Patents by Inventor Annaniah Luruthudass

Annaniah Luruthudass has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structural component and method for producing a structural component
    Patent number: 9252344
    Abstract: The invention relates to a structural component which comprises a support (1), an optoelectronic semiconductor chip (2) having at least one lateral face (2a), further comprising a connecting means (3), a first molded element (4), and a second molded element (5), the optoelectronic semiconductor chip (2) being mechanically connected to the support (1) by the connecting means (3). The first molded element (4) covers an exposed outer face of the optoelectronic semiconductor chip (2) and the first molded element (4) covers an exposed outer face of the connecting means (3). The second molded element (5) covers an exposed outer face of the first molded element (5) and the second molded element (5) has a higher modulus of elasticity at room temperature than the first molded element.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: February 2, 2016
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Thomas Kippes, Stephan Haslbeck, Annaniah Luruthudass, Ee Lian Lee
  • Optoelectronic semiconductor component, method for producing same and use of such a component
    Patent number: 9190553
    Abstract: An opto-electronic component includes a housing, a radiation-emitting semiconductor chip and a radiation-detecting semiconductor chip. A first cavity and a second cavity are formed in the housing, wherein the radiation-emitting semiconductor chip is arranged in the first cavity and is cast by means of a first casting compound. The radiation-detecting semiconductor chip is arranged in the second cavity and cast by means of a second casting compound, wherein absorber particles are embedded in the second casting compound which are suitable for at least partially absorbing the radiation emitted by the radiation-emitting semiconductor chip.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: November 17, 2015
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Annaniah Luruthudass, Ratha Krishnan Vicknes
  • STRUCTURAL COMPONENT AND METHOD FOR PRODUCING A STRUCTURAL COMPONENT
    Publication number: 20140159101
    Abstract: The invention relates to a structural component which comprises a support (1), an optoelectronic semiconductor chip (2) having at least one lateral face (2a), further comprising a connecting means (3), a first molded element (4), and a second molded element (5), the optoelectronic semiconductor chip (2) being mechanically connected to the support (1) by the connecting means (3). The first molded element (4) covers an exposed outer face of the optoelectronic semiconductor chip (2) and the first molded element (4) covers an exposed outer face of the connecting means (3). The second molded element (5) covers an exposed outer face of the first molded element (5) and the second molded element (5) has a higher modulus of elasticity at room temperature than the first molded element.
    Type: Application
    Filed: April 12, 2012
    Publication date: June 12, 2014
    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Thomas Kippes, Stephan Haslbeck, Annaniah Luruthudass, Ee Lian Lee
  • OPTOELECTRONIC SEMICONDUCTOR COMPONENT, METHOD FOR PRODUCING SAME AND USE OF SUCH A COMPONENT
    Publication number: 20130334544
    Abstract: An opto-electronic component includes a housing, a radiation-emitting semiconductor chip and a radiation-detecting semiconductor chip. A first cavity and a second cavity are formed in the housing, wherein the radiation-emitting semiconductor chip is arranged in the first cavity and is cast by means of a first casting compound. The radiation-detecting semiconductor chip is arranged in the second cavity and cast by means of a second casting compound, wherein absorber particles are embedded in the second casting compound which are suitable for at least partially absorbing the radiation emitted by the radiation-emitting semiconductor chip.
    Type: Application
    Filed: November 2, 2011
    Publication date: December 19, 2013
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: Annaniah Luruthudass, Ratha Krishnan Vicknes