Patents by Inventor Anil R. Indluru

Anil R. Indluru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ablation method and recipe for wafer level underfill material patterning and removal
    Patent number: 9786517
    Abstract: Introducing an underfill material over contact pads on a surface of an integrated circuit substrate; and ablating the introduced underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation. A method including first ablating an underfill material to expose an area of contact pads on a substrate using temporally coherent electromagnetic radiation; introducing a solder to the exposed area of the contact pads; and second ablating the underfill material using temporally coherent electromagnetic radiation. A method including introducing an underfill material over contact pads on a surface of an integrated circuit substrate; defining an opening in the underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation; introducing a solder material to the exposed area of the contact pads; and after introducing the solder, removing the sacrificial material.
    Type: Grant
    Filed: September 9, 2013
    Date of Patent: October 10, 2017
    Assignee: Intel Corporation
    Inventors: Rajendra C. Dias, Lars D. Skoglund, Anil R. Indluru, Edward R. Prack, Danish Faruqui, Tyler N. Osborn, Amram Eitan, Timothy A. Gosselin
  • LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNING AND REMOVAL
    Publication number: 20150072515
    Abstract: A method including introducing a passivation material over contact pads on a surface of an integrated circuit substrate; patterning a sacrificial material on the passivation material to define openings in the sacrificial material to the contact pads; introducing solder to the contact pads; and after introducing the solder, removing the sacrificial material with the proviso that, where the sacrificial material is a photosensitive material, removing comprises using temporally coherent electromagnetic radiation. A method including introducing a passivation material over contact pads; exposing the contact pads; patterning a photosensitive material on the passivation material; introducing solder to the contact pads; and after introducing the solder, removing the photosensitive material using temporally coherent electromagnetic radiation.
    Type: Application
    Filed: September 9, 2013
    Publication date: March 12, 2015
    Inventors: Rajendra C. Dias, Lars D. Skoglund, Anil R. Indluru, Edward R. Prack, Danish Faruqui, Tyler N. Osborn
  • ABLATION METHOD AND RECIPE FOR WAFER LEVEL UNDERFILL MATERIAL PATTERNING AND REMOVAL
    Publication number: 20150072479
    Abstract: Introducing an underfill material over contact pads on a surface of an integrated circuit substrate; and ablating the introduced underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation. A method including first ablating an underfill material to expose an area of contact pads on a substrate using temporally coherent electromagnetic radiation; introducing a solder to the exposed area of the contact pads; and second ablating the underfill material using temporally coherent electromagnetic radiation. A method including introducing an underfill material over contact pads on a surface of an integrated circuit substrate; defining an opening in the underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation; introducing a solder material to the exposed area of the contact pads; and after introducing the solder, removing the sacrificial material.
    Type: Application
    Filed: September 9, 2013
    Publication date: March 12, 2015
    Inventors: Rajendra C. Dias, Lars D. Skoglund, Anil R. Indluru, Edward R. Prack, Danish Faruqui, Tyler N. Osborn, Amram Eitan, Timothy A. Gosselin