Patents by Inventor Ann Jinyan Xu

Ann Jinyan Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having an EMI shielding layer
    Patent number: 9991211
    Abstract: Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: June 5, 2018
    Assignee: Intel Corporation
    Inventors: Anna M. Prakash, Reynaldo Alberto Olmedo, Venmathy McMahan, Rajendra C. Dias, Joshua David Heppner, Ann Jinyan Xu, Sriya Sanyal, Eric Jin Li
  • SEMICONDUCTOR PACKAGE HAVING AN EMI SHIELDING LAYER
    Publication number: 20170287851
    Abstract: Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.
    Type: Application
    Filed: May 26, 2017
    Publication date: October 5, 2017
    Inventors: Anna M. Prakash, Reynaldo Alberto Olmedo, Venmathy McMahan, Rajendra C. Dias, Joshua David Heppner, Ann Jinyan Xu, Sriya Sanyal, Eric Jin Li
  • Semiconductor package having an EMI shielding layer
    Patent number: 9685413
    Abstract: Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: June 20, 2017
    Assignee: Intel Corporation
    Inventors: Anna M. Prakash, Reynaldo Alberto Olmedo, Venmathy McMahan, Rajendra C. Dias, Joshua David Heppner, Ann Jinyan Xu, Sriya Sanyal, Eric Jin Li