Patents by Inventor Anja Haase

Anja Haase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084368
    Abstract: A film composite folded from a single film to form a plurality of layered film layers (1) and comprising microfluidic structures (5) in different planes, wherein the microfluidic structures are formed by film layers having embossed recesses covered by the respective film layer adjacent in the layering direction, and wherein microfluidic structures of one plane are connected to microfluidic structures of another plane via through-holes in at least one film layer; a method for producing the film composite; and the use of the film composite.
    Type: Application
    Filed: February 17, 2022
    Publication date: March 14, 2024
    Applicant: Joanneum Research Forschungsgesellschaft mbH
    Inventors: Barbara Stadlober, Jan Hesse, Anja Haase, Christian Wolf
  • Patent number: 8017937
    Abstract: The invention relates to a semiconductor component having a metal-insulator structure (MIS) which contains as basic components a substrate, a layer made of an organic semiconductor material and a dielectric layer as insulator. The substrate and/or the dielectric layer made of an inorganic-organic hybrid polymer is chosen from these basic components. In addition, the invention relates to a method for the production of semiconductor components of this type and also to the use of inorganic-organic hybrid polymers for the production of semiconductor components.
    Type: Grant
    Filed: October 21, 2005
    Date of Patent: September 13, 2011
    Assignees: Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V., Joanneum Research ForSchungsgesellschaft MBH
    Inventors: Ruth Houbertz-Krauss, Angelika Schmitt, Gerhard Domann, Michael Popall, Barbara Stadlober, Ursula Haas, Anja Haase
  • Publication number: 20080073642
    Abstract: The invention relates to a semiconductor component having a metal-insulator structure (MIS) which contains as basic components a substrate, a layer made of an organic semiconductor material and a dielectric layer as insulator. The substrate and/or the dielectric layer made of an inorganic-organic hybrid polymer is chosen from these basic components. In addition, the invention relates to a method for the production of semiconductor components of this type and also to the use of inorganic-organic hybrid polymers for the production of semiconductor components.
    Type: Application
    Filed: October 21, 2005
    Publication date: March 27, 2008
    Applicants: FRAUNHOFER-GESELLSCHAFT ZUR FORdERUNG DER ANGEWANDTEN FORSCHUNG E.V., JOANNEUM RESEARCH FORSCHUNGSGESELLSCHAFT MBH
    Inventors: Ruth Houbertz-Krauss, Angelika Schmitt, Gerhard Domann, Michael Popall, Barbara Stadlober, Ursula Haas, Anja Haase