Patents by Inventor Anis Fauzi Abdul Aziz

Anis Fauzi Abdul Aziz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Making a flat no-lead package with exposed electroplated side lead surfaces
    Patent number: 11348806
    Abstract: A method of making Flat No-Lead Packages with plated lead surfaces exposed on lateral faces thereof. The method includes providing a plurality of Flat No-Lead Packages having severed, unplated lead surfaces exposed on lateral faces thereof and having plated lead surfaces exposed on bottom faces thereof. The method further includes batch electroplating the severed unplated lead surfaces of the plurality of Flat No-Lead Packages.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: May 31, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Lee Han Meng@ Eugene Lee, Shu Hui Ooi, Anis Fauzi Abdul Aziz, Wei Fen Sueann Lim
  • MAKING A FLAT NO-LEAD PACKAGE WITH EXPOSED ELECTROPLATED SIDE LEAD SURFACES
    Publication number: 20160181122
    Abstract: A method of making Flat No-Lead Packages with plated lead surfaces exposed on lateral faces thereof. The method includes providing a plurality of Flat No-Lead Packages having severed, unplated lead surfaces exposed on lateral faces thereof and having plated lead surfaces exposed on bottom faces thereof. The method further includes batch electroplating the severed unplated lead surfaces of the plurality of Flat No-Lead Packages.
    Type: Application
    Filed: December 23, 2014
    Publication date: June 23, 2016
    Inventors: Lee Han Meng@ Eugene Lee, Shu Hui Ooi, Anis Fauzi Abdul Aziz, Sueann Lim Wei Fen
  • Integrated circuit package
    Patent number: 9029990
    Abstract: An integrated circuit (IC) package including a bottom leadframe, an interposer mounted on the bottom leadframe, a flipchip die mounted on the interposer and a top leadframe electrically connected to the interposer. Also, a method of making an integrated circuit (IC) package including electrically and physically attaching a die to an interposer, attaching the interposer to a bottom leadframe, attaching a discrete circuit component to the interposer and attaching a top leadframe to the bottom leadframe.
    Type: Grant
    Filed: January 4, 2013
    Date of Patent: May 12, 2015
    Assignee: Texas Instruments Incorporated
    Inventors: Lee Hang Meng@Eugene Lee, Anis Fauzi Abdul Aziz, Yien Sien Khoo
  • INTEGRATED CIRCUIT PACKAGE
    Publication number: 20140191378
    Abstract: An integrated circuit (IC) package including a bottom leadframe, an interposer mounted on the bottom leadframe, a flipchip die mounted on the interposer and a top leadframe electrically connected to the interposer. Also, a method of making an integrated circuit (IC) package including electrically and physically attaching a die to an interposer, attaching the interposer to a bottom leadframe, attaching a discrete circuit component to the interposer and attaching a top leadframe to the bottom leadframe.
    Type: Application
    Filed: January 4, 2013
    Publication date: July 10, 2014
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Han Meng@Eugene Lee Lee, Anis Fauzi Abdul Aziz, Yien Sien Khoo