Patents by Inventor Anna Lifton

Anna Lifton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SINTERING POWDER
    Publication number: 20260146195
    Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent.
    Type: Application
    Filed: November 25, 2025
    Publication date: May 28, 2026
    Applicant: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghoshal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
  • Sintering powder
    Patent number: 12522761
    Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: January 13, 2026
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
  • Solder material and method for die attachment
    Patent number: 12388042
    Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.
    Type: Grant
    Filed: September 19, 2023
    Date of Patent: August 12, 2025
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Angelo Gulino, Bogdan Bankiewicz, Oscar Khaselev, Anna Lifton, Michael T. Marczi, Girard Sidone, Paul Salerno, Paul J. Koep
  • METHOD AND SYSTEM FOR DIFFERENTIATING PERFORMANCE BETWEEN INTEGRATED SOLUTIONS
    Publication number: 20250111324
    Abstract: A graphical user interface (GUI) to communication evidenced-based value propositions to a customer The tool is capable of presenting interactively compelling evidenced based value and enables engagement of various integrated solutions that can be tailored to specific customer needs. Thus, the tool of the present invention is desired to demonstrate an interface of various integrated solutions to provide evidence-based value propositions for evaluation and consideration by the customer.
    Type: Application
    Filed: September 26, 2024
    Publication date: April 3, 2025
    Inventors: Paul Salerno, Anna Lifton, Howard Jin, Eric Bradley, Bruce Moloznik, Julia Murray
  • SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
    Publication number: 20240021565
    Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.
    Type: Application
    Filed: September 19, 2023
    Publication date: January 18, 2024
    Inventors: Angelo GULINO, Bogdan BANKIEWICZ, Oscar KHASELEV, Anna LIFTON, Michael T. MARCZI, Girard SIDONE, Paul SALERNO, Paul J. KOEP
  • Solder material and method for die attachment
    Patent number: 11842974
    Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: December 12, 2023
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Angelo Gulino, Bogdan Bankiewicz, Oscar Khaselev, Anna Lifton, Michael T. Marczi, Girard Sidone, Paul Salerno, Paul J. Koep
  • Methods for attachment and devices produced using the methods
    Patent number: 11699632
    Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: July 11, 2023
    Assignee: ALPHA ASSEMBLY SOLUTIONS INC.
    Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
  • SINTERING POWDER
    Publication number: 20220169905
    Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
    Type: Application
    Filed: October 4, 2021
    Publication date: June 2, 2022
    Applicant: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
  • Sintering paste
    Patent number: 11162007
    Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: November 2, 2021
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
  • METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS
    Publication number: 20210289680
    Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.
    Type: Application
    Filed: January 20, 2021
    Publication date: September 16, 2021
    Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
    Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
  • Methods for attachment and devices produced using the methods
    Patent number: 10905041
    Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.
    Type: Grant
    Filed: September 16, 2013
    Date of Patent: January 26, 2021
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
  • SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
    Publication number: 20200203304
    Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.
    Type: Application
    Filed: May 11, 2018
    Publication date: June 25, 2020
    Inventors: Angelo GULINO, Bogdan BANKIEWICZ, Oscar KHASELEV, Anna LIFTON, Michael T. MARCZI, Girard SIDONE, Paul SALERNO, Paul J. KOEP
  • Sintering Powder
    Publication number: 20190194517
    Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
    Type: Application
    Filed: March 1, 2019
    Publication date: June 27, 2019
    Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
  • Sintering powder
    Patent number: 10259980
    Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: April 16, 2019
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
  • Flux formulations
    Patent number: 9751159
    Abstract: Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: September 5, 2017
    Inventors: Narahari Pujari, Sanyogita Arora, Siuli Sarkar, Anna Lifton, Rahul Raut, Bawa Singh
  • Flux Formulations
    Publication number: 20170106479
    Abstract: Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.
    Type: Application
    Filed: December 27, 2016
    Publication date: April 20, 2017
    Inventors: Narahari Pujari, Sanyogita Arora, Siuli Sarkar, Anna Lifton, Rahul Raut, Bawa Singh
  • Flux formulations
    Patent number: 9566668
    Abstract: Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: February 14, 2017
    Inventors: Narahari Pujari, Sanyogita Arora, Siuli Sarkar, Anna Lifton, Rahul Raut, Bawa Singh
  • SINTERING POWDER
    Publication number: 20150353804
    Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
    Type: Application
    Filed: October 29, 2013
    Publication date: December 10, 2015
    Applicant: ALPHA METALS, INC.
    Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
  • METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS
    Publication number: 20140153203
    Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.
    Type: Application
    Filed: September 16, 2013
    Publication date: June 5, 2014
    Applicant: ALPHA METALS, INC.
    Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
  • FLUX FORMULATIONS
    Publication number: 20140060703
    Abstract: Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.
    Type: Application
    Filed: November 12, 2013
    Publication date: March 6, 2014
    Inventors: Narahari Pujari, Sanyogita Arora, Siuli Sarkar, Anna Lifton, Rahul Raut, Bawa Singh