Patents by Inventor Anirudh Bhat

Anirudh Bhat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package comprising a block device with a shield and method of fabricating the same
    Patent number: 11985804
    Abstract: A package that includes a substrate, a first integrated device coupled to the substrate, a first block device coupled to the substrate, a second encapsulation layer encapsulating the first integrated device and the first block device. The first block device includes a first electrical component, a second electrical component, a first encapsulation layer at least partially encapsulating the first electrical component and the second electrical component, and a first metal layer coupled to the first encapsulation layer.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: May 14, 2024
    Assignee: QUALCOMM INCORPORATED
    Inventors: Anirudh Bhat, Jay Scott Salmon
  • MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNETIC ISOLATION (EMI) SHIELD STRUCTURES AND RELATED METHODS
    Publication number: 20240021538
    Abstract: Multi-component modules (MCMs), including configurable electromagnetic interference (EMI) shield structures and related methods, are disclosed. An EMI shield enclosing an IC or another electrical component in an MCM can protect other components within the MCM from EMI generated by the enclosed component. The EMI shield also protects the enclosed component from the EMI generated by other electrical components. An EMI shield with sidewall structures, in which vertical conductors supported by a wall medium electrically couple a lid of the EMI shield to a ground layer in a substrate, provides configurable EMI protection in an MCM. The EMI shield may also be employed to increase heat dissipation. The sidewall structures of the EMI shield are disposed on one or more sides of an electrical component and are configurable to provide a desired level of EMI isolation.
    Type: Application
    Filed: July 21, 2023
    Publication date: January 18, 2024
    Inventors: Jay Scott Salmon, Anirudh Bhat
  • Multi-component modules (MCMs) including configurable electro-magnetic isolation (EMI) shield structures, and related methods
    Patent number: 11721639
    Abstract: Multi-component modules (MCMs) including configurable electromagnetic interference (EMI) shield structures, and related methods are disclosed. An EMI shield enclosing an IC or another electrical component in an MCM can protect other components within the MCM from EMI generated by the enclosed component. The EMI shield also protects the enclosed component from the EMI generated by other electrical components. An EMI shield with side-wall structures, in which vertical conductors supported by a wall medium electrically couple a lid of the EMI shield to a ground layer in a substrate, provides configurable EMI protection in an MCM. The EMI shield may also be employed to increase heat dissipation. The side-wall structures of the EMI shield are disposed on one or more sides of an electrical component and are configurable to provide a desired level of EMI isolation.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: August 8, 2023
    Assignee: QUALCOMM INCORPORATED
    Inventors: Jay Scott Salmon, Anirudh Bhat
  • PACKAGE COMPRISING A SUBSTRATE WITH A PAD INTERCONNECT COMPRISING A PROTRUSION
    Publication number: 20230070275
    Abstract: A package that includes a substrate and an integrated device coupled to the substrate. The substrate includes at least one dielectric layer and a plurality of interconnects comprising a first pad interconnect. The first pad interconnect comprises a first portion comprising a first width and a second portion comprising a second width that is different than the first width.
    Type: Application
    Filed: September 9, 2021
    Publication date: March 9, 2023
    Inventors: Anirudh BHAT, Yuling NIU, Jay Scott SALMON
  • PACKAGE COMPRISING A BLOCK DEVICE WITH A SHIELD
    Publication number: 20230023868
    Abstract: A package that includes a substrate, a first integrated device coupled to the substrate, a first block device coupled to the substrate, a second encapsulation layer encapsulating the first integrated device and the first block device. The first block device includes a first electrical component, a second electrical component, a first encapsulation layer at least partially encapsulating the first electrical component and the second electrical component, and a first metal layer coupled to the first encapsulation layer.
    Type: Application
    Filed: July 22, 2021
    Publication date: January 26, 2023
    Inventors: Anirudh BHAT, Jay Scott SALMON
  • MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTRO-MAGNETIC ISOLATION (EMI) SHIELD STRUCTURES, AND RELATED METHODS
    Publication number: 20210407927
    Abstract: Multi-component modules (MCMs) including configurable electromagnetic interference (EMI) shield structures, and related methods are disclosed. An EMI shield enclosing an IC or another electrical component in an MCM can protect other components within the MCM from EMI generated by the enclosed component. The EMI shield also protects the enclosed component from the EMI generated by other electrical components. An EMI shield with side-wall structures, in which vertical conductors supported by a wall medium electrically couple a lid of the EMI shield to a ground layer in a substrate, provides configurable EMI protection in an MCM. The EMI shield may also be employed to increase heat dissipation. The side-wall structures of the EMI shield are disposed on one or more sides of an electrical component and are configurable to provide a desired level of EMI isolation.
    Type: Application
    Filed: June 2, 2021
    Publication date: December 30, 2021
    Inventors: Jay Scott Salmon, Anirudh Bhat