Abstract: The present invention provides a packaged semiconductor device that includes two semiconductor die. The first semiconductor die is attached to a package substrate using adhesive. A first set of wire bonds electrically connect the first semiconductor die to the package substrate. A first layer of encapsulant extends over the first semiconductor die and over the first set of wire bonds. A second semiconductor die is attached to the first layer of encapsulant using adhesive. A second set of wire bonds electrically connect the second semiconductor die to the package substrate. A second layer of encapsulant extends over the second semiconductor die and over the second set of wire bonds.

Abstract: An apparatus and a method for reducing layer separation and cracking in semiconductor devices. A structure is formed over a semiconductor wafer that includes die separated by scribe streets and that includes probe pads for testing die. A notch is cut within a scribe street so as to expose an open area that does not contain any probe pad and that does not contain any metal layers. The wafer is then severed into semiconductor devices by extending a cutting blade through the open area. A semiconductor device is then electrically and physically coupled to a ball grid array substrate to form a ball grid array device having reduced layer separation and cracking.

Abstract: A method for forming a packaged semiconductor device and a packaged semiconductor device. A first semiconductor die is coupled to a package substrate. Wire bonds are then coupled to the first semiconductor die and to the package substrate. Encapsulant is applied such that the encapsulant extends over the first semiconductor die and over the wire bonds. The encapsulant is then at least partially cured. A second semiconductor die is coupled to the encapsulant. The second semiconductor die is electrically coupled to the ball grid array substrate. Encapsulant is then applied and cured to form a second layer of encapsulant that covers the second semiconductor die.