Patents by Inventor Annette Fälschle

Annette Fälschle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE AND A SEMICONDUCTOR DEVICE MODULE INCLUDING THE SAME
    Publication number: 20230282591
    Abstract: A semiconductor package includes: a die carrier having a first main face and a second main face opposite to the first main face; a semiconductor die disposed on the die carrier, the semiconductor die including a first pad and a second pad; a first electrical connector disposed on the first pad; an encapsulant at least partially covering the semiconductor die, the die carrier, and the first electrical connector; and an insulation layer disposed on the second main face of the die carrier.
    Type: Application
    Filed: February 27, 2023
    Publication date: September 7, 2023
    Inventors: Edward Fürgut, Ivan Nikitin, Annette Fälschle, Wolfgang Scholz, Bernd Schmoelzer