Abstract: A fluid control valve assembly including a microvalve for controlling fluid flow in a fluid circuit having a relatively high fluid pressure requirement, such as vehicular brake system, is fixed to an associated fluid distributing substrate with a high-pressure fluid connection. The fluid distributing substrate is provided with fluid passages adapted for connection to a fluid source to provide communication between the fluid source and the microvalve device. The connection between the microvalve and the fluid distributing substrate may include metallic connections forming electrical current paths between the microvalve and the substrate; solder joints forming part of the pressure boundary of the high-pressure fluid connection; underfill formed of elastomeric or other adhesive; and bonding between the substrate and the microvalves in only selected portions of the surface of the microvalve.

Abstract: Disclosed is an ultra-thick thick film of copper or silver or other suitable conductor material for use in spreading heat laterally, i.e., in the x and y directions, along a substrate. A substrate of suitable thickness is chosen to dissipate heat in the vertical or z-direction underneath a heat generating component such as a semiconductor chip. The ultra-thick films have a thickness ranging from about 2 to about 5 mils and are prepared from metal powders having average particles sizes ranging from about 1 micron to 3 microns.