conducting polymer having good chemical durability and proton conductivity, the MEA is durable and has high proton conductivity.
    Type: Application
    Filed: April 4, 2025
    Publication date: July 17, 2025
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, Industry Foundation of Chonnam National University
    Inventors: In Yu Park, Jong Kil Oh, Sun Ju Song, Jae Woon Hong, Aniket Kumar, Ye Jin Yun
  • Publication number: 20250215049
    Abstract: Provided herein are methods for preparing a protein composition having a reduced quantity of a recombinant cell byproduct which provides an undesirable color to a protein composition.
    Type: Application
    Filed: August 9, 2024
    Publication date: July 3, 2025
    Applicant: Clara Foods Co.
    Inventor: Aniket KALE
  • Publication number: 20250218966
    Abstract: In an aspect, a substrate includes a core having a first surface and a second surface opposite the first surface; a first set of metallization layers disposed over the first surface; an offset layer structure disposed over the second surface; and a second set of metallization layers disposed over the second surface, wherein the second set of metallization layers includes a larger number of metallization layers than the first set of metallization layers.
    Type: Application
    Filed: December 28, 2023
    Publication date: July 3, 2025
    Inventors: Manuel ALDRETE, Aniket PATIL, Joan Rey Villarba BUOT
  • Publication number: 20250217155
    Abstract: Techniques for early resteering of a branch misprediction are described. Examples detailed herein use a virtual run-ahead mechanism in the core. On a branch misprediction for an hard-to-predict (H2P) branch, a subset of the backslice of the H2P branch are replayed from the out-of-order engine directly (while the main thread is flushing and restarting execution from the front-end).
    Type: Application
    Filed: December 30, 2023
    Publication date: July 3, 2025
    Inventors: Aniket Deshmukh, Sufiyan Syed, Jayesh Gaur, Sreenivas Subramoney
  • Patent number: 12346280
    Abstract: Multi-port Media Control Channel (MAC) with flexible data-path width. A multi-port receive (RX) MAC block includes multiple RX ports and a plurality of RX circuit blocks comprising an RX MAC pipeline for performing MAC Layer operations on RX data received at the RX ports. The RX circuit blocks are connected with variable-width datapath segments, and the RX MAC block is configured to implement a multi-port arbitration scheme such as a TDM (Time-Division Multiplexed) scheme under which RX data received at a given RX port are forwarded over the variable-width datapath segments using datapath widths associated with that RX port. A multi-port transmit (TX) MAC block implementing a TX MAC pipeline comprising TX circuit blocks connected with variable-width datapath segments is also provided. The RX and TX MAC blocks include CRC modules configured to calculate CRC values on input data received over datapaths having different widths.
    Type: Grant
    Filed: July 12, 2024
    Date of Patent: July 1, 2025
    Assignee: Intel Corporation
    Inventors: Daniel Biederman, Aniket A Aphale, Sharvil Desai, Matthew James Webb
  • Publication number: 20250194961
    Abstract: A wearable sensor decal may include a flexible wrapper layer, an intermediate layer, and a porous film layer. A first plurality of electrodes may be deposited on the wrapper layer. A heating element may be conductivity coupled to the first plurality of electrodes. A second plurality of electrodes may be deposited on the intermediate layer. A biosensor may be conductively coupled to the second plurality of electrodes. The flexible film may be hydrophilic to allow biofluids pass to the biosensor and the wrapper layer may be hydrophobic to provide waterproofing to the biosensor and heating element. The heating element may be powered to reduce thermal variance in biosensor measurements. The electrodes for the heating element and biosensor may be exposed on the non-target side of the wearable sensor decal.
    Type: Application
    Filed: November 26, 2024
    Publication date: June 19, 2025
    Applicant: Purdue Research Foundation
    Inventors: Ramses Valentin Martinez, Aniket Pal
  • Publication number: 20250192010
    Abstract: In an aspect, an interposer substrate for an integrated circuit (IC) package includes a core layer, a first metallization structure on a first surface of the core layer and having an inner side facing the core layer, a second metallization structure on a second surface of the core layer and having an inner side facing the core layer, a first solder resist layer on an outer side of the first metallization structure, and a second solder resist layer on an outer side of the second metallization structure. The first metallization structure includes n metallization layer(s) in total. The second metallization structure includes m metallization layers in total. In some examples, m is greater than n.
    Type: Application
    Filed: December 6, 2023
    Publication date: June 12, 2025
    Inventors: Aniket PATIL, Joan Rey Villarba BUOT, Manuel ALDRETE
  • Publication number: 20250191989
    Abstract: A package comprising a first substrate; an integrated device coupled to the first substrate, wherein the integrated device comprises a step back side; a second substrate comprising a cavity, wherein the integrated device is located at least partially in the cavity of the second substrate; and an encapsulation layer coupled to the first substrate and the second substrate. The encapsulation layer is located between the first substrate and the second substrate. The encapsulation layer is located at least partially in the cavity of the second substrate.
    Type: Application
    Filed: December 7, 2023
    Publication date: June 12, 2025
    Inventors: Joan Rey Villarba BUOT, Aniket PATIL, Zhijie WANG
  • Patent number: 12322175
    Abstract: A video is classified as real or fake by extracting facial features, including facial modalities and facial emotions, and speech features, including speech modalities and speech emotions, from the video. The facial and speech modalities are passed through first and second neural networks, respectively, to generate facial and speech modality embeddings. The facial and speech emotions are passed through third and fourth neural networks, respectively, to generate facial and speech emotion embeddings. A first distance, d1, between the facial modality embedding and the speech modality embedding is generated, together with a second distance, d2, between the facial emotion embedding and the speech emotion embedding. The video is classified as fake if a sum of the first distance and the second distance exceeds a threshold distance. The networks may be trained using real and fake video pairs for multiple subjects.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: June 3, 2025
    Assignee: University of Maryland, College Park
    Inventors: Trisha Mittal, Uttaran Bhattacharya, Rohan Chandra, Aniket Bera, Dinesh Manocha
  • Patent number: 12316603
    Abstract: Systems and methods for remote command access in a hybrid cloud to on-premises devices are described. An example method includes receiving, by a gateway service, a request for a connection between a remote support service agent and an on-premises device. The method further includes receiving, by the gateway service, consent from an authorized user associated with the on-premises device. The method further includes creating, by the gateway service, a first session with the on-premises device, where a scope of the consent is limited to the first session. The method further includes provisioning, by the gateway service, a device-specific hybrid connection endpoint for the first session. The method further includes forming, by the gateway service a secure session by binding the device-specific hybrid connection endpoint with a second session, the secure session allowing for transport of data and a set of commands based on a scope of the consent.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: May 27, 2025
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Faraz H. Qadri, Aniket A. Malatpure, Swapnil T. Ashtekar, Greeshma Vijayakumar, Shireen Anvarhusein Isab, Mohit Kumar Garg, Phani Prakash Boppana, Trivikram Somisetty