Patents by Inventor Anoop Mathew
Anoop Mathew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11145689Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED chips and related methods are disclosed. LED chips are provided that include an indicia arranged between a primary light-emitting face and a mounting face of the LED chip. The indicia may include at least one of a logo, one or more alphanumeric characters, or a symbol, among others that are configured to convey information. Arrangements of at least one of an n-contact, a p-contact, or a reflector layer of the LED chip may form the indicia. LED chips are also provided where at least a portion of an indicia is arranged on a mounting face of the LED chip. Indicia are provided that may be visible through primary light-emitting faces when LED chips are electrically activated or electrically deactivated. In this regard, the indicia may be embedded within LED chips while still being able to convey information.Type: GrantFiled: November 29, 2018Date of Patent: October 12, 2021Assignee: CreeLED, Inc.Inventors: Nikolas Hall, Derek Miller, Anoop Mathew, Colin Blakely, Luis Breva, Jesse Reiherzer, David Todd Emerson
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Publication number: 20200176507Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED chips and related methods are disclosed. LED chips are provided that include an indicia arranged between a primary light-emitting face and a mounting face of the LED chip. The indicia may include at least one of a logo, one or more alphanumeric characters, or a symbol, among others that are configured to convey information. Arrangements of at least one of an n-contact, a p-contact, or a reflector layer of the LED chip may form the indicia. LED chips are also provided where at least a portion of an indicia is arranged on a mounting face of the LED chip. Indicia are provided that may be visible through primary light-emitting faces when LED chips are electrically activated or electrically deactivated. In this regard, the indicia may be embedded within LED chips while still being able to convey information.Type: ApplicationFiled: November 29, 2018Publication date: June 4, 2020Inventors: Nikolas Hall, Derek Miller, Anoop Mathew, Colin Blakely, Luis Breva, Jesse Reiherzer, David Todd Emerson
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Patent number: 10283681Abstract: A phosphor-converted light emitting device includes a light emitting diode (LED) on a substrate, where the LED comprises a stack of epitaxial layers comprising a p-n junction. A wavelength conversion material is in optical communication with the LED. According to one embodiment of the phosphor-converted light emitting device, a selective filter is adjacent to the wavelength conversion material, and the selective filter comprises a plurality of nanoparticles for absorbing light from the LED not down-converted by the wavelength conversion material. According to another embodiment of the phosphor-converted light emitting device, a perpendicular distance between a perimeter of the LED on the substrate and an edge of the substrate is at least about 24 microns. According to another embodiment of the phosphor-converted light emitting device, the LED comprises a mirror layer on one or more sidewalls thereof for reducing light leakage through the sidewalls.Type: GrantFiled: May 14, 2014Date of Patent: May 7, 2019Assignee: Cree, Inc.Inventors: Brian T. Collins, Matthew Donofrio, Kevin W. Haberern, Bennett Langsdorf, Anoop Mathew, Harry A. Seibel, Iliya Todorov, Bradley E. Williams
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Patent number: 9796063Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.Type: GrantFiled: June 30, 2014Date of Patent: October 24, 2017Assignee: FNS TECH CO., LTD.Inventors: Paul Lefevre, Anoop Mathew, Guangwei Wu, Scott Xin Qiao, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin
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Patent number: 9162341Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.Type: GrantFiled: May 6, 2013Date of Patent: October 20, 2015Assignee: FNS TECH CO., LTDInventors: Paul LeFevre, Anoop Mathew, Scott Xin Qiao, Guangwei Wu, David Adam Wells, Oscar K. Hsu
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Publication number: 20150069430Abstract: A phosphor-converted light emitting device includes a light emitting diode (LED) on a substrate, where the LED comprises a stack of epitaxial layers comprising a p-n junction. A wavelength conversion material is in optical communication with the LED. According to one embodiment of the phosphor-converted light emitting device, a selective filter is adjacent to the wavelength conversion material, and the selective filter comprises a plurality of nanoparticles for absorbing light from the LED not down-converted by the wavelength conversion material. According to another embodiment of the phosphor-converted light emitting device, a perpendicular distance between a perimeter of the LED on the substrate and an edge of the substrate is at least about 24 microns. According to another embodiment of the phosphor-converted light emitting device, the LED comprises a mirror layer on one or more sidewalls thereof for reducing light leakage through the sidewalls.Type: ApplicationFiled: May 14, 2014Publication date: March 12, 2015Inventors: Brian T. Collins, Matthew Donofrio, Kevin W. Haberern, Bennett Langsdorf, Anoop Mathew, Harry A. Seibel, Iliya Todorov, Bradley E. Williams
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Publication number: 20140311043Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.Type: ApplicationFiled: June 30, 2014Publication date: October 23, 2014Inventors: Paul LEFEVRE, Anoop MATHEW, Guangwei WU, Scott Xin QIAO, Oscar K. HSU, David Adam WELLS, John Erik ALDEBORGH, Marc C. JIN
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Patent number: 8790165Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.Type: GrantFiled: January 5, 2010Date of Patent: July 29, 2014Assignee: FNS Tech Co., Ltd.Inventors: Paul Lefevre, Anoop Mathew, Guangwei Wu, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin, Xuechan Zhao
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Patent number: 8758659Abstract: A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width, and shrinking the lands from a first land length (L1) at the surface to a second land length (L2) at the surface, wherein the second land length (L2) is less than the first land length (L1) and the grooves have a second width (W2) wherein (W1)?(X)(W2), wherein (X) has a value in the range of 0.01 to 0.75.Type: GrantFiled: September 29, 2010Date of Patent: June 24, 2014Assignee: FNS Tech Co., Ltd.Inventors: Paul Lefevre, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin, Guangwei Wu, Anoop Mathew
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Patent number: 8684794Abstract: A polishing pad and a method of producing a polishing pad. The method includes providing a mold, having a first cavity and a second cavity, wherein the first cavity defines a recess, providing a polymer matrix material including void forming elements in the recess, forming a polishing pad and removing at least a portion of the elements from the polishing pad forming void spaces within the polishing pad by one of a chemical method or mechanical method, prior to use in chemical/mechanical planarization procedures.Type: GrantFiled: August 4, 2008Date of Patent: April 1, 2014Assignee: FNS Tech Co., Ltd.Inventors: Paul Lefevre, Oscar K. Hsu, David Adam Wells, Scott Xin Qiao, Anoop Mathew, Guangwei Wu
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Publication number: 20130244548Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.Type: ApplicationFiled: May 6, 2013Publication date: September 19, 2013Inventors: Paul LEFEVRE, Anoop MATHEW, Scott Xin QIAO, Guangwei WU, David Adam WELLS, Oscar K. HSU
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Patent number: 8435099Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.Type: GrantFiled: January 27, 2010Date of Patent: May 7, 2013Assignee: Innopad, Inc.Inventors: Paul Lefevre, Anoop Mathew, Guangwei Wu, David Adam Wells, Oscar K. Hsu, Xuechan Zhao
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Patent number: 8377351Abstract: A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.Type: GrantFiled: October 2, 2008Date of Patent: February 19, 2013Assignee: Innopad, Inc.Inventors: Paul Lefevre, David Adam Wells, Marc C. Jin, Oscar K. Hsu, John Erik Aldeborgh, Scott Xin Qiao, Anoop Mathew, Guangwei Wu
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Publication number: 20120073210Abstract: A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width, and shrinking the lands from a first land length (L1) at the surface to a second land length (L2) at the surface, wherein the second land length (L2) is less than the first land length (L1) and the grooves have a second width (W2) wherein (W1)?(X)(W2), wherein (X) has a value in the range of 0.01 to 0.75.Type: ApplicationFiled: September 29, 2010Publication date: March 29, 2012Applicant: INNOPAD, INC.Inventors: Paul LEFEVRE, Oscar K. HSU, David Adam WELLS, John Erik ALDEBORGH, Marc C. JIN, Guangwei WU, Anoop MATHEW
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Publication number: 20100221985Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.Type: ApplicationFiled: January 27, 2010Publication date: September 2, 2010Applicant: INNOPAD, INC.Inventors: Paul LEFEVRE, Anoop MATHEW, Scott Xin QIAO, Xuechan Zhao, Guangwei WU, David Adam WELLS, Oscar K. HSU
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Publication number: 20100221983Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.Type: ApplicationFiled: January 5, 2010Publication date: September 2, 2010Applicant: INNOPAD, INC.Inventors: Paul LEFEVRE, Anoop MATHEW, Guangwei WU, Scott Xin QIAO, Oscar K. HSU, David Adam WELLS, John Erik ALDEBORGH, Marc C. JIN, Xuechan Zhao
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Publication number: 20090246504Abstract: A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.Type: ApplicationFiled: October 2, 2008Publication date: October 1, 2009Applicant: INNOPAD, INC.Inventors: Paul LEFEVRE, David Adam WELLS, Marc C. JIN, Oscar K. HSU, John Erik ALDEBORGH, Scott Xin Qiao, Anoop Mathew, Guangwei Wu