Abstract: A multi-chip package structure is provided. The multi-chip package structure includes a first IC chip and a second IC chip, and a fluid conduit thermally coupled to the first IC chip and the second IC chip. The multi-chip package structure is configured to remove heat generated by at least one of the first IC chip and the second IC chip. The fluid conduit has a first end and a second end opposite to the first end. The multi-chip package structure also includes a first monopole feed connected between the first IC chip and the first end of the fluid conduit, and a second monopole feed connected between the second IC chip and the second end of the fluid conduit. The first monopole feed is configured to transmit an electromagnetic signal through the fluid conduit toward the second monopole feed and vice versa.

Abstract: A high-resolution optical spectrometer with multiple diffractive optical elements operates under broadband light and enables spectral splitting with 3D diffractive optical elements. Diffractive optical elements are used to provide concentration of light as well as spectral splitting. Depending on the application, the high-resolution optical spectrometer operates with a reflection or transmission diffractive optical element. The number of operating wavelengths, spectral resolution, and operating bandwidth of diffractive optical elements are flexible depending on application.

Abstract: A nanotube polariton quantum dot photon source device includes a substrate. A nanotube is arranged on the substrate, and an incident light source is configured to generate an exciton-plasmon polariton excitation in the nanotube. The nanotube emits a photon in response to the generated exciton plasmon polariton excitation. The nanotube has a length L < 50 nm to emit one or more photons at a desired frequency.

Abstract: A thermal interface material, a process of forming a thermal interface, the thermal interface including the thermal interface material, and an article of manufacture including the thermal interface material, where the thermal interface material includes polar nanoparticles embedded in one or more carrier materials. The polar nanoparticles may have a diameter of approximately 50-60 nanometers or less, and near-field radiative coupling between the polar nanoparticles. The process of forming the thermal interface including: obtaining the polar nanoparticles; adding the polar nanoparticles to one or more carrier materials to form a carrier mixture, where the polar nanoparticles are embedded in the one or more carrier materials; creating a thermal interface material using the carrier mixture; applying the thermal interface material to a first electronics component and a second electronics component; and compressing the electronics components, where the compressing densely packing the polar nanoparticles.

Abstract: A system to develop a light detection and range determination (LIDAR) application by a rotation of optical elements embedded on a rotating disk in a spherical geometry is provided. The system further enables to conduct a fastest possible spatial scanning mechanically and to determine flight times of light beams by adaptive elements according to a distance and a size of a target region.

Abstract: A circuit board and method of manufacture therefor utilize voltage domain edge plating disposed on at least a portion of one or more edges of a circuit board to electrically couple voltage domain conductive shapes disposed in different conductive layers of the circuit board. By doing so, interconnection of multiple voltage domain conductive shapes in different conductive layers may be facilitated with improved power integrity, while also providing EMI shielding along the edge of the circuit board.

Abstract: A thermal interface material, a process of forming a thermal interface, the thermal interface including the thermal interface material, and an article of manufacture including the thermal interface material, where the thermal interface material includes polar nanoparticles embedded in one or more carrier materials. The polar nanoparticles may have a diameter of approximately 50-60 nanometers or less, and near-field radiative coupling between the polar nanoparticles. The process of forming the thermal interface including: obtaining the polar nanoparticles; adding the polar nanoparticles to one or more carrier materials to form a carrier mixture, where the polar nanoparticles are embedded in the one or more carrier materials; creating a thermal interface material using the carrier mixture; applying the thermal interface material to a first electronics component and a second electronics component; and compressing the electronics components, where the compressing densely packing the polar nanoparticles.

Abstract: A circuit board and method of manufacture therefor utilize voltage domain edge plating disposed on at least a portion of one or more edges of a circuit board to electrically couple voltage domain conductive shapes disposed in different conductive layers of the circuit board. By doing so, interconnection of multiple voltage domain conductive shapes in different conductive layers may be facilitated with improved power integrity, while also providing EMI shielding along the edge of the circuit board.

Abstract: A microscale selective laser sintering (?-SLS) that improves the minimum feature-size resolution of metal additively manufactured parts by up to two orders of magnitude, while still maintaining the throughput of traditional additive manufacturing processes. The microscale selective laser sintering includes, in some embodiments, ultra-fast lasers, a micro-mirror based optical system, nanoscale powders, and a precision spreader mechanism. The micro-SLS system is capable of achieving build rates of at least 1 cm3/hr while achieving a feature-size resolution of approximately 1 ?m. In some embodiments, the exemplified systems and methods facilitate a direct write, microscale selective laser sintering ?-SLS system that is configured to write 3D metal structures having features sizes down to approximately 1 ?m scale on rigid or flexible substrates. The exemplified systems and methods may operate on a variety of material including, for example, polymers, dielectrics, semiconductors, and metals.

Abstract: A microscale selective laser sintering (?-SLS) that improves the minimum feature-size resolution of metal additively manufactured parts by up to two orders of magnitude, while still maintaining the throughput of traditional additive manufacturing processes. The microscale selective laser sintering includes, in some embodiments, ultra-fast lasers, a micro-mirror based optical system, nanoscale powders, and a precision spreader mechanism. The micro-SLS system is capable of achieving build rates of at least 1 cm3/hr while achieving a feature-size resolution of approximately 1 ?m. In some embodiments, the exemplified systems and methods facilitate a direct write, microscale selective laser sintering ?-SLS system that is configured to write 3D metal structures having features sizes down to approximately 1 ?m scale on rigid or flexible substrates. The exemplified systems and methods may operate on a variety of material including, for example, polymers, dielectrics, semiconductors, and metals.

Abstract: Exemplified microscale selective laser sintering (?-SLS or micro-SLS) systems and methods facilitate modeling of the nanoparticle powder bed by simulating the interactions between particles during the powder spreading operation. In particular, the exemplified methods and system use multiscale modeling techniques to accurately predict the formation and mechanical/electrical properties of parts produced by selective laser sintering of powder beds. Discrete element modeling is used for nanoscale particle interactions by implementing the different forces dominant at nanoscale. A heat transfer analysis is used to predict the sintering of individual particles in the powder beds in order to build up a complete structural model of the parts that are being produced by the SLS process.