Abstract: A component carrier and a method for manufacturing the same are disclosed. The component carrier includes an electrically conductive layer structure and an overhanging end. A first surface finish is formed on a first surface portion of the electrically conductive layer structure. Furthermore, the component carrier further includes a second surface finish on a second surface portion of the electrically conductive layer structure connected to the first surface finish and extending under the overhanging end.

Abstract: A component carrier includes a core having a recess, an electronic component arranged in the recess, a laminated electrically insulating sheet covering at least part of the core and of the electronic component and filling a gap between a lateral surface of the electronic component and a lateral surface of the core in the recess, and a further electrically insulating layer structure laminated on top of the sheet.

Abstract: A semifinished product with a sacrificial structure and two component carriers releasably formed on opposing main surfaces of the sacrificial structure. The component carriers include at least one electrically insulating layer structure, and at least one electrically conductive layer structure. The at least one electrically insulating layer structure relates to a respective one of the component carriers. Located closest to the sacrificial structure are pure or unprocessed electrically insulating layers without electrically conductive material therein.

Abstract: A component carrier has a base structure with a recess, a thermally highly conductive coating covering at least a part of a surface of the base structure, and a component in the recess.

Abstract: A semifinished product with a sacrificial structure and two component carriers releasably formed on opposing main surfaces of the sacrificial structure. The sacrificial structure includes a central structure and releasing layers on or over both opposing main surfaces of the central structure The central structure includes a dummy core being covered, in particular fully, on or over both main surfaces thereof with a respective one of two spatially separated sections of separate material, in particular separate dielectric material.

Abstract: A component carrier includes a core having a recess, at least one electronic component arranged in the recess, wherein a vertical thickness of the at least one electronic component is larger than a vertical thickness of the core, and an electrically insulating sheet covering at least part of a top main surface of the core, covering at least part of the at least one electronic component and filling a gap between a lateral surface of the at least one electronic component and a lateral surface of the core in the recess.

Abstract: A plater arrangement for filling a hole formed in a component carrier with copper is disclosed. The plater arrangement includes an electroless plater section for forming a layer of an electrically conductive material, which layer covers at least part of a surface of a wall of a component carrier and where the wall delimits the hole in the component carrier and an electro-plater section for covering at least partially the layer and filling at least partially an unfilled volume of the hole with copper by an electro-plating process, wherein at least partially covering the layer and at least partially filling the hole is done by flash-plating. The electro-plater section having a bath for plating with copper.

Abstract: A method of filling a hole formed in a component carrier with copper is disclosed. The method comprises i) forming a layer of an electrically conductive material covering at least part of a surface of a wall, wherein the wall delimits the hole, and subsequently ii) covering at least partially the layer and filling at least partially an unfilled volume of the hole with copper using a plating process including a bath. Hereby, the bath comprises a concentration of a copper ion, in particular Cu2+, in a range between 50 g/L and 75 g/L, in particular in a range between 60 g/L and 70 g/L.

Abstract: A component carrier includes a core having a recess, an electronic component arranged in the recess, a laminated electrically insulating sheet covering at least part of the core and of the electronic component and filling a gap between a lateral surface of the electronic component and a lateral surface of the core in the recess, and a further electrically insulating layer structure laminated on top of the sheet.

Abstract: A component carrier and a method for manufacturing the same are disclosed. The component carrier includes an electrically conductive layer structure and an overhanging end. A first surface finish is formed on a first surface portion of the electrically conductive layer structure. Furthermore, the component carrier further includes a second surface finish on a second surface portion of the electrically conductive layer structure connected to the first surface finish and extending under the overhanging end.

Abstract: A component carrier includes a core having a recess, at least one electronic component arranged in the recess, wherein a vertical thickness of the at least one electronic component is larger than a vertical thickness of the core, and an electrically insulating sheet covering at least part of a top main surface of the core, covering at least part of the at least one electronic component and filling a gap between a lateral surface of the at least one electronic component and a lateral surface of the core in the recess.

Abstract: A method of filling a hole formed in a component carrier with copper is disclosed. The method comprises i) forming a layer of an electrically conductive material covering at least part of a surface of a wall, wherein the wall delimits the hole, and subsequently ii) covering at least partially the layer and filling at least partially an unfilled volume of the hole with copper using a plating process including a bath. Hereby, the bath comprises a concentration of a copper ion, in particular Cu2+, in a range between 50 g/L and 75 g/L, in particular in a range between 60 g/L and 70 g/L.

Abstract: A semifinished product with a sacrificial structure and two component carriers releasably formed on opposing main surfaces of the sacrificial structure. The sacrificial structure includes a central structure and releasing layers on or over both opposing main surfaces of the central structure The central structure includes a dummy core being covered, in particular fully, on or over both main surfaces thereof with a respective one of two spatially separated sections of separate material, in particular separate dielectric material.

Abstract: A semifinished product with a sacrificial structure and two component carriers releasably formed on opposing main surfaces of the sacrificial structure. The component carriers include at least one electrically insulating layer structure, and at least one electrically conductive layer structure. The at least one electrically insulating layer structure relates to a respective one of the component carriers. Located closest to the sacrificial structure are pure or unprocessed electrically insulating layers without electrically conductive material therein.

Abstract: A component carrier has a base structure with a recess, a thermally highly conductive coating covering at least a part of a surface of the base structure, and a component in the recess.