Patents by Inventor Anpeng BAI

Anpeng BAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180065150
    Abstract: The present disclosure discloses an ultrasonic transducer. The ultrasonic transducer includes an active layer. The active layer includes an array of piezoelectric pillars configured for emitting and receiving ultrasound and an attenuation portion surrounding sidewalls of the piezoelectric pillars and configured for attenuating a part of the ultrasound emitted from the sidewalls of the piezoelectric pillars. The present disclosure also relates to an ultrasonic fingerprint recognition sensor and an electronic device having the ultrasonic transducer.
    Type: Application
    Filed: April 19, 2017
    Publication date: March 8, 2018
    Inventors: Anpeng BAI, Wensi SUN
  • Publication number: 20180068153
    Abstract: The present disclosure discloses an ultrasonic fingerprint sensor. The ultrasonic fingerprint sensor includes a piezoelectric layer, a number of emitters, and a number of receiving electrode lines. The piezoelectric layer includes an array of piezoelectric posts. The emitters are formed on a lower end of the piezoelectric layer and correspond to the piezoelectric posts. Each of the emitters is connected to a corresponding piezoelectric post. The receiving electrode lines are arranged on an upper end of the piezoelectric layer, and each of the receiving electrode lines corresponds to a row of the piezoelectric posts and connected to the row of the piezoelectric posts. The present disclosure also discloses a fingerprint recognition module.
    Type: Application
    Filed: April 18, 2017
    Publication date: March 8, 2018
    Inventor: Anpeng BAI