Patents by Inventor Anna Malin

Anna Malin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for providing high-density capacitors
    Patent number: 8084841
    Abstract: The present invention describes systems and methods for providing high-density capacitors. An exemplary embodiment of the present invention provides a high-density capacitor system comprising a substrate and a porous conductive layer formed on the substrate, wherein the porous conductive layer is formed in accordance with a predetermined pattern. Furthermore, the high-density capacitor system includes a dielectric material formed on the porous conductive layer and a second conductive layer formed on the dielectric material. Additionally, the high-density capacitor system includes a plurality of conductive pads configured in communication with the second conductive layer.
    Type: Grant
    Filed: May 5, 2009
    Date of Patent: December 27, 2011
    Assignees: Georgia Tech Research, Medtronic, Inc.
    Inventors: MarkondeyaRaj Pulugurtha, Andreas Fenner, Anna Malin, Dasharatham Janagama Goud, Rao Tummala
  • SYSTEMS AND METHODS FOR FABRICATING HIGH-DENSITY CAPACITORS
    Publication number: 20100284123
    Abstract: The present invention describes systems and methods for fabricating high-density capacitors. An exemplary embodiment of the present invention provides a method for fabricating a high-density capacitor system including the steps of providing a substrate and depositing a nanoelectrode particulate paste layer onto the substrate. The method for fabricating a high-density capacitor system further includes sintering the nanoelectrode particulate paste layer to form a bottom electrode. Additionally, the method for fabricating a high-density capacitor system includes depositing a dielectric material onto the bottom electrode with an atomic layer deposition process. Furthermore, the method for fabricating a high-density capacitor system includes depositing a conductive material on the dielectric material to form a top electrode.
    Type: Application
    Filed: May 5, 2009
    Publication date: November 11, 2010
    Inventors: MarkondeyaRaj Pulugurtha, Andreas Fenner, Anna Malin, Kanika Sethi, Himani Sharma, Dasharatham Janagama Goud, Rao Tummala
  • SYSTEMS AND METHODS FOR PROVIDING HIGH-DENSITY CAPACITORS
    Publication number: 20100283122
    Abstract: The present invention describes systems and methods for providing high-density capacitors. An exemplary embodiment of the present invention provides a high-density capacitor system comprising a substrate and a porous conductive layer formed on the substrate, wherein the porous conductive layer is formed in accordance with a predetermined pattern. Furthermore, the high-density capacitor system includes a dielectric material formed on the porous conductive layer and a second conductive layer formed on the dielectric material. Additionally, the high-density capacitor system includes a plurality of conductive pads configured in communication with the second conductive layer.
    Type: Application
    Filed: May 5, 2009
    Publication date: November 11, 2010
    Inventors: MarkondeyaRaj PULUGURTHA, Andreas FENNER, Anna MALIN, Rao TUMMALA, Dasharatham Janagama GOUD