Patents by Inventor Anil Nadkarni

Anil Nadkarni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11929904
    Abstract: Method for monitoring network performance in a telecommunication network coupled with a plurality of Virtual Machines (VM) arranged in a cluster format is disclosed. A packet is received at a VM smart cluster device. Metadata is extracted from the packet. The packet can be distributed to one of the plurality of VMs. Key performance indicator (KPI) session related data associated with a subscriber in one of the plurality of VMs that receives the distributed packet can be generated.
    Type: Grant
    Filed: January 18, 2023
    Date of Patent: March 12, 2024
    Assignee: Netscout Systems, Inc.
    Inventors: Rajeev Nadkarni, Abhishek Saraswati, Anil K. Singhal, Bruce A. Kelley, Jr., Narendra Byrapuram, John Peter Curtin, Tauras Liubinskas
  • Publication number: 20070231182
    Abstract: The present invention provides a new process for making a low cost powder for the manufacture of high performance bearings. Improved powders and sintered parts (e.g., bearings) are also provided. The powders of the present invention are formed by blending iron powder with fine cuprous oxide powder and elemental tin powder. The blended powders are then thermally treated under a reducing atmosphere to form a sintered cake, which is milled to a powder.
    Type: Application
    Filed: February 26, 2007
    Publication date: October 4, 2007
    Applicant: SCM Metal Products, Inc.
    Inventors: Nicola Veloff, Anil Nadkarni, Thomas Murphy
  • Publication number: 20050182161
    Abstract: The present invention provides water atomized copper powder comprising substantially irregular shaped copper particles having at least a median D50 particle size of from about 20 ?m or greater to about 50 ?m. The powders of the present invention are suitable for use in electrically conductive compositions, such as copper-based adhesives. The present invention also provides methods of making these copper powders.
    Type: Application
    Filed: January 3, 2005
    Publication date: August 18, 2005
    Inventors: Rajesh Khattar, Anil Nadkarni, Hsiao Cheng
  • Publication number: 20020149005
    Abstract: The present invention provides water atomized copper powder comprising substantially irregular shaped copper particles having at least a median D50 particle size of from about 10 &mgr;m to about 50 &mgr;m. The powders of the present invention are suitable for use in electrically conductive compositions, such as copper-based adhesives. The present invention also provides methods of making these copper powders.
    Type: Application
    Filed: December 10, 2001
    Publication date: October 17, 2002
    Inventors: Rajesh Khattar, Anil Nadkarni, Hsiao L. Cheng
  • Publication number: 20020037234
    Abstract: The invention provides a fully dense compacted metal composite comprising silver alloy matrix having uniformly dispersed therein discrete microparticles of a refractory metal oxide, and further comprising discrete macroparticles of metal oxides. This composition can be used for electrical contacts which have greater mechanical strength, welding resistance and arc erosion resistance than previously known electrical contacts.
    Type: Application
    Filed: July 13, 2001
    Publication date: March 28, 2002
    Inventors: Anil Nadkarni, John T. Abrams
  • Patent number: 4999336
    Abstract: There is provided a substantially fully dense powdered metal composite comprising a highly conductive metal or metal alloy matrix having dispersed therein discrete microparticles of a refractory metal oxide and discrete macroparticles of a mechanical or physical property-conferring additive material. The respective components undergo minimal alloying or interdispersion because sintering is not utilized in forming the composite. These composites are characterized by high thermal or electrical conductivity and a desired property (controlled thermal expansion, high strength, wear and arc erosion resistance, or magnetic) attributable to the composite forming material, like refractory metal, alloy, or compound. The composites are useful in forming lead frames for integrated circuit chips, electric lamp lead wires, electrical contact members, and discrete component leads.
    Type: Grant
    Filed: June 17, 1988
    Date of Patent: March 12, 1991
    Assignee: SCM Metal Products, Inc.
    Inventors: Anil Nadkarni, Prasan K. Samal, James E. Synk