Patents by Inventor Ankitha Chandran

Ankitha Chandran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230359336
    Abstract: Apparatuses, methods and storage medium associated with computer-assisted or autonomous driving (CA/AD) vehicles are disclosed herein. In embodiments, CA/AD vehicles are members of a CA/AD vehicle social network (CASN) in which various CA/AD vehicles may form connections or relationships with one another. CA/AD vehicles that have an existing relationship or connection may share CASN information with one another. The CASN information may include authenticated and/or proprietary information. Other embodiments are also described and claimed.
    Type: Application
    Filed: July 13, 2023
    Publication date: November 9, 2023
    Inventors: Fatema Adenwala, Ankitha Chandran, Nageen Himayat, Florence Pon, Divya Vijayaraghavan
  • Patent number: 11704007
    Abstract: Apparatuses, methods and storage medium associated with computer-assisted or autonomous driving (CA/AD) vehicles are disclosed herein. In embodiments, CA/AD vehicles are members of a CA/AD vehicle social network (CASN) in which various CA/AD vehicles may form connections or relationships with one another. CA/AD vehicles that have an existing relationship or connection may share CASN information with one another. The CASN information may include authenticated and/or proprietary information. Other embodiments are also described and claimed.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: July 18, 2023
    Assignee: Intel Corporation
    Inventors: Fatema Adenwala, Ankitha Chandran, Nageen Himayat, Florence Pon, Divya Vijayaraghavan
  • Patent number: 11348909
    Abstract: Methods and apparatus to implement efficient memory storage in multi-die packages are disclosed. An example multi-die package includes a multi-die stack including a first die and a second die. The second die is stacked on the first die. The multi-die package further includes a third die adjacent the multi-die stack. The multi-die package also includes a silicon-based connector to communicatively couple the multi-die stack and the third die. The silicon-based connector includes at least one of a logic circuit or a memory circuit.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: May 31, 2022
    Assignee: Intel Corporation
    Inventors: Maruti Gupta Hyde, Nageen Himayat, Linda Hurd, Min Suet Lim, Van Le, Gayathri Jeganmohan, Ankitha Chandran
  • Publication number: 20210303137
    Abstract: Apparatuses, methods and storage medium associated with computer-assisted or autonomous driving (CA/AD) vehicles are disclosed herein. In embodiments, CA/AD vehicles are members of a CA/AD vehicle social network (CASN) in which various CA/AD vehicles may form connections or relationships with one another. CA/AD vehicles that have an existing relationship or connection may share CASN information with one another. The CASN information may include authenticated and/or proprietary information. Other embodiments are also described and claimed.
    Type: Application
    Filed: May 10, 2021
    Publication date: September 30, 2021
    Inventors: Fatema Adenwala, Ankitha Chandran, Nageen Himayat, Florence Pon, Divya Vijayaraghavan
  • Patent number: 11036370
    Abstract: Apparatuses, methods and storage medium associated with computer-assisted or autonomous driving (CA/AD) vehicles are disclosed herein. In embodiments, CA/AD vehicles are members of a CA/AD vehicle social network (CASN) in which various CA/AD vehicles may form connections or relationships with one another. CA/AD vehicles that have an existing relationship or connection may share CASN information with one another. The CASN information may include authenticated and/or proprietary information. Other embodiments are also described and claimed.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: June 15, 2021
    Assignee: Intel Corporation
    Inventors: Fatema Adenwala, Ankitha Chandran, Nageen Himayat, Florence Pon, Divya Vijayaraghavan
  • Patent number: 10942562
    Abstract: Methods and apparatus to manage operation of variable-state computing devices using artificial intelligence are disclosed. An example computing device includes a hardware platform. The example computing device also includes an artificial intelligence (AI) engine to: determine a context of the device; and adjust an operation of the hardware platform based on an expected change in the context of the device. The adjustment modifies at least one of a computational efficiency of the device, a power efficiency of the device, or a memory response time of the device.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: March 9, 2021
    Assignee: Intel Corporation
    Inventors: Shekoufeh Qawami, Nageen Himayat, Chaitanya Sreerama, Hassnaa Moustafa, Rita Wouhaybi, Linda Hurd, Nadine L Dabby, Van Le, Gayathri Jeganmohan, Ankitha Chandran
  • Publication number: 20190079659
    Abstract: Apparatuses, methods and storage medium associated with computer-assisted or autonomous driving (CA/AD) vehicles are disclosed herein. In embodiments, CA/AD vehicles are members of a CA/AD vehicle social network (CASN) in which various CA/AD vehicles may form connections or relationships with one another. CA/AD vehicles that have an existing relationship or connection may share CASN information with one another. The CASN information may include authenticated and/or proprietary information. Other embodiments are also described and claimed.
    Type: Application
    Filed: September 25, 2018
    Publication date: March 14, 2019
    Inventors: Fatema Adenwala, Ankitha Chandran, Nageen Himayat, Florence Pon, Divya Vijayaraghavan
  • Publication number: 20190051642
    Abstract: Methods and apparatus to implement efficient memory storage in multi-die packages are disclosed. An example multi-die package includes a multi-die stack including a first die and a second die. The second die is stacked on the first die. The multi-die package further includes a third die adjacent the multi-die stack. The multi-die package also includes a silicon-based connector to communicatively couple the multi-die stack and the third die. The silicon-based connector includes at least one of a logic circuit or a memory circuit.
    Type: Application
    Filed: September 28, 2018
    Publication date: February 14, 2019
    Inventors: Maruti Gupta Hyde, Nageen Himayat, Linda Hurd, Min Suet Lim, Van Le, Gayathri Jeganmohan, Ankitha Chandran
  • Publication number: 20190047462
    Abstract: In embodiments, a computer-assisted or autonomous driving (CA/AD) vehicle includes a docking platform to receive one or more unmanned aerial vehicles (UAVs) of different types to dock with the CA/AD vehicle, each UAV to include at least one sensor directed to a configurable specific use of the CA/AD vehicle, and a UAV interface to communicate with the one or more docked UAVs, including to receive sensor data obtained by the one or more UAVs. In embodiments, the CA/AD vehicle is configured to a specific use, based at least in part on the one or more UAVs docked with the CA/AD vehicle.
    Type: Application
    Filed: September 25, 2018
    Publication date: February 14, 2019
    Inventors: Divya Vijayaraghavan, Nageen Himayat, Florence Pon, Fatema Adenwala, Ankitha Chandran
  • Publication number: 20190050049
    Abstract: Methods and apparatus to manage operation of variable-state computing devices using artificial intelligence are disclosed. An example computing device includes a hardware platform. The example computing device also includes an artificial intelligence (AI) engine to: determine a context of the device; and adjust an operation of the hardware platform based on an expected change in the context of the device. The adjustment modifies at least one of a computational efficiency of the device, a power efficiency of the device, or a memory response time of the device.
    Type: Application
    Filed: September 28, 2018
    Publication date: February 14, 2019
    Inventors: Shekoufeh Qawami, Nageen Himayat, Chaitanya Sreerama, Hassnaa Moustafa, Rita Wouhaybi, Linda Hurd, Nadine L Dabby, Van Le, Gayathri Jeganmohan, Ankitha Chandran