Patents by Inventor Ann Kent-Ming Ho

Ann Kent-Ming Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of exposing circuit lateral interconnect contacts by wafer saw
    Patent number: 7662669
    Abstract: A method for fabricating wafer-level packages including lateral interconnects. The method includes precutting a cover wafer at the locations where the cover wafer will be completely cut through to separate the wafer-level packages. The cover wafer is bonded to the substrate wafer using bonding rings so as to seal the integrated circuit within a cavity between the cover wafer and the substrate wafer, where the precuts face the substrate wafer. The cover wafer is then cut at the precut locations to remove the unwanted portions of the cover wafer between the packages and expose contacts or probe pads for the lateral interconnects. The substrate wafer is then cut between the wafer-level packages to separate the packages.
    Type: Grant
    Filed: July 24, 2007
    Date of Patent: February 16, 2010
    Assignee: Northrop Grumman Space & Mission Systems Corp.
    Inventors: Patty Pei-Ling Chang-Chien, Kelly Jill Tornquist Hennig, Ken Wai-Kin Ho, Ann Kent-Ming Ho
  • Method of Exposing Circuit Lateral Interconnect Contacts by Wafer Saw
    Publication number: 20090029526
    Abstract: A method for fabricating wafer-level packages including lateral interconnects. The method includes precutting a cover wafer at the locations where the cover wafer will be completely cut through to separate the wafer-level packages. The cover wafer is bonded to the substrate wafer using bonding rings so as to seal the integrated circuit within a cavity between the cover wafer and the substrate wafer, where the precuts face the substrate wafer. The cover wafer is then cut at the precut locations to remove the unwanted portions of the cover wafer between the packages and expose contacts or probe pads for the lateral interconnects. The substrate wafer is then cut between the wafer-level packages to separate the packages.
    Type: Application
    Filed: July 24, 2007
    Publication date: January 29, 2009
    Applicant: Northrop Grumman Space & Mission Systems Corp.
    Inventors: Patty Pei-Ling Chang-Chien, Kelly Jill Tornquist Hennig, Ken Wai-Kin Ho, Ann Kent-Ming Ho