Abstract: A method of fabricating an integrated circuit includes identifying an edge device of a plurality of devices, the plurality of devices being part of a first layout including gate structures and diffusion regions, modifying the first layout resulting in a second layout, and fabricating the integrated circuit based on the second layout. Modifying the first layout resulting in the second layout includes adding a dummy device next to the edge device, the dummy device and the edge device having a shared diffusion region, adding a dummy gate structure next to the dummy device, extending the shared diffusion region to at least the dummy device, and performing a design rule check on the second layout. The performing the design rule check considers a gate structure of the dummy device as one of two dummy gate structures next to the edge device.

Abstract: A method of fabricating an integrated circuit includes identifying an edge device of a plurality of devices, the plurality of devices being part of a first layout including gate structures and diffusion regions, modifying the first layout resulting in a second layout, and fabricating the integrated circuit based on the second layout. Modifying the first layout resulting in the second layout includes adding a dummy device next to the edge device, the dummy device and the edge device having a shared diffusion region, adding a dummy gate structure next to the dummy device, extending the shared diffusion region to at least the dummy device, and performing a design rule check on the second layout. The performing the design rule check considers a gate structure of the dummy device as one of two dummy gate structures next to the edge device.

Abstract: A method includes designing a first layout of gate structures and diffusion regions of a plurality of active devices, identifying an edge device of the plurality of active devices, modifying the first layout resulting in a second layout, performing a design rule check on the second layout, and fabricating, based on the second layout, at least one of a photolithography mask or at least one component in a layer of a semiconductor device. Modifying the first layout includes adding a dummy device next to the edge device, adding a dummy gate structure next to the dummy device and extending a shared diffusion region to at least the dummy device. The dummy device and the edge device have the shared diffusion region. Performing the design rule check considers a gate structure of the dummy device as one of two dummy gate structures next to the edge device.

Abstract: A method includes designing a first layout of gate structures and diffusion regions of a plurality of active devices, identifying an edge device of the plurality of active devices, modifying the first layout resulting in a second layout, performing a design rule check on the second layout, and fabricating, based on the second layout, at least one of a photolithography mask or at least one component in a layer of a semiconductor device. Modifying the first layout includes adding a dummy device next to the edge device, adding a dummy gate structure next to the dummy device and extending a shared diffusion region to at least the dummy device. The dummy device and the edge device have the shared diffusion region. Performing the design rule check considers a gate structure of the dummy device as one of two dummy gate structures next to the edge device.

Abstract: A method includes designing a layout of gate structures and diffusion regions of a plurality of devices, identifying an edge device of the plurality of devices, adding a dummy device next to the edge device and a dummy gate structure next to the dummy device resulting in a modified layout, and fabricating, based on the modified layout, at least one of a photolithography mask or at least one component in a layer of a semiconductor device. The dummy device shares a diffusion region with the edge device. A gate structure of the dummy device is one of two dummy gate structures added next to the edge device.

Abstract: A method includes designing a layout of gate structures and diffusion regions of a plurality of devices, identifying an edge device of the plurality of devices, adding a dummy device next to the edge device and a dummy gate structure next to the dummy device resulting in a modified layout, and fabricating, based on the modified layout, at least one of a photolithography mask or at least one component in a layer of a semiconductor device. The dummy device shares a diffusion region with the edge device. A gate structure of the dummy device is one of two dummy gate structures added next to the edge device.

Abstract: A method of designing a layout of devices includes designing a layout of gate structures and diffusion regions of a plurality of devices. The method further includes identifying an edge device of the plurality of devices. The method further includes adding a dummy device next to the edge device and a dummy gate structure next to the dummy device, wherein the dummy device shares a diffusion region with the edge device, and wherein a gate structure of the dummy device is considered to be one of two dummy gate structures added next to the edge device.

Abstract: A circuit including a memory circuit, the memory circuit includes a first plurality of memory arrays and a first plurality of keepers, each keeper of the first plurality of keepers is electrically coupled with a corresponding one of the first plurality of memory arrays. The memory circuit further includes a first current limiter electrically coupled with and shared by the first plurality of keepers.

Abstract: A method of designing a layout of devices includes designing a layout of gate structures and diffusion regions of a plurality of devices. The method further includes identifying an edge device of the plurality of devices. The method further includes adding a dummy device next to the edge device and a dummy gate structure next to the dummy device, wherein the dummy device shares a diffusion region with the edge device, and wherein a gate structure of the dummy device is considered to be one of two dummy gate structures added next to the edge device.

Abstract: The layouts, device structures, and methods described above utilize dummy devices to extend the diffusion regions of edge structures and/or non-allowed structures to the dummy device. Such extension of diffusion regions resolves or reduces LOD and edge effect issues. In addition, treating the gate structure of a dummy device next to an edge device also allows only one dummy structure to be added next to the dummy device and saves the real estate on the semiconductor chip. The dummy devices are deactivated and their performance is not important. Therefore, utilizing dummy devices to extend the diffusion regions of edge structures and/or non-allowed structures according to design rules allows the resolution or reduction or LOD and edge effect issues without the penalty of yield reduction or increase in layout areas.

Abstract: A memory circuit includes a first plurality of memory arrays disposed in a column fashion. The memory circuit includes a first plurality of keepers each of which is electrically coupled with a corresponding one of the first plurality of memory arrays. A first current limiter is electrically coupled with and shared by the first plurality of keepers. A first plurality of sector switches each are electrically coupled between the first current limiter and a respective one of the first plurality of keepers.

Abstract: A memory circuit includes a first plurality of memory arrays disposed in a column fashion. The memory circuit includes a first plurality of keepers each of which is electrically coupled with a corresponding one of the first plurality of memory arrays. A first current limiter is electrically coupled with and shared by the first plurality of keepers.

Abstract: The layouts, device structures, and methods described above utilize dummy devices to extend the diffusion regions of edge structures and/or non-allowed structures to the dummy device. Such extension of diffusion regions resolves or reduces LOD and edge effect issues. In addition, treating the gate structure of a dummy device next to an edge device also allows only one dummy structure to be added next to the dummy device and saves the real estate on the semiconductor chip. The dummy devices are deactivated and their performance is not important. Therefore, utilizing dummy devices to extend the diffusion regions of edge structures and/or non-allowed structures according to design rules allows the resolution or reduction or LOD and edge effect issues without the penalty of yield reduction or increase in layout areas.

Abstract: A memory circuit includes a first plurality of memory arrays disposed in a column fashion. The memory circuit includes a first plurality of keepers each of which is electrically coupled with a corresponding one of the first plurality of memory arrays. A first current limiter is electrically coupled with and shared by the first plurality of keepers.

Abstract: A memory circuit includes a first plurality of memory arrays disposed in a column fashion. The memory circuit includes a first plurality of keepers each of which is electrically coupled with a corresponding one of the first plurality of memory arrays. A first current limiter is electrically coupled with and shared by the first plurality of keepers. A first plurality of sector switches each are electrically coupled between the first current limiter and a respective one of the first plurality of keepers.

Abstract: A read module for register files includes at least one local I/O module coupled to a memory cell for outputting a value stored in the memory cell; and at least one global bit line driver having an input terminal coupled to the local I/O module, and a output terminal coupled to a global bit line for selectively pre-charging the global bit line at a default voltage in response to a local pre-charge signal, and outputting the value stored in the memory cell to the global bit line when the local pre-charge signal is not asserted.

Abstract: A read module for register files includes at least one local I/O module coupled to a memory cell for outputting a value stored in the memory cell; and at least one global bit line driver having an input terminal coupled to the local I/O module, and a output terminal coupled to a global bit line for selectively pre-charging the global bit line at a default voltage in response to a local pre-charge signal, and outputting the value stored in the memory cell to the global bit line when the local pre-charge signal is not asserted.