Patents by Inventor Anja Kies

Anja Kies has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230296330
    Abstract: A stacked disc heat exchanger for a thermal management module may include a plurality of stacked discs arranged following one another in a stacking direction. Each stacked disc of the plurality of stacked discs may include a bottom extending transversely to the stacking direction. An outermost disc of the plurality of stacked discs in the stacking direction defining a cover disc. The cover disc may include at least one convexity formed in the stacking direction towards an outside. The at least one convexity may extend transversely to the stacking direction and may form a channel for a flow path extending through the stacked disc heat exchanger of a fluid. The cover disc may further include at least one opening that is open in the stacking direction towards the outside for fluidic connection with the thermal management module.
    Type: Application
    Filed: March 20, 2023
    Publication date: September 21, 2023
    Inventors: Timo Feldkeller, Anja Kies
  • Publication number: 20230102168
    Abstract: A thermal management module for a thermal management system is disclosed. The thermal management module includes a first heat exchanger for flowing through by a refrigerant and by a working medium fluidically separately with respect to the refrigerant. A second heat exchanger is provided including at least a first fluid path and at least a second fluid path, separate from the first fluid path, respectively for flowing through by the refrigerant. A connecting arrangement is arranged between the first heat exchanger and the second heat exchanger. The connecting arrangement connects the first heat exchanger and the second heat exchanger to one another mechanically and fluidically, so that the refrigerant can flow between the first heat exchanger and the second heat exchanger.
    Type: Application
    Filed: September 27, 2022
    Publication date: March 30, 2023
    Inventors: Dominik Behnert, Andreas Draenkow, Timo Feldkeller, Falk Humboldt, Anja Kies, Michael Schmidt