Patents by Inventor Anish Khan

Anish Khan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11441029
    Abstract: A packaging film is provided. The packaging film includes a polymer matrix composed of poly (butylene succinate) (PBS), and a modified tapioca starch (TPS), where a weight ratio (w/w) of the PBS to the TPS is in a range of 3:2 to 2:3. The packaging film also includes an antimicrobial composite including an organometallic compound dispersed within the polymer matrix. The packaging film has a water vapor permeability in a range of 94,000-95,000 micrometer gram per second per square meter per pascal (g·?m/m2·s·Pa). A method to prepare the packaging film is also disclosed. The packaging films of the present disclosure prevent or inhibit the growth of gram-positive bacteria and gram-negative bacteria, particularly on food surfaces.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: September 13, 2022
    Assignee: KING ABDULAZIZ UNIVERSITY
    Inventors: Anish Khan, Abdullah M Asiri, Tehseen Kamal, Mohammad Jawaid, Aziman Nurain
  • Patent number: 11413795
    Abstract: A method of making a composite laminate includes dequilling chicken feathers to form chicken feather fibers (CFFs). The CFFs and Ceiba Pentandra bark fibers (CPFs) are milled to form milled CFFs and milled CPFs so that the milled CFFs have a length of smaller than 200 microns and the milled CPFs have a length of smaller than 600 microns. The CFFs are treated with an amine compatibilizer to esterify carboxy groups present on keratin in the CFFs. A mixture of an epoxy resin, the milled CFFs, and the milled CPFs is solution cast to form an epoxy composite. A first carbon fabric layer and a second carbon fabric layer are placed on a front side and a backside, respectively, of the epoxy composite to form an epoxy laminate precursor. The epoxy laminate precursor is compression molded to cure the epoxy laminate precursor to form the composite laminate.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: August 16, 2022
    Assignee: King Abdulaziz University
    Inventors: Anish Khan, Abdullah Mohamed Asiri, Sanjay Mavinkere Rangappa