Abstract: The present invention is directed to an electrically conductive composition comprising: a) a resin component comprising: 1) a first epoxy resin; and, 2) a second epoxy resin and/or a functionalised polybutadiene resin and/or a functionalised butadiene-acrylonitrile copolymer; b) a curative for epoxy resin; c) an electrically conductive filler; d) a one core shell rubber toughener; and, e) a reactive diluent component comprising 1) a monofunctional epoxy diluent and/or 2) a polyfunctional epoxy diluent; wherein said composition further comprises a curing agent if said functionalised polybutadiene resin is present in said resin component.

Abstract: The present invention relates to an electrically conductive, room temperature stable, one-component (1K) epoxy adhesive composition comprising: a) an epoxy resin; b) at least one ionic constituent as a catalyst for epoxy homo-polymerization; c) electrically conductive particles; and, d) inorganic particles selected from the group consisting of barium sulphate (BaSO4), magnesium hydroxide (Mg(OH)2), aluminium hydroxide (Al(OH)3), zinc oxide (ZnO), zinc hydroxide (Zn(OH)2), titanium dioxide (TiO2), iron oxide and mixtures thereof.

Abstract: The present invention relates to an electrically conductive composition comprising a silicone resin comprising at least one vinyl-group; a silicone cross-linker having at least one Si—H group; electrically conductive particles; a solvent; an adhesion promoter; a catalyst; and an inhibitor, wherein ratio between Si—H groups and vinyl-groups is equal or greater than 1.3 but equal or less than 10.

Abstract: The present invention relates to a conductive paste composition for solar photovoltaic cells comprising metal particles dispersed in a suitable carrier therefor, wherein said carrier comprises a solvent and a resin, and wherein at least a portion of said metal particles are characterized by having a ? value, as defined by X-ray diffraction<0.0020, having at least 50% degree of crystallinity, and being anisotropic with respect to crystallographic direction.

Abstract: The present invention relates to an electrically conductive composition comprising a) a resin selected from the group consisting of epoxy (meth)acrylate, (poly)ester (meth)acrylate, urethane (meth)acrylate, silicone (meth)acrylate, poly(iso)butylene (meth)acrylate, (poly)isoprene (meth)acrylate, polybutylene (meth)acrylate and mixtures thereof; b) an acrylic monomer; c) an electrically conductive filler; and d) a curing agent. The composition is particularly suitable for use in a solar cell and/or a photovoltaic module, especially in the photovoltaic module, wherein the solar cells are shingled.

Abstract: The present invention relates to a process of forming electrical conductor on a substrate comprising the steps of a) providing a substrate; b) providing an electrically conductive composition; c) applying said electrically conductive composition to at least one part of said substrate; and d) exposing said electrically conductive composition on the substrate to a near infrared light to form an electrical conductor. NIR light cure provides improved electrical properties of the cured composition without damaging heat sensitive substrates.

Abstract: The present disclosure relates to a method for curing a heat-curable material (1) in an embedded curing zone (2) and an assembly resulting from such method. The method comprises providing a heat-conducting strip (3) partially arranged between a component (9) and a substrate (10) that form the embedded curing zone (2) therein between. The heat-conducting strip (3) extends from the embedded curing zone (2) to a radiation-accessible zone (7) that is distanced from the embedded curing zone (2) and at least partially free of the component (9) and the substrate (10). The method further comprises irradiating the heat-conducting strip (3) in the radiation-accessible zone (7) by means of electromagnetic radiation (6).

Abstract: The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, solar cells and/or solar modules. The adhesives comprise at least one resin component, at least one nitrogen-containing curative, at least one low melting point metal filler, and optionally at least one electrically conductive filler, which is different from the metal filler.

Abstract: The present invention relates to a process of forming electrical conductor on a substrate comprising the steps of a) providing a substrate; b) providing an electrically conductive composition; c) applying said electrically conductive composition to at least one part of said substrate; and d) exposing said electrically conductive composition on the substrate to a near infrared light to form an electrical conductor. NIR light cure provides improved electrical properties of the cured composition without damaging heat sensitive substrates.

Abstract: The present invention is directed to an electrically conductive composition for use in the preparation of an electrically conductive network, said composition comprising, based on the total weight of the composition: a) from 75 to 98 wt. % of a silver powder having a tap density of at least 4.0 g/cm3 and a specific surface area of less than 1.5 m2/g; b) from 1 to 10 wt. % of a binder resin; c) from 0 to 5 wt. % of a hardener; and, d) from 0 to 10 wt. % of solvent, wherein said composition is characterized in that, when heated to a temperature at which the silver powder starts to sinter, the binder resin is not yet fully cured or fully solidified.

Abstract: The present invention relates to a conductive paste composition for solar photovoltaic cells comprising metal particles dispersed in a suitable carrier therefor, wherein said carrier comprises a solvent and a resin, and wherein at least a portion of said metal particles are characterized by having a ? value, as defined by X-ray diffraction <0.0020, having at least 50% degree of crystallinity, and being anisotropic with respect to crystallographic direction.

Abstract: The present invention relates to curable compositions that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The curable compositions comprise a) one or more curable resins; b) composite particles, which comprise i) an electrically conductive core, and ii) an electrically conductive shell, comprising one or more shell materials each selected from the group consisting of metal carbides, metal sulfides, metal borides, metal silicides, and metal nitrides; and c) electrically conductive particles different from component b). The present invention further relates to a method of bonding a first substrate to a second substrate, wherein the substrates are bonded under heat and pressure using said curable composition.

Abstract: The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The adhesive of the present invention comprises one or more epoxy resins, silver-coated particles having a silver content of 2 to 30 wt.-%, based on the total amount of the silver-coated particles, and one or more amine-epoxy adducts, comprising one or more functional groups, each derived from an alkyl-substituted nitrogen-containing heterocycle.

Abstract: Provided herein are sinterable metal particles and compositions containing same. Such compositions can be used in a variety of ways, i.e., by replacing solders as die attach materials. The resulting sintered compositions are useful as a replacement for solder in conventional semiconductor assembly, and provide enhanced thermal and electrical conductivity in high power devices. Thus, invention compositions provide an alternative to nano-particulate metals that must be subjected to mechanical force during cure.

Abstract: The present invention relates to compositions that are suitable for use as electrically conductive inks in the fabrication of electronic devices, such as c-Si solar modules. The electrically conductive ink comprises a) one or more aromatic resins; b) electrically conductive silver particles having an average particle size of 1 ?m to 40 ?M, and a tap density of 1.5 g/cm3 to 6.5 g/cm3; and c) one or more organic solvents. The present invention further relates to a method of forming an electrically conductive pathway on a substrate and to a method of forming a bonded assembly using said electrically conductive ink.

Abstract: The present disclosure relates to a method for curing a heat-curable material (1) in an embedded curing zone (2) and an assembly resulting from such method. The method comprises providing a heat-conducting strip (3) partially arranged between a component (9) and a substrate (10) that form the embedded curing zone (2) therein between. The heat-conducting strip (3) extends from the embedded curing zone (2) to a radiation-accessible zone (7) that is distanced from the embedded curing zone (2) and at least partially free of the component (9) and the substrate (10). The method further comprises irradiating the heat-conducting strip (3) in the radiation-accessible zone (7) by means of electromagnetic radiation (6).

Abstract: The present invention relates to curable compositions that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The curable compositions comprise a) one or more curable resins; b) composite particles, which comprise i) an electrically conductive core, and ii) an electrically conductive shell, comprising one or more shell materials each selected from the group consisting of metal carbides, metal sulfides, metal borides, metal silicides, and metal nitrides; and c) electrically conductive particles different from component b). The present invention further relates to a method of bonding a first substrate to a second substrate, wherein the substrates are bonded under heat and pressure using said curable composition.

Abstract: The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The adhesive of the present invention comprises one or more epoxy resins, silver-coated particles having a silver content of 2 to 30 wt.-%, based on the total amount of the silver-coated particles, and one or more amine-epoxy adducts, comprising one or more functional groups, each derived from an alkyl-substituted nitrogen-containing heterocycle.

Abstract: The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, solar cells and/or solar modules. The adhesives comprise at least one resin component, at least one nitrogen-containing curative, at least one low melting point metal filler, and optionally at least one electrically conductive filler, which is different from the metal filler.

Abstract: A technique is described for the preparation of polymers according to a process in which the starting compound of formula (I) is polymerized in the presence of a base in an organic solvent. No end chain controlling agents are required during the polymerization to obtain soluble precursor polymers. The precursor polymer such obtained comprises structural units of the formula (II). In a next step, the precursor polymer (II) is subjected to a conversion reaction towards a soluble or insoluble conjugated polymer by thermal treatment. The arylene or heteroarylene polymer comprises structural units of the formula III. In this process the dithiocarbamate group acts as a leaving group and permits the formation of a precursor polymer of structural formula (II), which has an average molecular weight from 5000 to 1000000 Dalton and is soluble in common organic solvents. The precursor polymer with structural units of formula (II) is thermally converted to the conjugated polymer with structural formula (III).