Patents by Inventor Aniruddha Pal
Aniruddha Pal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230064637Abstract: Exemplary dual-channel showerheads may include an upper plate that defines a first plurality of apertures. The showerheads may include a base having a lower plate. The lower plate may define a second plurality of apertures and a third plurality of apertures. Each of the first plurality of apertures may be fluidly coupled with a respective one of the second plurality of apertures to define a fluid path extending from a top surface of the showerhead through a bottom surface of the showerhead. The base may define a gas inlet that is fluidly coupled with the third plurality of apertures. The base may be detachably coupled with the upper plate using one or more fastening mechanisms. The showerheads may include a compressible gasket positioned between the upper plate and the lower plate.Type: ApplicationFiled: August 23, 2022Publication date: March 2, 2023Applicant: Applied Materials, Inc.Inventors: Kiran Shyam Honnavar, Srikantha Raju, Gangadhar Sheelavant, Aniruddha Pal, Yao-Hung Yang, Basavaraja Shankarappa Kengunti
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Publication number: 20230051800Abstract: Methods and apparatus for producing bulk silicon carbide and producing silicon carbide coatings are provided herein. The method includes feeding a mixture of silicon carbide and ceramic into a plasma sprayer. The plasma generates a stream towards a substrate forming a bulk material or optionally a coating on the substrate such as an article upon contact therewith. In embodiments, the substrate can be removed, leaving a component part fabricated from bulk silicon carbide.Type: ApplicationFiled: January 27, 2021Publication date: February 16, 2023Inventors: YIKAI CHEN, ANIRUDDHA PAL, SAURABH M. CHAUDHARI, YAO-HUNG YANG, SIAMAK SALIMIAN, TOM K. CHO
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Patent number: 11574831Abstract: Examples of the present invention provide an apparatus for transferring substrates and confining a processing environment in a chamber. One example provides a hoop assembly for use in a processing chamber. The hoop assembly includes a confinement ring defining a confinement region therein. A hoop body mates with the confinement ring. The hoop body is slanted to reduce a thickness across a diameter of the hoop body. Three or more lifting fingers are attached to the hoop body and extend downwards. Each of the three or more lifting fingers has a contact tip positioned radially inward from the hoop body to form a substrate support surface below and spaced apart from the confinement region.Type: GrantFiled: September 10, 2020Date of Patent: February 7, 2023Assignee: Applied Materials, Inc.Inventors: Jared Ahmad Lee, Martin Jeffrey Salinas, Paul B. Reuter, Imad Yousif, Aniruddha Pal
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Patent number: 11359722Abstract: A sealing member is provided, including a plurality of nodes and a plurality of antinodes. Each sealing member can be rotated to expose nondamaged lobes for sealing, and prevents the sealing member from falling out of the lobed groove. A chamber is provided, including a groove that the sealing member is placed in. A method of rotating and placing the sealing member is provided, including a rotation to expose nondamaged portions of the sealing member.Type: GrantFiled: July 19, 2019Date of Patent: June 14, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Shagun P. Maheshwari, Yao-Hung Yang, King F. Lee, Andrew Yu, Aniruddha Pal, Tom K. Cho, Chien-Min Liao
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Patent number: 11177136Abstract: Embodiments of the present invention provide a dual load lock chamber capable of processing a substrate. In one embodiment, the dual load lock chamber includes a chamber body defining a first chamber volume and a second chamber volume isolated from one another. Each of the lower and second chamber volumes is selectively connectable to two processing environments through two openings configured for substrate transferring. The dual load lock chamber also includes a heated substrate support assembly disposed in the second chamber volume. The heated substrate support assembly is configured to support and heat a substrate thereon. The dual load lock chamber also includes a remote plasma source connected to the second chamber volume for supplying a plasma to the second chamber volume.Type: GrantFiled: September 26, 2019Date of Patent: November 16, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Jared Ahmad Lee, Martin Jeffrey Salinas, Paul B. Reuter, Imad Yousif, Aniruddha Pal
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Patent number: 11171008Abstract: Embodiments of the present invention provide a dual load lock chamber capable of processing a substrate. In one embodiment, the dual load lock chamber includes a chamber body defining a first chamber volume and a second chamber volume isolated from one another. Each of the lower and second chamber volumes is selectively connectable to two processing environments through two openings configured for substrate transferring. The dual load lock chamber also includes a heated substrate support assembly disposed in the second chamber volume. The heated substrate support assembly is configured to support and heat a substrate thereon. The dual load lock chamber also includes a remote plasma source connected to the second chamber volume for supplying a plasma to the second chamber volume.Type: GrantFiled: December 17, 2019Date of Patent: November 9, 2021Assignee: Applied Materials, Inc.Inventors: Jared Ahmad Lee, Martin Jeffrey Salinas, Paul B. Reuter, Imad Yousif, Aniruddha Pal
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Patent number: 11090893Abstract: A method of reclaiming a used seal includes boiling the used seal in a liquid, and after boiling the used seal in the liquid, baking the used seal. The boiling the used seal may include boiling for a predetermined boiling time in the liquid, and the baking the used seal may include baking the used seal for a predetermined bake time at a predetermined temperature.Type: GrantFiled: September 6, 2018Date of Patent: August 17, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Shagun P. Maheshwari, Yao-Hung Yang, Tom K. Cho, Yu-Chi Yeh, Andrew Yu, Aniruddha Pal, Siamak Salimian
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Patent number: 10991552Abstract: Embodiments of the invention generally provide a cooling mechanism utilized in a plasma reactor that may provide efficient temperature control during a plasma process. In one embodiment, a cooling mechanism disposed in a plasma processing apparatus includes a coil antenna enclosure formed in a processing chamber, a coil antenna assembly disposed in the coil antenna enclosure, a plurality of air circulating elements disposed in the coil antenna enclosure adjacent to the coil antenna assembly, and a baffle plate disposed in the coil antenna enclosure below and adjacent to the coil antenna assembly.Type: GrantFiled: February 26, 2019Date of Patent: April 27, 2021Assignee: Applied Materials, Inc.Inventors: Aniruddha Pal, Victor Calderon, Martin Jeffrey Salinas, Valentin N. Todorow
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Publication number: 20200411350Abstract: Examples of the present invention provide an apparatus for transferring substrates and confining a processing environment in a chamber. One example provides a hoop assembly for use in a processing chamber. The hoop assembly includes a confinement ring defining a confinement region therein. A hoop body mates with the confinement ring. The hoop body is slanted to reduce a thickness across a diameter of the hoop body. Three or more lifting fingers are attached to the hoop body and extend downwards. Each of the three or more lifting fingers has a contact tip positioned radially inward from the hoop body to form a substrate support surface below and spaced apart from the confinement region.Type: ApplicationFiled: September 10, 2020Publication date: December 31, 2020Inventors: Jared Ahmad LEE, Martin Jeffrey SALINAS, Paul B. REUTER, Imad YOUSIF, Aniruddha PAL
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Publication number: 20200126802Abstract: Embodiments of the present invention provide a dual load lock chamber capable of processing a substrate. In one embodiment, the dual load lock chamber includes a chamber body defining a first chamber volume and a second chamber volume isolated from one another. Each of the lower and second chamber volumes is selectively connectable to two processing environments through two openings configured for substrate transferring. The dual load lock chamber also includes a heated substrate support assembly disposed in the second chamber volume. The heated substrate support assembly is configured to support and heat a substrate thereon. The dual load lock chamber also includes a remote plasma source connected to the second chamber volume for supplying a plasma to the second chamber volume.Type: ApplicationFiled: December 17, 2019Publication date: April 23, 2020Inventors: Jared Ahmad LEE, Martin Jeffrey Salinas, Paul B. Reuter, Imad Yousif, Aniruddha Pal
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Publication number: 20200079044Abstract: A method of reclaiming a used seal includes boiling the used seal in a liquid, and after boiling the used seal in the liquid, baking the used seal. The boiling the used seal may include boiling for a predetermined boiling time in the liquid, and the baking the used seal may include baking the used seal for a predetermined bake time at a predetermined temperature.Type: ApplicationFiled: September 6, 2018Publication date: March 12, 2020Inventors: Shagun P. MAHESHWARI, Yao-Hung YANG, Tom K. CHO, Yu-Chi YEH, Andrew YU, Aniruddha PAL, Siamak SALIMIAN
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Publication number: 20200066563Abstract: Embodiments of the present invention provide an apparatus for transferring substrates and confining a processing environment in a chamber. One embodiment of the present invention provides a hoop assembly for using a processing chamber. The hoop assembly includes a confinement ring defining a confinement region therein, and three or more lifting fingers attached to the hoop. The three or more lifting fingers are configured to support a substrate outside the inner volume of the confinement ring.Type: ApplicationFiled: November 4, 2019Publication date: February 27, 2020Inventors: Jared Ahmad LEE, Martin Jeff SALINAS, Paul B. REUTER, Imad YOUSIF, Aniruddha PAL
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Publication number: 20200025292Abstract: A sealing member is provided, including a plurality of nodes and a plurality of antinodes. Each sealing member can be rotated to expose non-damaged lobes for sealing, and prevents the sealing member from falling out of the lobed groove. A chamber is provided, including a groove that the sealing member is placed in. A method of rotating and placing the sealing member is provided, including a rotation to expose nondamaged portions of the sealing member.Type: ApplicationFiled: July 19, 2019Publication date: January 23, 2020Inventors: Shagun P. MAHESHWARI, Yao-Hung YANG, King F. LEE, Andrew YU, Aniruddha PAL, Tom K. CHO, Chien-Min LIAO
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Publication number: 20200027742Abstract: Embodiments of the present invention provide a dual load lock chamber capable of processing a substrate. In one embodiment, the dual load lock chamber includes a chamber body defining a first chamber volume and a second chamber volume isolated from one another. Each of the lower and second chamber volumes is selectively connectable to two processing environments through two openings configured for substrate transferring. The dual load lock chamber also includes a heated substrate support assembly disposed in the second chamber volume. The heated substrate support assembly is configured to support and heat a substrate thereon. The dual load lock chamber also includes a remote plasma source connected to the second chamber volume for supplying a plasma to the second chamber volume.Type: ApplicationFiled: September 26, 2019Publication date: January 23, 2020Inventors: Jared Ahmad LEE, Martin Jeffrey SALINAS, Paul B. REUTER, Imad YOUSIF, Aniruddha PAL
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Patent number: 10468282Abstract: Embodiments of the present invention provide an apparatus for transferring substrates and confining a processing environment in a chamber. One embodiment of the present invention provides a hoop assembly for using a processing chamber. The hoop assembly includes a confinement ring defining a confinement region therein, and three or more lifting fingers attached to the hoop. The three or more lifting fingers are configured to support a substrate outside the inner volume of the confinement ring.Type: GrantFiled: April 26, 2018Date of Patent: November 5, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Jared Ahmad Lee, Martin Jeff Salinas, Paul B. Reuter, Imad Yousif, Aniruddha Pal
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Patent number: 10453694Abstract: Embodiments of the present invention provide a dual load lock chamber capable of processing a substrate. In one embodiment, the dual load lock chamber includes a chamber body defining a first chamber volume and a second chamber volume isolated from one another. Each of the lower and second chamber volumes is selectively connectable to two processing environments through two openings configured for substrate transferring. The dual load lock chamber also includes a heated substrate support assembly disposed in the second chamber volume. The heated substrate support assembly is configured to support and heat a substrate thereon. The dual load lock chamber also includes a remote plasma source connected to the second chamber volume for supplying a plasma to the second chamber volume.Type: GrantFiled: February 29, 2012Date of Patent: October 22, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Jared Ahmad Lee, Martin Jeffrey Salinas, Paul B. Reuter, Imad Yousif, Aniruddha Pal
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Publication number: 20190198295Abstract: Embodiments of the invention generally provide a cooling mechanism utilized in a plasma reactor that may provide efficient temperature control during a plasma process. In one embodiment, a cooling mechanism disposed in a plasma processing apparatus includes a coil antenna enclosure formed in a processing chamber, a coil antenna assembly disposed in the coil antenna enclosure, a plurality of air circulating elements disposed in the coil antenna enclosure adjacent to the coil antenna assembly, and a baffle plate disposed in the coil antenna enclosure below and adjacent to the coil antenna assembly.Type: ApplicationFiled: February 26, 2019Publication date: June 27, 2019Inventors: Aniruddha PAL, Victor CALDERON, Martin Jeffrey SALINAS, Valentin N. TODOROW
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Patent number: 10249475Abstract: Embodiments of the invention generally provide a cooling mechanism utilized in a plasma reactor that may provide efficient temperature control during a plasma process. In one embodiment, a cooling mechanism disposed in a plasma processing apparatus includes a coil antenna enclosure formed in a processing chamber, a coil antenna assembly disposed in the coil antenna enclosure, a plurality of air circulating elements disposed in the coil antenna enclosure adjacent to the coil antenna assembly, and a baffle plate disposed in the coil antenna enclosure below and adjacent to the coil antenna assembly.Type: GrantFiled: April 1, 2014Date of Patent: April 2, 2019Assignee: Applied Materials, Inc.Inventors: Aniruddha Pal, Victor Calderon, Martin Jeffrey Salinas, Valentin N. Todorow
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Patent number: 10204805Abstract: The present disclosure relates to an apparatus for heating and supporting a substrate in a processing chamber. A substrate support assembly includes a heated plate having a substrate supporting surface on a front side and a cantilever arm extending from a backside of the heated plate. The heated plate is configured to support and heat a substrate on the substrate supporting surface. The cantilever arm has a first end attached to the heated plate near a central axis of the heated plate, and a second end extending radially outwards from the central axis.Type: GrantFiled: July 28, 2016Date of Patent: February 12, 2019Assignee: Applied Materials, Inc.Inventors: Imad Yousif, Martin Jeffrey Salinas, Paul B. Reuter, Aniruddha Pal, Jared Ahmad Lee
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Patent number: D1027120Type: GrantFiled: December 17, 2020Date of Patent: May 14, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Yao-Hung Yang, Eric Ruhland, Saurabh M. Chaudhari, Dien-Yeh Wu, Philip Wayne Nagle, Aniruddha Pal, Sudhir R. Gondhalekar, Siamak Salimian, Scott Lin, Boon Sen Chan