Abstract: The invention relates to storage-stable hot-melt adhesive containing 15 to 70 wt % of a mixture of at least one copolymer based on ethylene and/or propylene and at least one C4 to C20 ?-olefin which is obtainable as a block copolymer by metallocene-catalyzed polymerization, and at least one styrene block copolymer, 10 to 70 wt % of at least one tackifying resin, 0 to 40 wt % of further additives, wherein the total of the percentages should amount to 100% and the tackifying resin is entirely or in part a soft resin.

Abstract: The invention relates to storage-stable hot-melt adhesive containing 15 to 70 wt % of a mixture of at least one copolymer based on ethylene and/or propylene and at least one C4 to C20 ?-olefin which is obtainable as a block copolymer by metallocene-catalysed polymerisation, and at least one styrene block copolymer, 10 to 70 wt % of at least one tackifying resin, 0 to 40 wt % of further additives, wherein the total of the percentages should amount to 100% and the tackifying resin is entirely or in part a soft resin.

Abstract: The invention relates to a hot melt pressure sensitive adhesive. The hot melt pressure sensitive adhesive is particularly well suited for flexible substrates such as plastic and paperboard packaging.

Abstract: The invention relates to a method for gluing labels on hydrophobic substrates, wherein a radiation cross-linking, pressure-sensitive adhesive is applied on the label or on the substrate on a surface opposite to the label and irradiated with UV or electron radiation, and label and substrate are then brought together and glued to one another. The pressure-sensitive adhesive is soluble in aqueous solutions. The label is selected from i) water permeable labels with a water uptake (Cobb value) greater than 0.2 g/m2 per 20 sec, and ii) perforated labels which have perforations or cut-outs of less than 10% on the glued surfaces. Furthermore, the invention describes a label, coated with a water-soluble, radiation curable, pressure sensitive adhesive, which has a high water uptake and/or optionally perforations or cut-outs on the glued surface.

Abstract: The invention relates to a hot melt pressure sensitive adhesive. The hot melt pressure sensitive adhesive is particularly well suited for flexible substrates such as plastic and paperboard packaging.

Abstract: Method of bonding labels to hydrophobic substrates, a pressure-sensitive hotmelt adhesive being applied wholly or partly to the label or to the substrate at an area opposite the label, then bringing label and substrate together and bonding them, characterized in that the pressure-sensitive hotmelt adhesive is water-soluble in alkaline solution and the label is selected from i) water-permeable labels having a water absorbency (Cobb value) of greater than 0.3 g/m2 per 20 sec, ii) perforated labels which on the bonded surfaces have a perforation or cutouts of below 10%. Further described is a label which is coated with a water-soluble pressure-sensitive hotmelt adhesive and which exhibits a high water absorbency and/or, where appropriate, contains perforations or cutouts on the bonded surface.