Abstract: A method of fabricating integrated circuits according to a first design. One first pattern is common with a second design, and one second pattern is unique to the first design. The first pattern is imaged using a first mask having first patterns formed in a block thereon. No other patterns of the first and second designs are formed on the first mask. The second patterns are imaged on the substrate using a second mask having second patterns formed in a block thereon. At least one third layer pattern is formed on the second mask.

Abstract: A method of fabricating integrated circuits according to a first design. One first pattern is common with a second design, and one second pattern is unique to the first design. The first pattern is imaged using a first mask having first patterns formed in a block thereon. No other patterns of the first and second designs are formed on the first mask. The second patterns are imaged on the substrate using a second mask having second patterns formed in a block thereon. At least one third layer pattern is formed on the second mask.

Abstract: A method of fabricating integrated circuits according to a first design by imaging a first layer on a substrate using a first mask having a block of first patterns in common with a second design, but without any other patterns of the first or second designs and imaging a second layer on the substrate using a second mask having a block of second patterns unique to the first design and at least one third layer pattern. The block of first patterns is repeatedly exposed in a first grid and the block of second patterns is repeatedly exposed in a second grid, each without overlap in the corresponding layer. The grids are aligned such that the integrated circuits and test structures in scribe lines between the integrated circuits are properly formed on the substrate. The first patterns can be for large fields and the second patterns can be for small fields.

Abstract: A method of fabricating a plurality of integrated circuits on a substrate according to a first integrated circuit design. Each of the integrated circuits is formed with a plurality of layer patterns. At least one first layer pattern of the layer patterns is common with a second integrated circuit design, and at least one second layer pattern of the layer patterns is unique to the first integrated circuit design. The first layer pattern is imaged on the substrate using an exposure tool and a first mask having a first number of the first layer patterns formed in a block thereon. No other layer patterns of the first layer patterns and the second layer patterns are formed on the first mask. The first number is less than the plurality of integrated circuits formed on the substrate. The first layer patterns are imaged on the substrate by exposing and repeating the block of first number of first layer patterns across the substrate with the exposure tool.

Abstract: A reticle includes multiple different layer patterns selected from a group comprising same circuit layer patterns and different circuit layer patterns. The layer patterns are positioned on the reticle within borders and within a portion of a defined x by y array on the reticle. The reticle is used to produce an integrated circuit of a single design or integrated circuits of multiple designs.