Abstract: A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.

Abstract: A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.

Abstract: A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.

Abstract: An integrated multilayer structure for use in sensing applications and a method of manufacture are presented. The multilayer structure includes at least one molded or cast plastic layer and a film layer on both first and second sides of said plastic layer. The film layer on the first side of said plastic layer is provided with reactance sensing electronics. The sensing electronics includes at least one sensing element and an electrical connection for connecting the sensing element to an associated control circuitry. The film layer on the second side of the plastic layer has a sensing area superimposed with the sensing element of the sensing electronics. The electrical distance between the film layer on the second side of the plastic layer and the sensing element are locally reduced by a physical feature at the position of the sensing area of the film layer to improve the associated sensing sensitivity.

Abstract: A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.

Abstract: A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.

Abstract: A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.

Abstract: An integrated multilayer structure for use in sensing applications and a method of manufacture are presented. The multilayer structure includes at least one molded or cast plastic layer and a film layer on both first and second sides of said plastic layer. The film layer on the first side of said plastic layer is provided with reactance sensing electronics. The sensing electronics includes at least one sensing element and an electrical connection for connecting the sensing element to an associated control circuitry. The film layer on the second side of the plastic layer has a sensing area superimposed with the sensing element of the sensing electronics. The electrical distance between the film layer on the second side of the plastic layer and the sensing element are locally reduced by a physical feature at the position of the sensing area of the film layer to improve the associated sensing sensitivity.

Abstract: A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.

Abstract: Integrated multilayer structure suitable for use in sensing applications is disclosed including at least one plastic layer, at least one film layer provided on both sides of the plastic layer. A film layer on a first side of the plastic layer includes electronics incorporating reactance sensing electronics for sensing of selected target quantities, and conversion thereof into representative electrical signals. The sensing electronics include an electrode and a connection element for connecting the electrode to control circuitry. A film layer on a second side of the plastic layer includes features including one conductive feature that is configured to shape an electromagnetic field to adapt a sensitivity or directionality the sensing response of the sensing electronics on the first side of the plastic layer.

Abstract: A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.

Abstract: A multiband internal antenna apparatus and methods of tuning and utilizing the same. In one embodiment, the antenna configuration is used within a handheld mobile device (e.g., cellular telephone or smartphone). The device enclosure is fabricated from a conductive material and has two parts: the main portion, housing the device electronics and ground plane, and the antenna cap, which substantially envelops a directly fed radiator structure of the antenna. Electromagnetic coupling of the cap portion to the device feed effects formation of a parasitic antenna radiator in a lower frequency band. The cap portion is separated from the main portion by a narrow gap, extending along circumference of the device, and is grounded at a location selected to cause desired resonance and to widen antenna bandwidth. In one implementation, a second parasitic radiator is disposed proximate the directly feed radiator to further expand antenna frequency bands of operation.

Abstract: An adjustable monopole antenna especially intended for the mobile terminals. The adjusting circuit (930) of the antenna is located between the radiator (920) and the antenna port of a radio device and forms, together with the antenna feed conductor (901), a feed circuit. This circuit comprises an adjustable reactance between the feed conductor and the ground in series with the feed conductor or in both of those places. For example, the feed conductor can be connected by a multi-way switch to one of alternative transmission lines, which are typically short-circuited or open at their tail end and shorter than the quarter wave, each line acting for a certain reactance. The antenna operating band covers at a time only a part of the frequency range used by one or two radio systems, in which case the antenna matching is easier to arrange than of a real broadband antenna. The space required for both the radiator and the adjusting circuit is relatively small.

Abstract: A multiband internal antenna apparatus and methods of tuning and utilizing the same. In one embodiment, the antenna configuration is used within a handheld mobile device (e.g., cellular telephone or smartphone). The device enclosure is fabricated from a conductive material and has two parts: the main portion, housing the device electronics and ground plane, and the antenna cap, which substantially envelops a directly fed radiator structure of the antenna. Electromagnetic coupling of the cap portion to the device feed effects formation of a parasitic antenna radiator in a lower frequency band. The cap portion is separated from the main portion by a narrow gap, extending along circumference of the device, and is grounded at a location selected to cause desired resonance and to widen antenna bandwidth. In one implementation, a second parasitic radiator is disposed proximate the directly feed radiator to further expand antenna frequency bands of operation.

Abstract: A multiband antenna applicable as an internal antenna in small mobile terminals especially. The antenna (200) is a PIFA placed inside the housing of a mobile station with at least two operating bands. A first resonance falling into a lower operating band is produced by means of a radiating conductive pattern (B21) in planar element (220). To improve the characteristics of the antenna in the upper operating band the planar element further comprises a slot (232) which goes between the feed point (F) and the short-circuit point (S) of the antenna. The radiator provided by this slot can be considered a quarter-wave slot radiator or a half-wave loop radiator. The PIFA further may have another radiator, which resonates in the upper operation band. By means of said slot the upper operating band of an antenna can be widened or the radiation in the horizontal plane in the upper operating band can be made more effective.

Abstract: The invention relates to an antenna structure (400) to be placed inside in particular small radio apparatus. A conventional PIFA-type structure is extended by arranging a structural part (415) adding to the capacitance between the radiating plane (420) and ground plane (410) relatively close to the feed point (F) of the antenna. The structural component may be a projection extending from the radiating plane towards the ground plane or vice versa. An advantage of the invention is that it achieves a significant increase in the antenna bandwidth without increasing the size of the antenna. Another advantage of the invention is that the structure according to it is simple and the increase in the manufacturing costs is relatively low.

Abstract: A planar antenna comprises a planar radiating element (600) formed of a conductive area confined by a substantially continuous border line. The conductive area is split by a gap which divides the planar radiating element into a first branch and second branch such that both the first and the second branch have an outermost end. The gap has a head end on said substantially continuous border line and a tail end within the conductive area. At its head end (601) the gap has a certain first direction and at another point (603) a certain second direction which differs from the first direction by more than 90 degrees when the directions are defined along the gap from the head end towards the tail end. The outermost end of the second branch, confined by the gap, is located within the continuous border line, surrounded by the first branch.

Abstract: The invention relates to dual mode antennas particularly suitable for mobile stations. The antenna structure comprises an antenna (211, 201, 202, 212) of the PIFA type which is located within the covers of the mobile station, and a whip element (220) which is movable relating to the PIFA antenna. The PIFA can be a single band or a dual band antenna. When the whip element is extracted its lower end (222) forms a galvanic or capacitive coupling with the radiating element (211) of the PIFA. If the PIFA is a single band antenna the extracted whip element substantially changes the resonant frequency of the PIFA, so that the whip is left as the radiating element at the operating band. If the PIFA is a dual band antenna, then an extracted whip alone, or the whip and the planar element of the PIFA together, functions as the radiating element at one operating band, and at the other operating band the planar element of the PIFA operates as the radiating element.

Abstract: A PIFA structure has a first operating frequency and a second operating frequency. It comprises a planar radiating element (801, 1002, 1101, 1203) which is a conductive area confined by a substantially continuous border line divided by a non-conductive slot (802). The slot has a first end on said substantially continuous border line and a second end within the conductive area. The planar radiating element comprises a feedpoint (803, 1206) and ground contact (804, 1208) near the first end of the slot so that the electrical length of the conductive area divided by the slot, measured at the feedpoint, equals a quarter of the wavelength at the first operating frequency and the electrical length of the slot equals a quarter of the wavelength at the second operating frequency.