Abstract: This disclosure describes systems, methods, and devices related to optical proximity corrections to an integrated circuit photomask. A method may include identifying a first contour of a first adjacent polygon of a photomask predicted for a first polygon of an integrated circuit, the first contour excluding a first corner formed by a first edge and a second edge of the first polygon; identifying a second contour of a second adjacent polygon of a photomask predicted for a second polygon of the integrated circuit, the second contour excluding a second corner formed by a third edge and a fourth edge of the second polygon; generating a fast contour prediction based on corner rounding associated with the first contour and the second contour; and generating, based on the fast contour prediction, a minimum distance between the first contour and the second contour, the minimum distance associated with the optical proximity corrections.

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to adjust vias in integrated circuits (ICs) based on machine learning (ML). An example apparatus computes a dimension by which to extend a via based on at least one of a first metal wire in a first layer of the IC above the via, a via-to-via patterning constraint, or a via-to-metal shorting constraint for a second layer of the IC below the via. The example apparatus also computes a shifted position of the via based on at least one of (a) the dimension or (b) a width and a position of a second metal wire below the via, the width and the position predicted by an ML model. Additionally, the example apparatus adjusts a configuration file corresponding to the IC based on at least one of the dimension or the shifted position of the via.

Abstract: This disclosure describes systems, methods, and devices related to optical proximity corrections to an integrated circuit photomask. A method may include identifying a first contour of a first adjacent polygon of a photomask predicted for a first polygon of an integrated circuit, the first contour excluding a first corner formed by a first edge and a second edge of the first polygon; identifying a second contour of a second adjacent polygon of a photomask predicted for a second polygon of the integrated circuit, the second contour excluding a second corner formed by a third edge and a fourth edge of the second polygon; generating a fast contour prediction based on corner rounding associated with the first contour and the second contour; and generating, based on the fast contour prediction, a minimum distance between the first contour and the second contour, the minimum distance associated with the optical proximity corrections.