Abstract: A defective integrated circuit (IC) is analyzed to identify a portion of the integrated circuit possibly containing an electrical defect. A computer is used to process the design information of the integrated circuit and to navigate to the physical portion of the integrated circuit where the potential electrical defect might be found. The design information includes information on the layout and the technology used to fabricate the integrated circuit. A three-dimensional view of the portion of the design of the integrated circuit where the electrical defect might be found is rendered, based on the design information for the integrated circuit.

Abstract: A layout design for a semiconductor chip includes two or more layers, each including a set of shapes, which are used for various fabrication processes during the manufacture of a physical semiconductor chip. Some manufacturing processes create physical features on the semiconductor chip that do not directly correspond to shapes in the layout design. To facilitate design analysis of such semiconductor chips, shapes from the layout design are selected and manipulated by performing one or more operations, such as Boolean operations, on the shapes to generate new shapes. The new shapes, which can represent physical features of the manufactured semiconductor chip, are then displayed, along with an image of the corresponding section of the physical semiconductor chip, to facilitate design analysis, such as failure analysis.

Abstract: Defect characterization and failure analysis are useful tools for analyzing and improving fabrication for semiconductor chips. By using a layout and a netlist in combination with images of semiconductors, defects can be identified and analyzed. Electrical simulation can be performed on the netlist, based on the presence of the defect that was detected. Layout geometries where the defect was detected can be binned, and a search can be performed of the remainder of the layout for similar groupings of layout geometries. Various representations of the semiconductor can be cross-mapped, including layout, schematic, and netlist. The presence of certain defects can be correlated to yield, to performance, and to other characteristics.

Abstract: A defective integrated circuit (IC) is analyzed to identify a portion of the integrated circuit possibly containing an electrical defect. A computer is used to process the design information of the integrated circuit and to navigate to the physical portion of the integrated circuit where the potential electrical defect might be found. The design information includes information on the layout and the technology used to fabricate the integrated circuit. A three-dimensional view of the portion of the design of the integrated circuit where the electrical defect might be found is rendered, based on the design information for the integrated circuit.

Abstract: A defective integrated circuit (IC) is analyzed to identify a portion of the integrated circuit possibly containing an electrical defect. A computer is used to process the design information of the integrated circuit and to navigate to the physical portion of the integrated circuit where potential electrical defect might be found. The design information includes information on the layout and the technology used to fabricate the integrated circuit. A three-dimensional view of the portion of the design of integrated circuit where the electrical defect might be found is rendered, based on the design information for the integrated circuit.

Abstract: A layout design for a semiconductor chip includes two or more layers, each including a set of shapes, which are used for various fabrication processes during the manufacture of a physical semiconductor chip. Some manufacturing processes create physical features on the semiconductor chip that do not directly correspond to shapes in the layout design. To facilitate design analysis of such semiconductor chips, shapes from the layout design are selected and manipulated by performing one or more operations, such as Boolean operations, on the shapes to generate new shapes. The new shapes, which can represent physical features of the manufactured semiconductor chip, are then displayed, along with an image of the corresponding section of the physical semiconductor chip, to facilitate design analysis, such as failure analysis.

Abstract: A defective integrated circuit (IC) is analyzed to identify a portion of the integrated circuit possibly containing an electrical defect. A computer is used to process the design information of the integrated circuit and to navigate to the physical portion of the integrated circuit where potential electrical defect might be found. The design information includes information on the layout and the technology used to fabricate the integrated circuit. A three-dimensional view of the portion of the design of integrated circuit where the electrical defect might be found is rendered, based on the design information for the integrated circuit.

Abstract: Defect characterization and failure analysis are useful tools for analyzing and improving fabrication for semiconductor chips. By using a layout and a netlist in combination with images of semiconductors, defects can be identified and analyzed. Electrical simulation can be performed on the netlist, based on the presence of the defect that was detected. Layout geometries where the defect was detected can be binned, and a search can be performed of the remainder of the layout for similar groupings of layout geometries. Various representations of the semiconductor can be cross-mapped, including layout, schematic, and netlist. The presence of certain defects can be correlated to yield, to performance, and to other characteristics.

Abstract: Defect characterization is a useful tool for analyzing and improving fabrication for semiconductor chips. By using layout and netlist in combination with images of semiconductors, defects can be identified and analyzed. Electrical simulation can be performed on the netlist, based on the presence of the defect that was detected. Layout geometries where the defect was detected can be binned and a search can be performed of the remainder of the layout for similar groupings of layout geometries. Various representations of the semiconductor can be cross mapped, including layout, schematic, and netlist. The presence of certain defects can be correlated to yield, performance, and other characteristics.

Abstract: The use of design rule checks for failure analysis of semiconductor chips is described. The smaller geometries of recent semiconductor devices lead to a much higher level of sensitivity of devices to photolithography related systematic problems. Failure analysis to date has focused on physical, randomly distributed defects of devices rather than systematic problems caused by the mask manufacturing or mask application process. Methods and systems are described which allow for online searches of a layout database for geometric features defined by a set of rules. The rules may be defined as two-dimensional Boolean operations including shape or distance based as well as any kind of combination. The result is graphically and interactively presented.

Abstract: Defect characterization is a useful tool for analyzing and improving fabrication for semiconductor chips. By using layout and netlist in combination with images of semiconductors, defects can be identified and analyzed. Electrical simulation can be performed on the netlist, based on the presence of the defect that was detected. Layout geometries where the defect was detected can be binned and a search can be performed of the remainder of the layout for similar groupings of layout geometries. Various representations of the semiconductor can be cross mapped, including layout, schematic, and netlist. The presence of certain defects can be correlated to yield, performance, and other characteristics.

Abstract: Signal tracing across boards and chips can be used to greatly enhance failure analysis of the boards and chips. Concepts are disclosed for tracing one or more signal lines across a board, across a chip boundary, and across a chip. Signals may be traced through active circuitry on a chip along with paths through various logic cones. The result can be graphically and interactively presented.

Abstract: Signal tracing across boards and chips can be used to greatly enhance failure analysis of the boards and chips. Concepts are disclosed for tracing one or more signal lines across a board, across a chip boundary, and across a chip. Signals may be traced through active circuitry on a chip along with paths through various logic cones. The result can be graphically and interactively presented.

Abstract: The use of design rule checks for failure analysis of semiconductor chips is described. The smaller geometries of recent semiconductor devices lead to a much higher level of sensitivity of devices to photolithography related systematic problems. Failure analysis to date has focused on physical, randomly distributed defects of devices rather than systematic problems caused by the mask manufacturing or mask application process. Methods and systems are described which allow for online searches of a layout database for geometric features defined by a set of rules. The rules may be defined as two-dimensional Boolean operations including shape or distance based as well as any kind of combination. The result is graphically and interactively presented.