Patents by Inventor Anna Wanda Topol

Anna Wanda Topol has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High density chip carrier with integrated passive devices
    Patent number: 6962872
    Abstract: A carrier for a semiconductor component is provided having passive components integrated in its substrate. The passive components include decoupling components, such as capacitors and resistors. A set of connections is integrated to provide a close electrical proximity to the supported components.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: November 8, 2005
    Assignee: International Business Machines Corporation
    Inventors: Michael Patrick Chudzik, Robert H. Dennard, Rama Divakaruni, Bruce Kenneth Furman, Rajarao Jammy, Chandrasekhar Narayan, Sampath Purushothaman, Joseph F. Shepard, Jr., Anna Wanda Topol
  • High density chip carrier with integrated passive devices
    Publication number: 20050023664
    Abstract: A carrier for a semiconductor component is provided having passive components integrated in its substrate. The passive components include decoupling components, such as capacitors and resistors. A set of connections is integrated to provide a close electrical proximity to the supported components.
    Type: Application
    Filed: August 31, 2004
    Publication date: February 3, 2005
    Inventors: Michael Chudzik, Robert Dennard, Rama Divakaruni, Bruce Kenneth Furman, Rajarao Jammy, Chandrasekhar Narayan, Sampath Purushothaman, Joseph Shepard, Anna Wanda Topol
  • High density chip carrier with integrated passive devices
    Publication number: 20040108587
    Abstract: A carrier for a semiconductor component is provided having passive components integrated in its substrate. The passive components include decoupling components, such as capacitors and resistors. A set of connections is integrated to provide a close electrical proximity to the supported components.
    Type: Application
    Filed: December 9, 2002
    Publication date: June 10, 2004
    Inventors: Michael Patrick Chudzik, Robert H. Dennard, Rama Divakaruni, Bruce Kenneth Furman, Rajarao Jammy, Chandrasekhar Narayan, Sampath Purushothaman, Joseph F. Shepard, Anna Wanda Topol