Patents by Inventor Anoop Haridasan

Anoop Haridasan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vent through a printhead support structure
    Patent number: 9475297
    Abstract: In one example, a structure for supporting a printhead includes: a substrate having a first side and a second side; an inlet tower through which liquid may be introduced into the structure; an opening through the substrate near the inlet tower; and an air channel along the substrate connecting the opening in the substrate to the atmosphere.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: October 25, 2016
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Iain Campbell-Brown, Eugene Cahill, William S Osborne, Anoop Haridasan, Ivor Cummins
  • VENT THROUGH A PRINTHEAD SUPPORT STRUCTUR
    Publication number: 20160089890
    Abstract: In one example, a structure for supporting a printhead includes: a substrate having a first side and a second side; an inlet tower through which liquid may be introduced into the structure; an opening through the substrate near the inlet tower; and an air channel along the substrate connecting the opening in the substrate to the atmosphere.
    Type: Application
    Filed: December 8, 2015
    Publication date: March 31, 2016
    Inventors: Iain CAMPBELL-BROWN, Eugene CAHILL, William S. OSBORNE, Anoop HARIDASAN, Ivor CUMMINS
  • Vent through a printhead support structure
    Patent number: 9254672
    Abstract: In one example, a structure for supporting a printhead includes: a substrate having a first side and a second side; an inlet tower through which liquid may be introduced into the structure; an opening through the substrate near the inlet tower; and an air channel along the substrate connecting the opening in the substrate to the atmosphere.
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: February 9, 2016
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Iain Campbell-Brown, Eugene Cahill, William S Osborne, Anoop Haridasan, Ivor Cummins
  • VENT THROUGH A PRINTHEAD SUPPORT STRUCTURE
    Publication number: 20150042730
    Abstract: In one example, a structure for supporting a printhead includes: a substrate having a first side and a second side: an inlet tower through which liquid may be introduced into the structure; an opening through the substrate near the inlet tower; and an air channel along the substrate connecting the opening in the substrate to the atmosphere.
    Type: Application
    Filed: March 19, 2012
    Publication date: February 12, 2015
    Inventors: Iain Campbell-Brown, Eugene Cahill, William S. Osborne, Anoop Haridasan, Ivor Cummins
  • Vent path for a liquid container
    Patent number: 8684505
    Abstract: In one example, a structure for supporting a printhead includes: a substrate having a first side and a second side; multiple inlets each protruding from the first side of the substrate through which liquids may be introduced into the structure from the outlets of liquid containers that can be attached to the structure; multiple openings through the substrate from the first side to the second side, each opening positioned near one of the inlets at a location exposed to the outlet of a corresponding one of the containers when the container is attached to the structure; and an air channel on the second side of the substrate connecting each of one or more of the openings to another opening.
    Type: Grant
    Filed: September 25, 2012
    Date of Patent: April 1, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Iain Campbell-Brown, William Scott Osborne, Eugene Cahill, Ivor Cummins, Anoop Haridasan
  • VENT PATH FOR A LIQUID CONTAINER
    Publication number: 20130242011
    Abstract: In one example, a structure for supporting a printhead includes: a substrate having a first side and a second side; multiple inlets each protruding from the first side of the substrate through which liquids may be introduced into the structure from the outlets of liquid containers that can be attached to the structure; multiple openings through the substrate from the first side to the second side, each opening positioned near one of the inlets at a location exposed to the outlet of a corresponding one of the containers when the container is attached to the structure; and an air channel on the second side of the substrate connecting each of one or more of the openings to another opening.
    Type: Application
    Filed: September 25, 2012
    Publication date: September 19, 2013
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Iain Campbell-Brown, William Scott Osborne, Eugene Cahill, Ivor Cummins, Anoop Haridasan