Patents by Inventor Anoop Anand

Anoop Anand has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153300
    Abstract: Disclosed aspects include computer-implemented method for preventing Carpal Tunnel Syndrome (CTS), a computer program product, and a laptop computer. One embodiment of the method may comprise collecting, by a device having an associated keyboard, data of a user's interaction with the keyboard. The method may further comprise analyzing, by a first machine learning model, the audiovisual data to identify ergonomic issues in the user's interaction with the keyboard. The method may further comprise notifying the user of the identified ergonomic issues in real time.
    Type: Application
    Filed: November 9, 2022
    Publication date: May 9, 2024
    Inventors: Manish Anand Bhide, Anoop T Puthiyaveetil, Pinky Chaudhary, Madan K Chukka, Phani Kumar V. U. Ayyagari, Ravi Shankar Singh
  • Patent number: 9670328
    Abstract: In the present disclosure!, there is disclosed an epoxy resin formulation for the manufacturing of large and thick composite structures, said formulation comprising i) at least one epoxy resin in a weight proportion varying between 50 parts to 70 parts; (ii) at least one hardening agent in a weight proportion varying between 21 phr to 29 phr; (iii) at least one diluent in a weight proportion varying between 10 phr to 40 phr; and (iv) N,N?dimethylaminopropylamine as an accelerator in a weight proportion varying between 0.5 phr to 3.0 phr. The formulation is used in the manufacturing of large and thick composite structures by employing Vacuum Assisted Resin Transfer Molding Process.
    Type: Grant
    Filed: March 26, 2013
    Date of Patent: June 6, 2017
    Assignee: DIRECTOR GENERAL, DEFENCE RESEARCH & DEVELOPMENT ORGANIZATION [DRDO]
    Inventors: Rahul Harshe, Ranjith Kottot, Anoop Anand, Makarand Joshi
  • Publication number: 20150274902
    Abstract: In the present disclosure!, there is disclosed an epoxy resin formulation for the manufacturing of large and thick composite structures, said formulation comprising i) at least one epoxy resin in a weight proportion varying between 50 parts to 70 parts; (ii) at least one hardening agent in a weight proportion varying between 21 phr to 29 phr; (iii) at least one diluent in a weight proportion varying between 10 phr to 40 phr; and (iv) N,N?dimethylaminopropylamine as an accelerator in a weight proportion varying between 0.5 phr to 3.0 phr. The formulation is used in the manufacturing of large and thick composite structures by employing Vacuum Assisted Resin Transfer Molding Process.
    Type: Application
    Filed: March 26, 2013
    Publication date: October 1, 2015
    Applicant: DIRECTOR GENERAL, DEFENCE RESEARCH & DEVELOPMENT ORGANIZATION [DRDO]
    Inventors: Rahul Harshe, Ranjith Kottot, Anoop Anand, Makarand Joshi