Abstract: The invention relates to a method and a device for regenerating exhausted tin-plating solutions which contain tin and copper ions, free complexing agent and complexing agent bound to the copper ions, as well as expended and unexpended reducing agent. By means of a suitable rinsing technique, the rinse water of the tin-plating process is concentrated to a 10 to 15 percent dilution of the process solution. The regenerating solution thus produced is fed to an electrolytic cell. The electrolytic cell comprises a cathode chamber, a middle chamber and an anode chamber. The cathode chamber is separated from the middle chamber by an anion-exchange membrane and the anode chamber is separated from the middle chamber by a cation-exchange membrane. The regenerating solution is initially provided in the cathode chamber. Here, the interfering copper component is cathodically deposited.