Abstract: A wireless communication device wirelessly downloads a user application, and in response, wirelessly receives signaling that indicates a wireless network slice for the user application. The wireless communication device wirelessly downloads another user application, and in response, wirelessly receives other signaling that indicates another wireless network slice for the other user application. The wireless communication device executes the user application, and in response, wirelessly transfers a request for the wireless network slice and wirelessly exchanges application data for the user application over the wireless network slice for the user application. The wireless communication device executes the other user application, and in response, wirelessly transfers another request for the other wireless network slice and wirelessly exchanges other application data for the other user application over the other wireless network slice for the other user application.

Abstract: A wireless communication network delivers status information for User Equipment (UE) upon request. A network controller exchanges registration signaling with the UE and exchanges authentication signaling for the UE with a Unified Data Management (UDM). The UDM exchanges the authentication signaling with the network controller and responsively transfers a UDM request for the UE status information to the network controller. The network controller determines the UE status information and transfers the UE status information to the UDM in response to the UDM request. The UDM receive the UE status information from the network controller and transfers the UE status information to a Unified Data Repository (UDR). The UDR receives the UE status information from the UDM and receives a status request for the UE from a network element. The UDR responsively transfers the UE status information for the UE to the network element.

Abstract: In one embodiment, a system for managing communication connections in a virtualization environment includes a plurality of host machines implementing a virtualization environment, wherein each of the host machines includes a hypervisor, at least one user virtual machine (user VM), and a distributed file server that includes file server virtual machines (FSVMs) and associated local storage devices. Each FSVM and associated local storage device are local to a corresponding one of the host machines, and the FSVMs conduct I/O transactions with their associated local storage devices based on I/O requests received from the user VMs. Each of the user VMs on each host machine sends each of its representative I/O requests to an FSVM that is selected by one or more of the FSVMs for each I/O request based on a lookup table that maps a storage item referenced by the I/O request to the selected one of the FSVMs.

Abstract: A wireless communication network deregisters network functions. In the wireless communication, a network data system receives a deregistration command that indicates a wireless User Equipment (UE) and forwards the deregistration command to a Unified Data Management (UDM). The UDM receives the indication and determines a Data Network Name (DNN) for the wireless UE. The UDM identifies a network controller and a session controller for the wireless UE based on the DNN. The UDM transfers deregistration notifications to the network controller and session controller. The UDM receives a deregistration acknowledgement from the network controller. The UDM directs the network data system to remove stored session data for the session controller. The network data system receives the direction from the UDM and responsively removes stored session data for the session controller.

Abstract: Examples described herein include virtualized file servers which may include cloned instances of the virtualized file server. Cloning a virtualized the server may allow for testing of new and/or revised features, disaster recovery plans, or other configurations while maintaining availability of the parent (e.g., source) virtualized file server.

Abstract: In one embodiment, an illustrative method herein may comprise: determining, by a network controller, physical network topology of a data center network; collecting, by the network controller, virtual machine related network topology of the data center network from a virtual machine manager for the data center network; collecting, by the network controller, virtual ethernet flow mapping information of the data center network from a blade system management software for the data center network; collecting, by the network controller, container workload information of the data center network from a container orchestrator for the data center network; and generating, by the network controller, an integrated correlated visualization mapping of containers and associated network attachment points in the data center network based on the physical network topology, the virtual machine related network topology, the virtual ethernet flow mapping information, and the container workload information.

Abstract: Embodiments disclosed herein include an integrated circuit structure. In an embodiment, the integrated circuit structure comprises an interlayer dielectric (ILD). and an interconnect over the ILD. In an embodiment, the interconnect comprises a plurality of first layers, where the first layers comprise a metal, and a plurality of second layer in an alternating pattern with the plurality of first layers. In an embodiment, the second layers comprise a two-dimensional (2D) material.

Abstract: The current document is directed to event-message collection, processing, and storage systems and, in particular, to event-message collection, processing, and storage computing systems that are configurable to facilitate scaling, load balancing, and selection of a centralizing/decentralizing level which, in turn, provide a variety of operational efficiencies and advantages. Decentralization combined with event-record filtering, in a described implementation, provides for a significant reduction in data-transmission, processing, and data-storage overheads. Dynamic reconfiguration of the components of the event-message collection, processing, and storage systems allows for increased precision in scaling and load balancing to adapt the event-message collection, processing, and storage systems to dynamically reconfigured distributed computer systems in which the event-message collection, processing, and storage systems run.

Abstract: Embodiments disclosed herein include an integrated circuit structure. In an embodiment, the integrated circuit structure comprises an interlayer dielectric (ILD), and an opening in the ILD. In an embodiment, a first layer lines the opening, and a second layer lines the first layer. In an embodiment, the second layer comprises a semi-metal or transition metal dichalcogenide (TMD). The integrated circuit structure may further comprise a third layer over the second layer.

Abstract: A gas turbine engine includes a fan located at a forward portion of the gas turbine engine, and a compressor section and a turbine section arranged in serial flow order. The compressor section and the turbine section together define a core airflow path. A rotary member is rotatable with the fan and with a low pressure turbine of the turbine section. The low pressure turbine includes a rotating drum to which a first airfoil structure is connected and extends radially inward toward the rotary member. A torque frame connects the rotating drum to the rotary member and transfers torque from the first airfoil structure mounted to the rotating drum to the rotary member. The torque frame includes an inner disk mounted to the rotary member, an outer ring and a second airfoil structure formed separately from the outer ring and connected thereto by a releasable connecting structure. The second airfoil structure extends radially inward from the outer ring toward the inner disk.

Abstract: Embodiments herein provide a method and system for performing a bearer type change of a plurality of radio bearers configured for a User Equipment (UE). The proposed method includes changing the bearer type of specific bearer by the network. Further, the proposed method includes checking any changes in keys or PDCP termination point or PDCP version change. Furthermore, the proposed method includes notifying the UE to change the bearer type either through reconfiguration procedure without handover or SN change procedure or reconfiguration procedure with handover or SN change procedure. The network indicates one or more operations to the UE for performing the bearer type change.

Abstract: Embodiments disclosed herein include through silicon waveguides and methods of forming such waveguides. In an embodiment, a through silicon waveguide comprises a substrate, where the substrate comprises silicon. In an embodiment, a waveguide is provided through the substrate. In an embodiment, the waveguide comprises a waveguide structure. and a cladding around the waveguide structure.

Abstract: An embodiment of a capacitor in the back-side layers of an IC die may comprise any type of solid-state electrolyte material disposed between electrodes of the capacitor. Another embodiment of a capacitor anywhere in an IC die may include one or more materials selected from the group of indium oxide, indium nitride, gallium oxide, gallium nitride, zinc oxide, zinc nitride, tungsten oxide, tungsten nitride, tin oxide, tin nitride, nickel oxide, nickel nitride, niobium oxide, niobium nitride, cobalt oxide, and cobalt nitride between electrodes of the capacitor. Other embodiments are disclosed and claimed.

Abstract: An integrated circuit (IC) die includes a substrate and an array of memory cells formed in or on the substrate with a memory cell of the array of memory cells that includes a storage circuit that comprises a hysteretic-oxide material. A ternary content-addressable memory (TCAM) may utilize hysteretic-oxide memory cells. Other embodiments are disclosed and claimed.

Abstract: An integrated circuit device includes a first IC die with a first front surface, a first back surface, and a first side surface along opposed edges of the first front surface and the first back surfaces of the first IC die, a second IC die with a second front surface, a second back surface, and a second side surface along opposed edges of the second front surface and second back surface of the second IC die, a substrate coupled to the first side surface of the first IC die and the second side surface of the second IC die, and fill material between one of the first front surface and the first back surface of the first IC die and one of the second front surface and second back surface of the second IC die. Other embodiments are disclosed and claimed.

Abstract: An integrated circuit (IC) die includes a plurality of front-side metallization layers including a first front-side metallization layer and one or more additional front-side metallization layers, a plurality of back-side metallization layers formed on the plurality front side metallization layers including a first back-side metallization layer and one or more additional back-side metallization layers, wherein the first front-side metallization layer is proximate to the first back-side metallization layer, and a vertical metallization structure formed through at least the first front-side metallization layer and the first back-side metallization layer, wherein the vertical metallization structure electrically connects a first metallization structure on one of the one or more additional front-side metallization layers to a second metallization structure on one of the one or more additional back-side metallization layers. Other embodiments are disclosed and claimed.

Abstract: An integrated circuit (IC) die includes a plurality of varactor devices, where at least one varactor of the plurality of varactor devices comprises a first electrode, a second electrode, and a multi-layer stack of ferroelectric material (e.g., ferroelectric variable capacitance material) disposed between the first and second electrodes. Other embodiments are disclosed and claimed.

Abstract: An integrated circuit (IC) die includes a first layer with conductive structures formed in a interlayer dielectric (ILD) material, with a portion of the conductive structures at a first surface of the first layer, a self-alignment layer in contact with non-conductive regions at the first surface of the first layer, a second layer with ILD material in contact with the self-alignment layer and the portion of the conductive structures at the first surface of the first layer, and conductive vias through the self-alignment layer and the second layer in contact with the portion of the conductive structures at the first surface of the first layer. The self-alignment layer may include a first material where the self-alignment layer is in contact with the conductive vias and a second material where the self-alignment layer is not in contact with the conductive vias. Other embodiments are disclosed and claimed.

Abstract: A wireless communication system serves a wireless User Equipment (UE) over a wireless network slice. A serving wireless communication network selects a Uniform Data Repository (UDR) in a target wireless communication network based on the wireless network slice. The serving wireless communication network transfers an information request for the wireless UE across a wireless communication network boundary to the selected UDR in the target wireless communication network. In response to the information request, the selected UDR in the target wireless communication network transfers UE information for the wireless UE across the wireless communication network boundary to the serving wireless communication network. The wireless network slice in the serving wireless communication network serves the wireless UE based on the UE information.