Patents by Inventor Aniruddha Upadhye

Aniruddha Upadhye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EX VIVO METHOD OF MANUFACTURING A WIRE STRUCTURE ELECTRODE
    Publication number: 20250242153
    Abstract: An injectable wire structure electrode can assimilate with surrounding tissues after injection, inducing in-growth of blood vessels, collagen and other tissue. Assimilation secures the electrode to the tissue without sutures and prevents relative motion which can lead to inflammation and scarring. Associated methods of manufacturing and injection are disclosed, as well as systems including a dermal multiplexer for power delivery.
    Type: Application
    Filed: March 27, 2025
    Publication date: July 31, 2025
    Applicant: NEURONOFF, INC.
    Inventors: Manfred Franke, Shaher Ahmad, Stephan Nieuwoudt, Amelia Howe, Aniruddha Upadhye, Emily Szabo, Derrick Liu, Sean Zuckermann, Craig Watson
  • Ex vivo method of manufacturing a wire structure electrode
    Patent number: 12285601
    Abstract: An injectable wire structure electrode can assimilate with surrounding tissues after injection, inducing in-growth of blood vessels, collagen and other tissue. Assimilation secures the electrode to the tissue without sutures and prevents relative motion which can lead to inflammation and scarring. Associated methods of manufacturing and injection are disclosed, as well as systems including a dermal multiplexer for power delivery.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: April 29, 2025
    Assignee: Neuronoff, Inc.
    Inventors: Manfred Franke, Shaher Ahmad, Stephan Nieuwoudt, Amelia Howe, Aniruddha Upadhye, Emily Szabo, Derrick Liu, Sean Zuckermann, Craig Watson
  • ULTRATHIN AND FLEXIBLE DEVICES INCLUDING CIRCUIT DIES
    Publication number: 20210319955
    Abstract: Ultrathin and flexible electrical devices including circuit dies such as, for example, a capacitor chip, a resistor chip, and/or an inductor chip, and methods of making and using the same are provided. Circuit dies are attached to a major surface of a flexible substrate having channels Electrically conductive traces are formed in the channels, self-aligned with the circuit dies, and in direct contact with the bottom surface of the circuit dies.
    Type: Application
    Filed: May 16, 2019
    Publication date: October 14, 2021
    Inventors: Ankit Mahajan, Saagar A. Shah, Mikhail L. Pekurovsky, Thomas J. Metzler, Kayla C. Niccum, Eric A. Vandre, Aniruddha Upadhye, Robert R. Owings, Jeremy K. Larsen, Zohaib Hameed