Patents by Inventor Anne Bardiot

Anne Bardiot has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hot-extrudable pressure-sensitive hot-melt adhesives and their use in multilayer films
    Patent number: 7622176
    Abstract: The present invention relates to hot-coextrudable hot-melt pressure-sensitive adhesives particularly suitable for the production of multilayer films intended for what are called “repositionable” packages that are opened and reclosed easily. The films used in these packages comprise at least three layers, namely an outer layer intended to be complexed thereafter, a sealing and separable layer, defining all or part of the internal surface of the package, and between them a hot-melt adhesive layer that joins them together. In this type of package, the adhesive plays an essential role insofar as, once the package has been opened by the end user, the quality of the reclosure and of the reopening will depend on the performance of the adhesive, which is of course a pressure-sensitive adhesive, that is to say an adhesive that adheres simply by manual pressure.
    Type: Grant
    Filed: December 10, 2003
    Date of Patent: November 24, 2009
    Assignee: Bostik SA
    Inventors: Anne Bardiot, Nicolas Sajot, Pierre Gerard, Christophe Notteau
  • Hot-extrudable pressure-sensitive hot-melt adhesives and their use in multilayer films
    Publication number: 20040077759
    Abstract: The present invention relates to hot-coextrudable hot-melt pressure-sensitive adhesives particularly suitable for the production of multilayer films intended for what are called “repositionable” packages that are opened and reclosed easily. The films used in these packages comprise at least three layers, namely an outer layer intended to be complexed thereafter, a sealing and separable layer, defining all or part of the internal surface of the package, and between them a hot-melt adhesive layer that joins them together. In this type of package, the adhesive plays an essential role insofar as, once the package has been opened by the end user, the quality of the reclosure and of the reopening will depend on the performance of the adhesive, which is of course a pressure-sensitive adhesive, that is to say an adhesive that adheres simply by manual pressure.
    Type: Application
    Filed: December 10, 2003
    Publication date: April 22, 2004
    Applicant: Bostik Findley, S.A.
    Inventors: Anne Bardiot, Nicolas Sajot, Pierre Gerard, Christophe Notteau