Abstract: An integrated pad and belt for polishing a surface comprising a belt integrated with a polishing pad that forms a seamless polishing surface.

Abstract: A system and method for planarizing a plurality of semiconductor wafers is provided. The method includes the steps of processing each wafer along the same process path using at least two polishing stations to each partially planarize the wafers. The system includes an improved process path exchanging a detachable wafer carrying head with spindles at each processing point and conveying the detached wafer carrying heads in a rotary index table between processing points. The system also provides for improved polishing accuracy using linear polishers having pneumatically adjustable belt tensioning and aligning capabilities.

Abstract: A technique for integrating a film thickness monitoring sensor within a load and unload unit of a cluster tool for performing chemical-mechanical polishing (CMP). In order to determine CMP performance, a sensor (or sensors) for determining film thickness is/are integrated within the load and unload unit of the cluster tool. Accordingly, film thickness measurements can then be taken at discrete times during the processing cycle without removing the wafer from the cluster tool.