Abstract: In a first aspect, an apparatus for cleaning a thin disk is provided. The apparatus includes a support roller for supporting a rotating wafer within a wafer cleaner. The support roller comprises a guide portion, for receiving an edge of a wafer, having an inclined surface comprising a low-friction material and adapted to allow the wafer edge to slide thereagainst; and an edge-trap portion for retaining the edge of the wafer and having a transverse surface comprising a high-friction material and adapted, when in communication with the edge of the wafer, to resist sliding thereagainst. Numerous other aspects are provided.

Abstract: In a first aspect, an apparatus for cleaning a thin disk is provided. The apparatus includes a support roller for supporting a rotating wafer within a wafer cleaner. The support roller comprises a guide portion, for receiving an edge of a wafer, having an inclined surface comprising a low-friction material and adapted to allow the wafer edge to slide thereagainst; and an edge-trap portion for retaining the edge of the wafer and having a transverse surface comprising a high-friction material and adapted, when in communication with the edge of the wafer, to resist sliding thereagainst. Numerous other aspects are provided.

Abstract: In a first aspect, an apparatus for cleaning a thin disk is provided. The apparatus includes a support roller for supporting a rotating wafer within a wafer cleaner. The support roller comprises a guide portion, for receiving an edge of a wafer, having an inclined surface comprising a low-friction material and adapted to allow the wafer edge to slide thereagainst; and an edge-trap portion for retaining the edge of the wafer and having a transverse surface comprising a high-friction material and adapted, when in communication with the edge of the wafer, to resist sliding thereagainst. Numerous other aspects are provided.

Abstract: In a first aspect, a method of cleaning an edge of a wafer is provided. The method comprises providing an edge cleaning roller having a first inclined frictional surface for cleaning an edge corner of a wafer rotating within a first plane; and causing the edge cleaning roller to rotate within a second plane at an angle to the first plane while the inclined frictional surface contacts and cleans the edge corner. Numerous other aspects are provided.

Abstract: In a first aspect, an apparatus for cleaning a thin disk is provided. The apparatus includes a support roller for supporting a rotating wafer within a wafer cleaner. The support roller comprises a guide portion, for receiving an edge of a wafer, having an inclined surface comprising a low-friction material and adapted to allow the wafer edge to slide thereagainst; and an edge-trap portion for retaining the edge of the wafer and having a transverse surface comprising a high-friction material and adapted, when in communication with the edge of the wafer, to resist sliding thereagainst. Numerous other aspects are provided.

Abstract: In a first aspect, an apparatus is provided that includes (1) an idler adapted to contact a substrate, to rotate therewith, and to sense rotation of the substrate; and (2) a driving mechanism coupled to the idler and adapted to drive the idler. Numerous other aspects are provided.

Abstract: In a first aspect, a method is provided for adjusting tension of a belt of a semiconductor device manufacturing tool. The first method includes (1) coupling an elastic element between a pulley coupled to the belt and a fixed surface of the semiconductor device manufacturing tool; and (2) compressing or decompressing the elastic element so as to adjust at least one of a height and a tilt of the pulley and a tension of the belt coupled to the pulley. Numerous other aspects are provided.

Abstract: In a first aspect, an apparatus for cleaning a thin disk is provided. The apparatus includes (1) a plurality of support rollers adapted to support an edge of the thin disk as the thin disk rotates within a first plane; and (2) an edge-cleaning roller adapted to rotate within a second plane oriented at a first non-zero angle to the first plane, so as to contact an edge bevel of the thin disk while so rotating. Numerous other aspects are provided.