Abstract: A Addition-fragmentation oligomers containing allylic disulfide groups are described. The oligomers may be added to polymerizable compositions to provide labile crosslinks that can cleave and reform during the polymerization process.

Abstract: Addition-fragmentation agents of the formula are disclosed having the following functional groups: 1) a labile addition-fragmentation group that can cleave and reform to relieve strain, 2) at least two surface-binding functional groups that associate with the surface of a substrate.

Abstract: Addition-fragmentation agents of the formula are disclosed: wherein R1, R2 and R3 are each independently Z-Q-, a (hetero)alkyl group or a (hetero)aryl group with the proviso that at least one of R1, R2 and R3 is Zm-Q-, Q is a linking group have a valence of m+1; Z is an ethylenically unsaturated polymerizable group, m is 1 to 6; each X1 is independently —O— or —NR4—, where R4 is H or C1-C4 alkyl, and n is 0 or 1.

Abstract: The present disclosure provides addition-fragmentation oligomers of the general formula: The crosslinking oligomers of this disclosure provide stress relief by including labile crosslinks that can cleave and reform during the polymerization process.

Abstract: This disclosure provides novel adhesive compositions comprising a highly crosslinked and plasticized low Tg (meth)acrylic copolymer that are self-wetting when applied to a substrate, and peelable therefrom.

Abstract: A self-wetting adhesive composition is described comprising the reaction product of a low Tg (meth)acrylate solute copolymer component; a low Tg solvent monomer solvent monomer component comprising low Tg monomers, a multifunctional acrylate; and a polymerizable siloxane copolymer having at least one polydiorganosiloxane segment and at least on oxyalkylene segment.

Abstract: Provided are novel high refractive index monomers, and dental resins containing the same.

Abstract: The present disclosure provides an ionically crosslinkable composition comprising a (meth)acrylate copolymer component having pendant acid functional groups and pendant photobase functional groups. On exposure to light, the pendant photobase group photolyzes to provide a pendant amine group, that ionically crosslinks the copolymer.

Abstract: The present disclosure provides an ionically crosslinkable composition comprising a (meth)acrylate copolymer component having pendant acid functional groups and pendant photobase functional groups. On exposure to light, the pendant photobase group photolyzes to provide a pendant amine group, that ionically crosslinks the copolymer.

Abstract: The present disclosure provides an crosslinkable composition comprising a (meth)acrylate copolymer component having pendant photobase functional groups and a crosslinking agent that has amine-reactive functional groups. On exposure to light, the pendant photobase group photolyzes to provide a pendant amine group, that crosslinks the copolymer.

Abstract: Addition-fragmentation oligomers of the general formula Z—By-A-(B-A)x-B-A-By—Z, where the A monomers units are derived from a diester or diacid, the B monomer units are derived from a difunctional monomer having functional groups co-reactive and at least one of the A or B monomers comprise a 1-methylene-3,3-dimethylpropyl group.

Abstract: A curable dental composition comprising an addition-fragmentation agent and a curable dental resin is disclosed.

Abstract: The disclosure describes a curable composition comprising a first oligomer having a plurality of polymerizable groups; a second component comprising alkylene oxide repeat units and terminal polymerizable groups, a solvent monomer component; and a photoinitiator. The curable composition may be used as an adhesive in optical applications.

Abstract: Addition-fragmentation agents of the formula are disclosed having the following functional groups: 1) a labile addition-fragmentation group that can cleave and reform to relieve strain, 2) at least two surface-binding functional groups that associate with the surface of a substrate.

Abstract: The present disclosure provides an crosslinkable composition comprising a (meth)acrylate copolymer component having pendant photobase functional groups and a crosslinking agent that has amine-reactive functional groups. On exposure to light, the pendant photobase group photolyzes to provide a pendant amine group, that crosslinks the copolymer.

Abstract: Addition-fragmentation agents of the formula are disclosed: wherein R1, R2 and R3 are each independently Z-Q-, a (hetero)alkyl group or a (hetero)aryl group with the proviso that at least one of R1, R2 and R3 is Zm-Q-, Q is a linking group have a valence of m+1; Z is an ethylenically unsaturated polymerizable group, m is 1 to 6; each X1 is independently —O— or —NR4—, where R4 is H or C1-C4 alkyl, and n is 0 or 1.

Abstract: Addition-fragmentation agents of the formula are disclosed having the following functional groups: 1) a labile addition-fragmentation group that can cleave and reform to relieve strain, 2) a free-radically polymerizable group, and 3) a surface-modifying functional group that associates with the surface of a substrate.

Abstract: Addition-fragmentation agents of the formula are disclosed having the following functional groups: 1) a labile addition-fragmentation group that can cleave and reform to relieve strain, 2) a free-radically polymerizable group, and 3) a surface-modifying functional group that associates with the surface of a substrate.

Abstract: Addition-fragmentation agents of the formula are disclosed: wherein R1, R2 and R3 are each independently Z-Q-, a (hetero)alkyl group or a (hetero)aryl group with the proviso that at least one of R1, R2 and R3 is Zm-Q-, Q is a linking group have a valence of m+1; Z is an ethylenically unsaturated polymerizable group, m is 1 to 6; each X1 is independently —O— or —NR4—, where R4 is H or C1-C4 alkyl, and n is 0 or 1.

Abstract: An electrical interconnect structure on a substrate, includes a first porous dielectric layer with surface region from which a porogen has been removed; and an etch stop layer disposed upon the first porous dielectric layer so that the etch stop layer extends to partially fill pores in the surface region of the first porous dielectric layer from which the porogen has been removed, thus improving adhesion during subsequent processing. The porogen may be removed from the surface region by heating, and in particular by hot plate baking. A second porous dielectric layer, which may have the same composition as the first porous dielectric layer, may be formed over the etch stop layer. Electrical vias and lines may be formed in the first and second porous dielectric layer, respectively. The layers may be part of a multilayer stack, wherein all of the layers are cured simultaneously in a spin application tool porous dielectric layer.