Patents by Inventor Annie Gui Hong Liao

Annie Gui Hong Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Curable compositions
    Patent number: 9102826
    Abstract: Embodiments include a curable composition comprising an epoxy resin, a non-halogen flame retardant agent comprising at least two of an aryl-cyanato group and at least two of a phosphorus group, and a styrene and maleic anhydride copolymer. Embodiments include method of preparing the curable composition, prepregs that include a reinforcement component and the curable composition, and an electrical laminate formed with the curable composition.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: August 11, 2015
    Assignee: Blue Cube IP LLC
    Inventors: Hongyu Chen, Annie Gui Hong Liao
  • CURABLE COMPOSITIONS
    Publication number: 20140128545
    Abstract: Embodiments include curable compositions including an epoxy resin and a hardener component including a terpolymer having first constitutional unit, a second constitutional unit, and a third constitutional unit, where the epoxy group to the second constitutional unit has a molar ratio in a range of 1.0:1.0 to 2.7:1.0. Embodiments include prepregs that include a reinforcement component and the curable composition and an electrical laminate formed with the curable composition.
    Type: Application
    Filed: June 30, 2011
    Publication date: May 8, 2014
    Applicant: DOW Global Technologies LLC
    Inventors: Jia Wen Xiong, Hongyu Chen, Michael Mullins, Chao Zhang, Annie Gui Hong Liao, Wayne Yi Zhang
  • CURABLE COMPOSITIONS
    Publication number: 20140128509
    Abstract: Embodiments include a curable composition comprising an epoxy resin, a non-halogen flame retardant agent comprising at least two of an aryl-cyanato group and at least two of a phosphorus group, and a styrene and maleic anhydride copolymer. Embodiments include method of preparing the curable composition, prepregs that include a reinforcement component and the curable composition, and an electrical laminate formed with the curable composition.
    Type: Application
    Filed: June 30, 2011
    Publication date: May 8, 2014
    Applicant: DOW Global Technologies LLC
    Inventors: Hongyu Chen, Annie Gui Hong Liao